Inventor · disambiguated record
Liran Yerushalmi
Also filed as: YERUSHALMI LIRAN
25 granted patents·2 pending applications·41 citations·filing 2016–2023
93Inventor score
Top patents by PatentIndex Score
27 records- 0197US11355375B2Device-like overlay metrology targets displaying Moiré effectsKLA CORP·Filed 2020·Granted Jun 7, 2022·6 cites·21 claims
- 0293US11604420B2Self-calibrating overlay metrologyKLA CORP·Filed 2021·Granted Mar 14, 2023·2 cites·44 claims
- 0392US11353799B1System and method for error reduction for metrology measurementsKLA CORP·Filed 2020·Granted Jun 7, 2022·5 cites·25 claims
- 0490US10551749B2Metrology targets with supplementary structures in an intermediate layerKLA TENCOR CORP·Filed 2017·Granted Feb 4, 2020·3 cites·29 claims
- 0589US10943838B2Measurement of overlay error using device inspection systemKLA TENCOR CORP·Filed 2018·Granted Mar 9, 2021·6 cites·20 claims
- 0688US11532566B2Misregistration target having device-scaled features useful in measuring misregistration of semiconductor devicesKLA CORP·Filed 2020·Granted Dec 20, 2022·2 cites·19 claims
- 0787US10571811B2Device metrology targets and methodsKLA TENCOR CORP·Filed 2016·Granted Feb 25, 2020·5 cites·25 claims
- 0885US10409171B2Overlay control with non-zero offset predictionKLA TENCOR CORP·Filed 2018·Granted Sep 10, 2019·3 cites·39 claims
- 0985US10095121B2Optimizing the utilization of metrology toolsKLA TENCOR CORP·Filed 2016·Granted Oct 9, 2018·5 cites·19 claims
- 1083US11635682B2Systems and methods for feedforward process control in the manufacture of semiconductor devicesKLA CORP·Filed 2020·Granted Apr 25, 2023·2 cites·16 claims
- 1181US11604063B2Self-calibrated overlay metrology using a skew training sampleKLA CORP·Filed 2021·Granted Mar 14, 2023·1 cites·26 claims
- 1278US11709433B2Device-like metrology targetsKLA TENCOR CORP·Filed 2022·Granted Jul 25, 2023·0 cites·20 claims
- 1376US11880142B2Self-calibrating overlay metrologyKLA CORP·Filed 2023·Granted Jan 23, 2024·0 cites·34 claims
- 1469US10763146B2Recipe optimization based zonal analysisKLA TENCOR CORP·Filed 2017·Granted Sep 1, 2020·1 cites·13 claims
- 1568US11644419B2Measurement of properties of patterned photoresistKLA CORP·Filed 2021·Granted May 9, 2023·0 cites·18 claims
- 1667US12347706B2Method for measuring and correcting misregistration between layers in a semiconductor device, and misregistration targets useful thereinKLA TENCOR CORP·Filed 2022·Granted Jul 1, 2025·0 cites·14 claims
- 1765US2020124981A1Device-like metrology targetsKLA TENCOR CORP·Filed 2019·Application pending·0 cites
- 1864US11784097B2Measurement of overlay error using device inspection systemKLA TENCOR CORP·Filed 2021·Granted Oct 10, 2023·0 cites·12 claims
- 1955US11302544B2Method for measuring and correcting misregistration between layers in a semiconductor device, and misregistration targets useful thereinKLA TENCOR CORP·Filed 2019·Granted Apr 12, 2022·0 cites·13 claims
- 2053US12131959B2Systems and methods for improved metrology for semiconductor device wafersKLA CORP·Filed 2021·Granted Oct 29, 2024·0 cites·24 claims
- 2153US11054752B2Device metrology targets and methodsKLA TENCOR CORP·Filed 2018·Granted Jul 6, 2021·0 cites·23 claims
- 2253US10725385B2Optimizing the utilization of metrology toolsKLA TENCOR CORP·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 2352US10331050B2Lithography systems with integrated metrology tools having enhanced functionalitiesKLA TENCOR CORP·Filed 2017·Granted Jun 25, 2019·0 cites·16 claims
- 2451US2023128610A1Continuous Machine Learning Model Training for Semiconductor ManufacturingKLA CORP·Filed 2021·Application pending·0 cites
- 2550US11075126B2Misregistration measurements using combined optical and electron beam technologyKLA TENCOR CORP·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 2643US12393113B2Inter-step feedforward process control in the manufacture of semiconductor devicesKLA CORP·Filed 2020·Granted Aug 19, 2025·0 cites·14 claims
- 2742US11971664B2Reducing device overlay errorsKLA TENCOR CORP·Filed 2018·Granted Apr 30, 2024·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →