Inventor · disambiguated record
Lee Smith
Also filed as: SMITH LEE · SMITH LEE J · SMITH LEE JOHN
14 granted patents·2 pending applications·1,054 citations·filing 1991–2021
95Inventor score
Top patents by PatentIndex Score
16 records- 0199US7842541B1Ultra thin package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Nov 30, 2010·169 cites·19 claims
- 0298US7176506B2High frequency chip packages with connecting elementsTESSERA INC·Filed 2003·Granted Feb 13, 2007·320 cites·18 claims
- 0397US6472758B1Semiconductor package including stacked semiconductor dies and bond wiresAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 29, 2002·193 cites·27 claims
- 0496US6650019B2Method of making a semiconductor package including stacked semiconductor diesAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 18, 2003·123 cites·27 claims
- 0594US8129824B1Shielding for a semiconductor packageST AMAND ROGER D·Filed 2008·Granted Mar 6, 2012·54 cites·21 claims
- 0694US8017436B1Thin substrate fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2007·Granted Sep 13, 2011·33 cites·23 claims
- 0794US7687893B2Semiconductor package having leadframe with exposed anchor padsAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 30, 2010·33 cites·20 claims
- 0892US7268426B2High-frequency chip packagesTESSERA INC·Filed 2004·Granted Sep 11, 2007·56 cites·18 claims
- 0972USD426641SBody shaping deviceSMITH LEE·Filed 1999·Granted Jun 13, 2000·18 cites·1 claims
- 1072US5216922ASlope monitoring deviceMODULAR MINING SYSTEMS INC·Filed 1991·Granted Jun 8, 1993·33 cites·18 claims
- 1171US11840103B2Tapeless carrier for mechanically fixing tube-shaped objectsTYCO ELECTRONICS LTD UK·Filed 2021·Granted Dec 12, 2023·0 cites·19 claims
- 1268USD483628SFood dicing deviceFiled 2003·Granted Dec 16, 2003·17 cites·1 claims
- 1365US9367712B1High density memory card using folded flexSMITH LEE J·Filed 2007·Granted Jun 14, 2016·3 cites·20 claims
- 1465US8089141B1Semiconductor package having leadframe with exposed anchor padsSMITH LEE J·Filed 2010·Granted Jan 3, 2012·2 cites·19 claims
- 1551US2007096160A1High frequency chip packages with connecting elementsTESSERA INC·Filed 2006·Application pending·0 cites
- 1633US2005156322A1Thin semiconductor package including stacked diesFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →