Inventor · disambiguated record
Lily Zhao
Also filed as: ZHAO LILY · ZHAO LILY LI
14 granted patents·18 pending applications·44 citations·filing 1999–2024
87Inventor score
Files withQUALCOMM INC23HONEYWELL INT INC2KONINKL PHILIPS ELECTRONICS NV2TAIWAN SEMICONDUCTOR MFG2AMPHENOL CORP1
Top patents by PatentIndex Score
32 records- 0185US11948909B2Package comprising spacers between integrated devicesQUALCOMM INC·Filed 2022·Granted Apr 2, 2024·1 cites·26 claims
- 0281US11557557B2Flip-chip flexible under bump metallization sizeQUALCOMM INC·Filed 2020·Granted Jan 17, 2023·1 cites·24 claims
- 0375US8847391B2Non-circular under bump metallization (UBM) structure, orientation of non-circular UBM structure and trace orientation to inhibit peeling and/or crackingQUALCOMM INC·Filed 2013·Granted Sep 30, 2014·4 cites·58 claims
- 0463US6207476B1Methods of packaging an integrated circuit and methods of forming an integrated circuit packageVLSI TECHNOLOGY INC·Filed 1999·Granted Mar 27, 2001·21 cites·16 claims
- 0560US2025309078A1Semiconductor die having a die interconnect and a die level distribution (dld) metallization layer including a metal line and a metal pad having a width greater than the width of the metal line for improved signal path conductivity between the die interconnect and the metal padQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0660US2024355781A1Integrated device comprising an offset interconnectQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0759US2025246569A1Stacked integrated circuit devices with face-to-face connections between logic and memory diesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0859US2025273586A1Package comprising a base portion and integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0959US2025300102A1Integrated device comprising metallization portionQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1058US12500188B2Flip-chip bumping metal layer and bump structureQUALCOMM INC·Filed 2023·Granted Dec 16, 2025·0 cites·27 claims
- 1158US6630737B2Integrated circuit package, ball-grid array integrated circuit packageKONINKL PHILIPS ELECTRONICS NV·Filed 1999·Granted Oct 7, 2003·17 cites·4 claims
- 1257US2024421119A1Flexible under-bump metallization (ubm) sizes and patterning, and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1356US11694982B2Sidewall wetting barrier for conductive pillarsQUALCOMM INC·Filed 2021·Granted Jul 4, 2023·0 cites·30 claims
- 1456US2024371736A1Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1556US2024421128A1Semiconductor device with multiple stacked passive devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1655USRE42457EMethods of packaging an integrated circuit and methods of forming an integrated circuit packageTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jun 14, 2011·0 cites·38 claims
- 1755USRE42332EIntegrated circuit package, ball-grid array integrated circuit packageTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted May 10, 2011·0 cites·26 claims
- 1854US12113038B2Thermal compression flip chip bump for high performance and fine pitchQUALCOMM INC·Filed 2020·Granted Oct 8, 2024·0 cites·26 claims
- 1953US2024079352A1Integrated circuit (ic) packages employing capacitor interposer substrate with aligned external interconnects, and related fabrication methodsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2052US12282187B2Building control device with a light guide configured for uniformly illuminating a graphical symbol that is visible to a user of the building control deviceHONEYWELL INT INC·Filed 2023·Granted Apr 22, 2025·0 cites·4 claims
- 2152US2023384367A1Bump structure for micro-bumped wafer probeQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2252US2024055383A1Bump coplanarity for die-to-die and other applicationsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2351US12345936B2Building control device with a light guide configured for uniformly illuminating a graphical symbol that is visible to a user of the building control deviceHONEYWELL INT INC·Filed 2023·Granted Jul 1, 2025·0 cites·17 claims
- 2451US2023369230A1Package comprising an interconnection die located between metallization portionsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2549US12469811B2Package comprising wire bonds coupled to integrated devicesQUALCOMM INC·Filed 2021·Granted Nov 11, 2025·0 cites·25 claims
- 2649US2023369234A1Package comprising a substrate and an interconnection die configured for high density interconnectionQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2747US12347980B2High-speed network connector with integrated magneticsAMPHENOL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·28 claims
- 2846US2017035236A1Beverage System for Providing a Cold BeverageNESTEC SA·Filed 2014·Application pending·0 cites
- 2946US2010300743A1Modified Pillar Design for Improved Flip Chip PackagingQUALCOMM INC·Filed 2009·Application pending·0 cites
- 3038US2014124877A1Conductive interconnect including an inorganic collarQUALCOMM INC·Filed 2013·Application pending·0 cites
- 3137US2018331061A1Integrated device comprising bump on exposed redistribution interconnectQUALCOMM INC·Filed 2017·Application pending·0 cites
- 3231US2008251286A1Method For Increasing a Routing Density For a Circuit Board and Such a Circuit BoardKONINKL PHILIPS ELECTRONICS NV·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →