Inventor · disambiguated record
Leonardus Antonius Elisabeth Van Gemert
Also filed as: VAN GEMERT LEONARDUS A E · VAN GEMERT LEONARDUS ANTONIUS ELISABETH
13 granted patents·7 pending applications·63 citations·filing 2003–2017
90Inventor score
Top patents by PatentIndex Score
20 records- 0193US9466585B1Reducing defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Oct 11, 2016·17 cites·12 claims
- 0292US10177111B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2017·Granted Jan 8, 2019·10 cites·12 claims
- 0390US9704823B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Jul 11, 2017·8 cites·4 claims
- 0488US8987057B2Encapsulated wafer-level chip scale (WLSCP) pedestal packagingNXP BV·Filed 2013·Granted Mar 24, 2015·8 cites·11 claims
- 0583US9196537B2Protection of a wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Nov 24, 2015·6 cites·15 claims
- 0677US9245804B2Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Jan 26, 2016·4 cites·9 claims
- 0772US9653414B2Shielded QFN package and method of makingNXP BV·Filed 2015·Granted May 16, 2017·2 cites·14 claims
- 0868US8895357B2Integrated circuit and method of manufacturing the sameNXP BV·Filed 2013·Granted Nov 25, 2014·2 cites·9 claims
- 0963US9385099B2Die interconnectNXP BV·Filed 2014·Granted Jul 5, 2016·1 cites·14 claims
- 1060US8217281B2Package, method of manufacturing a package and frameVAN GEMERT LEONARDUS A E·Filed 2008·Granted Jul 10, 2012·4 cites·8 claims
- 1154US9263299B2Exposed die clip bond power packageNXP BV·Filed 2014·Granted Feb 16, 2016·1 cites·10 claims
- 1251US2015069587A1Integrated circuit and method of manufacturing the sameNXP BV·Filed 2014·Application pending·0 cites
- 1349US10096555B2Shielded QFN package and method of makingNXP BV·Filed 2017·Granted Oct 9, 2018·0 cites·19 claims
- 1445US2015162306A1Encapsulated wafer-level chip scale (wlscp) pedestal packagingNXP BV·Filed 2015·Application pending·0 cites
- 1544US2005237419A1Camera module, holder for use in a camera module, camera system and method of manufacturing a camera moduleKONINKL PHILIPS ELECTRONICS NV·Filed 2003·Application pending·0 cites
- 1643US2016005653A1Flexible wafer-level chip-scale packages with improved board-level reliabilityNXP BV·Filed 2014·Application pending·0 cites
- 1739US2016005680A1Exposed-Heatsink Quad Flat No-Leads (QFN) PackageNXP BV·Filed 2014·Application pending·0 cites
- 1839US2016005679A1Exposed die quad flat no-leads (qfn) packageNXP BV·Filed 2014·Application pending·0 cites
- 1932US2017103939A1Ultrathin routable quad flat no-leads (qfn) packageNXP BV·Filed 2015·Application pending·0 cites
- 2028US9953903B2Heatsink very-thin quad flat no-leads (HVQFN) packageNXP BV·Filed 2015·Granted Apr 24, 2018·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →