Inventor · disambiguated record
Marvin L. Bernt
Also filed as: BERNT MARVIN · BERNT MARVIN L · BERNT MARVIN LOUIS
18 granted patents·15 pending applications·95 citations·filing 1995–2024
91Inventor score
Files withAPPLIED MATERIALS INC25SEMITOOL INC3SCHMITT MEASUREMENT SYSTEMS IN2GHEKIERE JOHN1KIM BIOH1
Top patents by PatentIndex Score
33 records- 0193US11634830B2Electrochemical depositions of nanotwin copper materialsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 25, 2023·2 cites·17 claims
- 0284US9359683B2Method of forming metal and metal alloy featuresKIM BIOH·Filed 2007·Granted Jun 7, 2016·6 cites·46 claims
- 0383US10494731B2Electroplating dynamic edge controlAPPLIED MATERIALS INC·Filed 2017·Granted Dec 3, 2019·3 cites·18 claims
- 0478US5625451AMethods and apparatus for characterizing a surfaceSCHMITT MEASUREMENT SYSTEMS IN·Filed 1995·Granted Apr 29, 1997·50 cites·33 claims
- 0576US12404597B2Electrochemical depositions of nanotwin copper materialsAPPLIED MATERIALS INC·Filed 2023·Granted Sep 2, 2025·0 cites·18 claims
- 0670US12444707B2Method for collective dishing of singulated diesAPPLIED MATERIALS INC·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 0769US10373864B2Systems and methods for wetting substratesAPPLIED MATERIALS INC·Filed 2017·Granted Aug 6, 2019·1 cites·19 claims
- 0869US7305999B2Centrifugal spray processor and retrofit kitSEMITOOL INC·Filed 2002·Granted Dec 11, 2007·13 cites·24 claims
- 0969US2019345624A1Systems and methods for removing contaminants in electroplating systemsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1064US2025273392A1Formation of Inductor Core Stacks Using Self-Assembled MonolayersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1164US2016355941A1Method of forming metal and metal alloy featuresAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
- 1262US2008041727A1Method and system for depositing alloy compositionSEMITOOL INC·Filed 2006·Application pending·0 cites
- 1360US11973034B2Nanotwin copper materials in semiconductor devicesAPPLIED MATERIALS INC·Filed 2021·Granted Apr 30, 2024·0 cites·19 claims
- 1460US5661556ASystem for measuring the total integrated scatter of a surfaceSCHMITT MEASUREMENT SYSTEMS IN·Filed 1996·Granted Aug 26, 1997·20 cites·12 claims
- 1557US2024413011A1Automated dial-in of electroplating process parameters based on wafer results from ex-situ metrologyAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1656US2024355676A1Process for thin electroless depositionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1755US11901225B2Diffusion layers in metal interconnectsAPPLIED MATERIALS INC·Filed 2021·Granted Feb 13, 2024·0 cites·14 claims
- 1854US11899376B1Methods for forming alignment marksAPPLIED MATERIALS INC·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 1954US2025308953A1In-Line Validation of Substrate Bonding SurfaceAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2054US2015247251A1Methods for electrochemical deposition of multi-component solder using cation permeable barrierAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2151US2024021571A1Hybrid bonding of semiconductor structures to advanced substrate panelsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2249US12412810B2Single side via fill process for through-viasAPPLIED MATERIALS INC·Filed 2022·Granted Sep 9, 2025·0 cites·17 claims
- 2349US11875996B2Methods for electrochemical deposition of isolated seed layer areasAPPLIED MATERIALS INC·Filed 2021·Granted Jan 16, 2024·0 cites·13 claims
- 2447US11203816B1Electroplating seed layer buildup and repairAPPLIED MATERIALS INC·Filed 2020·Granted Dec 21, 2021·0 cites·19 claims
- 2546US2022157655A1Electroplating with temporary featuresAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2643US2014246324A1Methods for electrochemical deposition of multi-component solder using cation permeable barrierAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2742US7420690B2End point detection in workpiece processingSEMITOOL INC·Filed 2005·Granted Sep 2, 2008·0 cites·18 claims
- 2840US11987897B2Systems and methods for shielding features of a workpiece during electrochemical depositionAPPLIED MATERIALS INC·Filed 2017·Granted May 21, 2024·0 cites·19 claims
- 2936US2020306931A1Methods and apparatus for removing abrasive particlesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3035US9922874B2Methods of enhancing polymer adhesion to copperAPPLIED MATERIALS INC·Filed 2016·Granted Mar 20, 2018·0 cites·20 claims
- 3132US2008070411A1Methods for uniformly etching films on a semiconductor waferGHEKIERE JOHN·Filed 2006·Application pending·0 cites
- 3230US2012052204A1Workpiece wetting and cleaningPUCH BRYAN·Filed 2010·Application pending·0 cites
- 3329US2015348925A1Reduced titanium undercut in etch processAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →