Inventor · disambiguated record
Masamitsu Agari
Also filed as: Agari Masamitsu
44 granted patents·1 pending application·13 citations·filing 2017–2024
95Inventor score
Top patents by PatentIndex Score
45 records- 0190US11289379B2Wafer processing methodDISCO CORP·Filed 2020·Granted Mar 29, 2022·2 cites·12 claims
- 0282US10438898B2Wafer processing methodDISCO CORP·Filed 2017·Granted Oct 8, 2019·3 cites·2 claims
- 0381US11024543B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 1, 2021·1 cites·13 claims
- 0480US10991624B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2020·Granted Apr 27, 2021·1 cites·14 claims
- 0579US10847420B2Wafer processing methodDISCO CORP·Filed 2019·Granted Nov 24, 2020·2 cites·11 claims
- 0672US11037814B2Wafer processing method using a ring frame with a polyester sheet with no adhesive layerDISCO CORP·Filed 2019·Granted Jun 15, 2021·1 cites·13 claims
- 0771US11062948B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jul 13, 2021·1 cites·12 claims
- 0868US10297501B2Method for dividing wafer into individual chipsDISCO CORP·Filed 2017·Granted May 21, 2019·2 cites·1 claims
- 0966US2024286245A1Substrate treatment apparatus and method for treating substrateEBARA CORP·Filed 2024·Application pending·0 cites
- 1060US11545393B2Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jan 3, 2023·0 cites·8 claims
- 1153US12295174B2Substrate dividing method using an expansion tape and a rollerDISCO CORP·Filed 2022·Granted May 6, 2025·0 cites·3 claims
- 1249US11610815B2Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Mar 21, 2023·0 cites·11 claims
- 1349US11594454B2Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 28, 2023·0 cites·11 claims
- 1449US11587833B2Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1549US11587832B2Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1649US11476161B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2020·Granted Oct 18, 2022·0 cites·13 claims
- 1749US11393721B2Wafer processing methodDISCO CORP·Filed 2020·Granted Jul 19, 2022·0 cites·12 claims
- 1849US11380588B2Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jul 5, 2022·0 cites·15 claims
- 1949US11322407B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 2048US11380587B2Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jul 5, 2022·0 cites·15 claims
- 2148US11361997B2Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jun 14, 2022·0 cites·21 claims
- 2248US11322406B2Wafer processing methodDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·8 claims
- 2348US11270916B2Wafer processing methodDISCO CORP·Filed 2020·Granted Mar 8, 2022·0 cites·18 claims
- 2448US11049772B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
- 2547US11302578B2Wafer processing methodDISCO CORP·Filed 2020·Granted Apr 12, 2022·0 cites·9 claims
- 2647US11251082B2Wafer processing methodDISCO CORP·Filed 2020·Granted Feb 15, 2022·0 cites·8 claims
- 2747US11056334B2Wafer processing method using a ring frame and a polyester sheetDISCO CORP·Filed 2019·Granted Jul 6, 2021·0 cites·10 claims
- 2847US11049757B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
- 2947US11031234B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2019·Granted Jun 8, 2021·0 cites·15 claims
- 3047US11018058B2Wafer processing method for dividing a wafer along predefined division lines using polyester sheetDISCO CORP·Filed 2020·Granted May 25, 2021·0 cites·9 claims
- 3147US11011407B2Wafer processing method using a ring frame and a polyolefin sheetDISCO CORP·Filed 2019·Granted May 18, 2021·0 cites·11 claims
- 3247US11004744B2Wafer processing method for dividing a wafer along predefined division linesDISCO CORP·Filed 2020·Granted May 11, 2021·0 cites·10 claims
- 3347US10998232B2Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheetDISCO CORP·Filed 2020·Granted May 4, 2021·0 cites·9 claims
- 3447US10991587B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·14 claims
- 3547US10985067B2Wafer processing method using a laser beam dividing stepDISCO CORP·Filed 2020·Granted Apr 20, 2021·0 cites·18 claims
- 3647US10720355B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jul 21, 2020·0 cites·9 claims
- 3746US11127633B2Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheetDISCO CORP·Filed 2019·Granted Sep 21, 2021·0 cites·21 claims
- 3846US11069574B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 3946US11043421B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jun 22, 2021·0 cites·21 claims
- 4046US11037813B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jun 15, 2021·0 cites·25 claims
- 4146US10985066B2Wafer processing method for dividing a wafer along division linesDISCO CORP·Filed 2019·Granted Apr 20, 2021·0 cites·9 claims
- 4246US10910269B2Wafer processing methodDISCO CORP·Filed 2019·Granted Feb 2, 2021·0 cites·8 claims
- 4346US10896850B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jan 19, 2021·0 cites·13 claims
- 4445US11018043B2Wafer processing method using a ring frame and a polyester sheetDISCO CORP·Filed 2019·Granted May 25, 2021·0 cites·10 claims
- 4542US10847404B2Sheet sticking methodDISCO CORP·Filed 2018·Granted Nov 24, 2020·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →