Inventor · disambiguated record
Lin Cui
Also filed as: CUI LIN
13 granted patents·3 pending applications·38 citations·filing 2005–2024
85Inventor score
Files withBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD4LAM RES CORP3UNIV QINGDAO TECHNOLOGY3HIDETOSHI FUJII2UNIV JINAN2
Top patents by PatentIndex Score
16 records- 0195US9991128B2Atomic layer etching in continuous plasmaLAM RES CORP·Filed 2017·Granted Jun 5, 2018·26 cites·19 claims
- 0293US10023956B2Eliminating first wafer metal contamination effect in high density plasma chemical vapor deposition systemsLAM RES CORP·Filed 2015·Granted Jul 17, 2018·8 cites·11 claims
- 0379US11608609B1Pile-side lateral static load deviceUNIV QINGDAO TECHNOLOGY·Filed 2022·Granted Mar 21, 2023·1 cites·8 claims
- 0467US11308453B2Method and system for scheduling pieces of materials based on real-time device statusBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2018·Granted Apr 19, 2022·1 cites·11 claims
- 0561US10687415B2Flexible printed circuit boardDALIAN CANGLONG OPTOELECTRONICS TECH CO LTD·Filed 2017·Granted Jun 16, 2020·2 cites·4 claims
- 0660US2025290840A1Seepage erosion test systemUNIV QINGDAO TECHNOLOGY·Filed 2024·Application pending·0 cites
- 0752US12435484B2System and method for monitoring earth pressure and displacement of miniature steel pipe pile bodyUNIV QINGDAO TECHNOLOGY·Filed 2022·Granted Oct 7, 2025·0 cites·8 claims
- 0852US11703839B2Material processing path selection method and deviceBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2022·Granted Jul 18, 2023·0 cites·10 claims
- 0950US2008190907A1Method of Connecting Metal MaterialHIDETOSHI FUJII·Filed 2005·Application pending·0 cites
- 1050US2008142572A1Method of Connecting Metal MaterialHIDETOSHI FUJII·Filed 2005·Application pending·0 cites
- 1142US11292718B2Process for preparing sulfur from reduction of sulfate/ nitrate by iron-carbon and recovering desulfurization/ denitration agentsUNIV SHANDONG·Filed 2018·Granted Apr 5, 2022·0 cites·10 claims
- 1240US12476123B2Method and apparatus for material dispatching, and vertical furnace apparatusBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2019·Granted Nov 18, 2025·0 cites·7 claims
- 1339US12197195B2Material scheduling method and device of semiconductor processing equipmentBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·9 claims
- 1438US10020183B1Edge roughness reductionLAM RES CORP·Filed 2017·Granted Jul 10, 2018·0 cites·14 claims
- 1534US11886583B2Description-entropy-based intelligent detection method for big data mobile software similarityUNIV JINAN·Filed 2020·Granted Jan 30, 2024·0 cites·8 claims
- 1633US11334669B2Method for fast and intelligent comparison and security detection of mobile malware big dataUNIV JINAN·Filed 2019·Granted May 17, 2022·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →