Inventor · disambiguated record
Lorenzo Valdevit
Also filed as: VALDEVIT LORENZO
10 granted patents·3 pending applications·57 citations·filing 2007–2020
89Inventor score
Files withIBM7UNIV CALIFORNIA3GLOBALFOUNDRIES INC1KHARMA VIJAYESHWAR D1THE REGENTS OF TEH UNIV OF CALIFORNIA1
Top patents by PatentIndex Score
13 records- 0194US8047421B2Elliptic C4 with optimal orientation for enhanced reliability in electronic packagesIBM·Filed 2010·Granted Nov 1, 2011·21 cites·7 claims
- 0286US9228916B2Self calibrating micro-fabricated load cellsUNIV CALIFORNIA·Filed 2013·Granted Jan 5, 2016·10 cites·18 claims
- 0382US8054630B2Electronic components on trenched substrates and method of forming sameIBM·Filed 2008·Granted Nov 8, 2011·6 cites·12 claims
- 0480US11193551B2Stable shape-reconfigurable structures and mechanismsUNIV CALIFORNIA·Filed 2017·Granted Dec 7, 2021·4 cites·14 claims
- 0579US7855430B2Electronic components on trenched substrates and method of forming sameIBM·Filed 2008·Granted Dec 21, 2010·4 cites·6 claims
- 0679US7777301B2Electronic components on trenched substrates and method of forming sameIBM·Filed 2008·Granted Aug 17, 2010·4 cites·9 claims
- 0777US7732894B2Electronic components on trenched substrates and method of forming sameIBM·Filed 2008·Granted Jun 8, 2010·4 cites·20 claims
- 0872US8659119B2Electronic components on trenched substrates and method of forming sameKHARMA VIJAYESHWAR D·Filed 2010·Granted Feb 25, 2014·3 cites·20 claims
- 0959US9508789B2Electronic components on trenched substrates and method of forming sameGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 29, 2016·0 cites·20 claims
- 1058US7841508B2Elliptic C4 with optimal orientation for enhanced reliability in electronic packagesIBM·Filed 2007·Granted Nov 30, 2010·1 cites·7 claims
- 1156US2020332547A1Architected material design for seismic isolationUNIV CALIFORNIA·Filed 2020·Application pending·0 cites
- 1254US2008205023A1Electronic components on trenched substrates and method of forming sameIBM·Filed 2007·Application pending·0 cites
- 1342US2018334825A1Architected material design for seismic isolationTHE REGENTS OF TEH UNIV OF CALIFORNIA·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →