Inventor · disambiguated record
Lei Lian
Also filed as: LIAN LEI
33 granted patents·15 pending applications·281 citations·filing 2002–2025
97Inventor score
Files withAPPLIED MATERIALS INC38DAVIS MATTHEW FENTON3LIAN LEI3DAVIS MATTHEW F2APPLIED MATERIAL INC1
Top patents by PatentIndex Score
48 records- 0195US11114286B2In-situ optical chamber surface and process sensorAPPLIED MATERIALS INC·Filed 2019·Granted Sep 7, 2021·14 cites·20 claims
- 0295US7169625B2Method for automatic determination of semiconductor plasma chamber matching and source of fault by comprehensive plasma monitoringAPPLIED MATERIALS INC·Filed 2003·Granted Jan 30, 2007·90 cites·31 claims
- 0394US12265377B2Autonomous substrate processing systemAPPLIED MATERIALS INC·Filed 2023·Granted Apr 1, 2025·3 cites·17 claims
- 0494US11709477B2Autonomous substrate processing systemAPPLIED MATERIALS INC·Filed 2021·Granted Jul 25, 2023·3 cites·18 claims
- 0594US7652774B2Interferometric endpoint determination in a substrate etching processAPPLIED MATERIALS INC·Filed 2007·Granted Jan 26, 2010·18 cites·18 claims
- 0692US7306696B2Interferometric endpoint determination in a substrate etching processAPPLIED MATERIALS INC·Filed 2002·Granted Dec 11, 2007·33 cites·23 claims
- 0791US9200950B2Pulsed plasma monitoring using optical sensor and a signal analyzer forming a mean waveformLIAN LEI·Filed 2014·Granted Dec 1, 2015·19 cites·20 claims
- 0890US9601396B23D NAND staircase CD control by using interferometric endpoint detectionAPPLIED MATERIALS INC·Filed 2015·Granted Mar 21, 2017·7 cites·14 claims
- 0987US7808651B2Determining endpoint in a substrate processAPPLIED MATERIALS INC·Filed 2010·Granted Oct 5, 2010·6 cites·26 claims
- 1084US8009938B2Advanced process sensing and control using near infrared spectral reflectometryAPPLIED MATERIALS INC·Filed 2008·Granted Aug 30, 2011·9 cites·24 claims
- 1184US7330244B2Method and apparatus for performing limited area spectral analysisAPPLIED MATERIALS INC·Filed 2006·Granted Feb 12, 2008·9 cites·20 claims
- 1284US2025362200A1Endpoint detection system for enhanced spectral data collectionAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1383US11421977B2Eliminating internal reflections in an interferometric endpoint detection systemAPPLIED MATERIALS INC·Filed 2018·Granted Aug 23, 2022·4 cites·9 claims
- 1481US8232212B2Within-sequence metrology based process tuning for adaptive self-aligned double patterningDAVIS MATTHEW F·Filed 2008·Granted Jul 31, 2012·8 cites·16 claims
- 1581US7969581B2Determining endpoint in a substrate processAPPLIED MATERIALS INC·Filed 2010·Granted Jun 28, 2011·3 cites·25 claims
- 1680US12385803B2Endpoint detection system for enhanced spectral data collectionAPPLIED MATERIALS INC·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1780US11719952B2Adjustable achromatic collimator assembly for endpoint detection systemsAPPLIED MATERIALS INC·Filed 2020·Granted Aug 8, 2023·1 cites·20 claims
- 1878US8257546B2Method and system for monitoring an etch processDAVIS MATTHEW FENTON·Filed 2003·Granted Sep 4, 2012·23 cites·37 claims
- 1976US12066639B2Adjustable achromatic collimator assembly for endpoint detection systemsAPPLIED MATERIALS INC·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 2074US7695987B2Method for automatic determination of semiconductor plasma chamber matching and source of fault by comprehensive plasma monitoringAPPLIED MATERILS INC·Filed 2006·Granted Apr 13, 2010·4 cites·15 claims
- 2174US7158221B2Method and apparatus for performing limited area spectral analysisAPPLIED MATERIALS INC·Filed 2003·Granted Jan 2, 2007·14 cites·24 claims
- 2273US11965798B2Endpoint detection system for enhanced spectral data collectionAPPLIED MATERIALS INC·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 2373US11735401B2In-situ optical chamber surface and process sensorAPPLIED MATERIALS INC·Filed 2021·Granted Aug 22, 2023·0 cites·14 claims
- 2472US9240359B23D NAND staircase CD control by using interferometric endpoint detectionAPPLIED MATERIALS INC·Filed 2014·Granted Jan 19, 2016·2 cites·11 claims
- 2571US2024385048A1Etalon thermometry for plasma environmentsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2670US8956886B2Embedded test structure for trimming process controlAPPLIED MATERIALS INC·Filed 2014·Granted Feb 17, 2015·2 cites·20 claims
- 2769US2024379469A1Endpoint detection in low open area and/or high aspect ratio etch applicationsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2868US8130382B2Determining endpoint in a substrate processLIAN LEI·Filed 2011·Granted Mar 6, 2012·1 cites·20 claims
- 2968US7602484B2Method and apparatus for performing limited area spectral analysisAPPLIED MATERIALS INC·Filed 2007·Granted Oct 13, 2009·2 cites·20 claims
- 3067US7815812B2Method for controlling a process for fabricating integrated devicesAPPLIED MATERIALS INC·Filed 2006·Granted Oct 19, 2010·2 cites·19 claims
- 3165US12078547B2Etalon thermometry for plasma environmentsAPPLIED MATERIALS INC·Filed 2021·Granted Sep 3, 2024·0 cites·19 claims
- 3265US12046522B2Endpoint detection in low open area and/or high aspect ratio etch applicationsAPPLIED MATERIALS INC·Filed 2022·Granted Jul 23, 2024·0 cites·14 claims
- 3365US2025157802A1Etch feedback for control of upstream processAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 3462US2025208597A1Endpoint detection by generating synthetic sensor dataAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3561US12237158B2Etch feedback for control of upstream processAPPLIED MATERIALS INC·Filed 2020·Granted Feb 25, 2025·0 cites·14 claims
- 3655US8274645B2Method and apparatus for in-situ metrology of a workpiece disposed in a vacuum processing chamberDAVIS MATTHEW F·Filed 2009·Granted Sep 25, 2012·2 cites·19 claims
- 3754US7393459B2Method for automatic determination of substrates states in plasma processing chambersAPPLIED MATERIALS INC·Filed 2004·Granted Jul 1, 2008·2 cites·27 claims
- 3846US11901203B2Substrate process endpoint detection using machine learningAPPLIED MATERIALS INC·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 3946US2022165593A1Feedforward control of multi-layer stacks during device fabricationAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4046US2012291952A1Method and system for monitoring an etch processDAVIS MATTHEW FENTON·Filed 2012·Application pending·0 cites
- 4144US2010076729A1Self-diagnostic semiconductor equipmentAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4242US2004200574A1Method for controlling a process for fabricating integrated devicesAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 4341US2022397515A1Obtaining substrate metrology measurement values using machine learningAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 4440US2009158265A1Implementation of advanced endpoint functions within third party software by using a plug-in approachDAVIS MATTHEW FENTON·Filed 2007·Application pending·0 cites
- 4539US2007249071A1Neural Network Methods and Apparatuses for Monitoring Substrate ProcessingLIAN LEI·Filed 2006·Application pending·0 cites
- 4639US2020013588A1Tilted interferometric endpoint (iep) window for sensitivity improvementAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 4739US2013309785A1Rotational absorption spectra for semiconductor manufacturing process monitoring and controlAPPLIED MATERIAL INC·Filed 2013·Application pending·0 cites
- 4837US2004018647A1Method for controlling the extent of notch or undercut in an etched profile using optical reflectometryAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →