Inventor · disambiguated record
Louis W. Nicholls
Also filed as: NICHOLLS LOUIS W
18 granted patents·1 pending application·291 citations·filing 1996–2025
94Inventor score
Files withAMKOR TECH SINGAPORE HOLDING PTE LTD7AMKOR TECHNOLOGY INC5MITSUBISHI SEMICONDUCTOR AM3DARVEAUX ROBERT FRANCIS1MITSUBISHI ELECTRIC AMERICA IN1
Top patents by PatentIndex Score
19 records- 0194US9462690B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Oct 4, 2016·15 cites·20 claims
- 0294US8536458B1Fine pitch copper pillar package and methodDARVEAUX ROBERT FRANCIS·Filed 2009·Granted Sep 17, 2013·27 cites·18 claims
- 0393US10347562B1Methods and structures for increasing the allowable die size in TMV packagesAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 9, 2019·7 cites·20 claims
- 0492US2025372490A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0591US9721872B1Methods and structures for increasing the allowable die size in TMV packagesNICHOLLS LOUIS W·Filed 2012·Granted Aug 1, 2017·16 cites·21 claims
- 0688US10224270B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 5, 2019·4 cites·22 claims
- 0784US10418318B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2019·Granted Sep 17, 2019·2 cites·20 claims
- 0883US12394699B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 0982US5776327AMethod and apparatus using an anode basket for electroplating a workpieceMITSUBISHI SEMICONUCTOR AMERIC·Filed 1996·Granted Jul 7, 1998·98 cites·18 claims
- 1077US5788829AMethod and apparatus for controlling plating thickness of a workpieceMITSUBISHI SEMICONDUCTOR AM·Filed 1996·Granted Aug 4, 1998·62 cites·10 claims
- 1176US11876039B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Jan 16, 2024·0 cites·20 claims
- 1275US10714408B2Semiconductor devices and methods of making semiconductor devicesAMKOR TECHNOLOGY INC·Filed 2019·Granted Jul 14, 2020·1 cites·21 claims
- 1374US12191241B2Fine pitch copper pillar package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jan 7, 2025·0 cites·22 claims
- 1474US5744013AAnode basket for controlling plating thickness distributionMITSUBISHI SEMICONDUCTOR AM·Filed 1996·Granted Apr 28, 1998·29 cites·8 claims
- 1570US11488892B2Methods and structures for increasing the allowable die size in TMV packagesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 1669US11362027B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 14, 2022·0 cites·19 claims
- 1769US5653860ASystem for ultrasonic removal of air bubbles from the surface of an electroplated articleMITSUBISHI SEMICONDUCTOR AM·Filed 1996·Granted Aug 5, 1997·21 cites·11 claims
- 1863US11088064B2Fine pitch copper pillar package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 1939US5864776AApparatus and method for detecting an error in the placement of a lead frame on a surface of a die moldMITSUBISHI ELECTRIC AMERICA IN·Filed 1997·Granted Jan 26, 1999·9 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →