Inventor · disambiguated record
Lei Fu
Also filed as: FU LEI
35 granted patents·25 pending applications·207 citations·filing 2003–2024
96Inventor score
Files withADVANCED MICRO DEVICES INC13ARAMCO SERVICES CO5GLOBALFOUNDRIES INC3SU MICHAEL Z3BHAGAVAT MILIND S2
Top patents by PatentIndex Score
60 records- 0197US10510721B2Molded chip combinationBHAGAVAT MILIND S·Filed 2017·Granted Dec 17, 2019·32 cites·20 claims
- 0294US8691626B2Semiconductor chip device with underfillSU MICHAEL Z·Filed 2010·Granted Apr 8, 2014·24 cites·21 claims
- 0393US11828902B1Multi-scale three-dimensional (3D) engineering geological model construction system and methodINST OF GEOLOGY AND GEOPHYSICS CAS·Filed 2023·Granted Nov 28, 2023·7 cites·6 claims
- 0490US11676940B2Hybrid bonded interconnect bridgingADVANCED MICRO DEVICES INC·Filed 2020·Granted Jun 13, 2023·2 cites·24 claims
- 0589US12249519B2Molded chip package with anchor structuresADVANCED MICRO DEVICES INC·Filed 2022·Granted Mar 11, 2025·1 cites·19 claims
- 0689US8723314B2Semiconductor workpiece with backside metallization and methods of dicing the sameSU MICHAEL·Filed 2012·Granted May 13, 2014·11 cites·23 claims
- 0786US11382255B1Method and system for storing emission rights for point and nonpoint source pollution based on internet of thingsZHEJIANG PROVINCE ECO ENV LOW CARBON DEVELOPMENT CENTER·Filed 2021·Granted Jul 12, 2022·24 cites·4 claims
- 0886US7223438B2Patterning magnetic nanostructuresUNIV NORTHWESTERN·Filed 2003·Granted May 29, 2007·27 cites·75 claims
- 0984US8624404B1Integrated circuit package having offset viasSU MICHAEL Z·Filed 2012·Granted Jan 7, 2014·7 cites·25 claims
- 1083US10943880B2Semiconductor chip with reduced pitch conductive pillarsADVANCED MICRO DEVICES INC·Filed 2019·Granted Mar 9, 2021·3 cites·19 claims
- 1182US7737563B2Semiconductor chip with reinforcement structureGLOBALFOUNDRIES INC·Filed 2008·Granted Jun 15, 2010·11 cites·27 claims
- 1280US2025022847A1Hybrid bonded interconnect bridgingADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1379US12107075B2Hybrid bonded interconnect bridgingADVANCED MICRO DEVICES INC·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 1479US10672712B2Multi-RDL structure packages and methods of fabricating the sameBHAGAVAT MILIND S·Filed 2018·Granted Jun 2, 2020·2 cites·21 claims
- 1579US8231854B2Method for treating carbon nanotubes, carbon nanotubes and carbon nanotubes device comprising thereofKAJIURA HISASHI·Filed 2008·Granted Jul 31, 2012·6 cites·14 claims
- 1678US11367628B2Molded chip package with anchor structuresADVANCED MICRO DEVICES INC·Filed 2019·Granted Jun 21, 2022·2 cites·17 claims
- 1778US7679200B2Semiconductor chip with crack stopGLOBALFOUNDRIES INC·Filed 2007·Granted Mar 16, 2010·8 cites·20 claims
- 1875US8709372B2Carbon nanotube fiber spun from wetted ribbonZHU YUNTIAN T·Filed 2008·Granted Apr 29, 2014·3 cites·22 claims
- 1972US8293636B2Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication methodSCHULZE THOMAS·Filed 2010·Granted Oct 23, 2012·5 cites·4 claims
- 2070US11742301B2Fan-out package with reinforcing rivetsADVANCED MICRO DEVICES INC·Filed 2019·Granted Aug 29, 2023·1 cites·20 claims
- 2170US7391720B1Local span mesh restoration (LSMR)CIENA CORP·Filed 2004·Granted Jun 24, 2008·17 cites·35 claims
- 2266US12089141B2Method for quickly searching for high-RAT network, and terminal deviceHUAWEI TECH CO LTD·Filed 2019·Granted Sep 10, 2024·1 cites·20 claims
- 2366US11898901B2Method and system for mapping fiber optic distributed acoustic sensing measurements to particle motionARAMCO SERVICES CO·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2466US7977160B2Semiconductor devices having stress relief layers and methods for fabricating the sameGLOBALFOUNDRIES INC·Filed 2009·Granted Jul 12, 2011·4 cites·19 claims
- 2566US2015040532A1Carbon Nanotube Fiber Spun From Wetted RibbonLOS ALAMOS NAT SECURITY LLC·Filed 2014·Application pending·0 cites
- 2665US11676924B2Semiconductor chip with reduced pitch conductive pillarsADVANCED MICRO DEVICES INC·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 2765US10142264B2Techniques for integration of blade switches with programmable fabricCISCO TECH INC·Filed 2016·Granted Nov 27, 2018·1 cites·20 claims
- 2865US9449907B2Stacked semiconductor chips packagingADVANCED MICRO DEVICES INC·Filed 2015·Granted Sep 20, 2016·1 cites·11 claims
- 2964US10903168B2Multi-RDL structure packages and methods of fabricating the sameADVANCED MICRO DEVICES INC·Filed 2020·Granted Jan 26, 2021·0 cites·20 claims
- 3061US2025083988A1Porous glass atomization core, production method therefor and electronic atomizerSHENZHEN SMOORE TECHNOLOGY LTD·Filed 2024·Application pending·0 cites
- 3160US7023793B2Resiliency of control channels in a communications networkCIENA CORP·Filed 2004·Granted Apr 4, 2006·7 cites·28 claims
- 3258US2025142434A1Data processing method and system, electronic device, bluetooth peripheral, and storage mediumHONOR DEVICE CO LTD·Filed 2023·Application pending·0 cites
- 3358US2025044469A1Method and system for kinematics-driven deep learning framework for seismic velocity estimationARAMCO SERVICES CO·Filed 2023·Application pending·0 cites
- 3457US2023259848A1Method and device for rational allocation of regional multi-source water resources driven by bilateral classified water pricesZHEJIANG INST HYDRAULICS & ESTUARY·Filed 2023·Application pending·0 cites
- 3556US12374645B2Electronic device including dies and an interconnect coupled to the dies and processes of forming the sameADVANCED MICRO DEVICES INC·Filed 2022·Granted Jul 29, 2025·0 cites·16 claims
- 3656US10995239B2Polishing fluid for improving surfaces formed by fused deposition molding with abs and method of preparing sameUNIV SHAANXI TECHNOLOGY·Filed 2020·Granted May 4, 2021·0 cites·2 claims
- 3755US2025277737A1Interleave-sampled photoacoustic (pa) imagingUNIV CALIFORNIA·Filed 2023·Application pending·0 cites
- 3854US2024412044A1Machine learning for automatic casing anomaly classification from electromagnetic dataSAUDI ARABIAN OIL CO·Filed 2023·Application pending·0 cites
- 3953US11309222B2Semiconductor chip with solder cap probe test padsADVANCED MICRO DEVICES INC·Filed 2019·Granted Apr 19, 2022·0 cites·20 claims
- 4053US2023347575A1Photosensitive polyimide resin for ultraviolet (uv) curing-based 3d printing and preparation method thereofUNIV SHAANXI TECHNOLOGY·Filed 2023·Application pending·0 cites
- 4153US2025116257A1Lightning protection device, lightning protection system, and methodJIANGSU GOLDWIND SCIENCE & TECH CO LTD·Filed 2022·Application pending·0 cites
- 4252US9989481B2Rapid microwave phase detection with a solid state deviceUNIV MANITOBA·Filed 2014·Granted Jun 5, 2018·0 cites·24 claims
- 4352US2025099458A1Use of anti-idiopathic pulmonary fibrosis drug nintedanib in treatment of tuberculosisBEIJING CHEST HOSPITAL CAPITAL MEDICAL UNIV·Filed 2023·Application pending·0 cites
- 4451US2022281902A1Mitochondrial modulation to improve metabolic syndrome during agingUNIV LELAND STANFORD JUNIOR·Filed 2020·Application pending·0 cites
- 4549US12026895B2Monocular vision-based method for measuring displacement and trajectory of planar motionUNIV GUIZHOU·Filed 2021·Granted Jul 2, 2024·0 cites·4 claims
- 4649US8293581B2Semiconductor chip with protective scribe structureSU MICHAEL Z·Filed 2009·Granted Oct 23, 2012·0 cites·27 claims
- 4749US2025369337A1System and method for automatic conversion of interpreted features on borehole images to digital labeling for deep learningSAUDI ARABIAN OIL CO·Filed 2024·Application pending·0 cites
- 4849US2009202422A1Method for treating carbon nanotubes, carbon nanotubes and carbon nanotube deviceSONY CORP·Filed 2008·Application pending·0 cites
- 4949US2025059864A1Methods and systems for machine learning based drilling fluid treatment response predictionARAMCO SERVICES CO·Filed 2023·Application pending·0 cites
- 5046US10798752B2Method and device for executing emergency callHUAWEI TECH CO LTD·Filed 2014·Granted Oct 6, 2020·0 cites·12 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Lei Fu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →