Inventor · disambiguated record
Liangfa Hu
Also filed as: HU LIANGFA
6 granted patents·3 pending applications·0 citations·filing 2018–2023
65Inventor score
Top patents by PatentIndex Score
9 records- 0176US12334384B2Methods and apparatus for minimizing substrate backside damageAPPLIED MATERIALS INC·Filed 2023·Granted Jun 17, 2025·0 cites·17 claims
- 0275US2023151487A1Methods of reducing chamber residuesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0371US2023146566A1Heat Treatable Magnets Having Improved Alignment Through Application Of External Magnetic Field During Binder-Assisted MoldingUNIV IOWA STATE RES FOUND INC·Filed 2022·Application pending·0 cites
- 0468US11560623B2Methods of reducing chamber residuesAPPLIED MATERIALS INC·Filed 2020·Granted Jan 24, 2023·0 cites·16 claims
- 0561US11515066B2Heat treatable magnets having improved alignment through application of external magnetic field during binder-assisted moldingUNIV IOWA STATE RES FOUND INC·Filed 2018·Granted Nov 29, 2022·0 cites·17 claims
- 0658US11756819B2Methods and apparatus for minimizing substrate backside damageAPPLIED MATERIALS INC·Filed 2020·Granted Sep 12, 2023·0 cites·10 claims
- 0755US2025140537A1Chamber and methods for downstream residue managementAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0854US11515150B2Hardmask tuning by electrode adjustmentAPPLIED MATERIALS INC·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 0945US10971390B2Methods of minimizing wafer backside damage in semiconductor wafer processingAPPLIED MATERIALS INC·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →