Inventor · disambiguated record
Marcel Broekaart
Also filed as: BROEKAART MARCEL · BROEKAART MARCEL EDUARD · BROEKAART MARCEL EDUARD IRENE
38 granted patents·15 pending applications·127 citations·filing 2001–2025
96Inventor score
Files withSOITEC SILICON ON INSULATOR37BROEKAART MARCEL7CASTEX ARNAUD6KONINKL PHILIPS ELECTRONICS NV1LAGAHE BLANCHARD CHRYSTELLE1
Top patents by PatentIndex Score
53 records- 0196US11711065B2Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave deviceSOITEC SILICON ON INSULATOR·Filed 2021·Granted Jul 25, 2023·5 cites·21 claims
- 0293US8575002B2Direct bonding method with reduction in overlay misalignmentBROEKAART MARCEL·Filed 2011·Granted Nov 5, 2013·26 cites·18 claims
- 0388US8202785B2Surface treatment for molecular bondingCASTEX ARNAUD·Filed 2009·Granted Jun 19, 2012·19 cites·15 claims
- 0485US9004135B2Method and apparatus for bonding together two wafers by molecular adhesionCASTEX ARNAUD·Filed 2011·Granted Apr 14, 2015·9 cites·25 claims
- 0585US8163570B2Method of initiating molecular bondingCASTEX ARNAUD·Filed 2009·Granted Apr 24, 2012·11 cites·20 claims
- 0684US10608610B2Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave deviceSOITEC SILICON ON INSULATOR·Filed 2016·Granted Mar 31, 2020·3 cites·18 claims
- 0783US12272540B2Method for manufacturing a substrateSOITEC SILICON ON INSULATOR·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 0883US11800803B2Hybrid structure for a surface acoustic wave deviceSOITEC SILICON ON INSULATOR·Filed 2017·Granted Oct 24, 2023·2 cites·20 claims
- 0983US8679944B2Progressive trimming methodBROEKAART MARCEL·Filed 2009·Granted Mar 25, 2014·17 cites·17 claims
- 1081US12143093B2Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave deviceSOITEC SILICON ON INSULATOR·Filed 2023·Granted Nov 12, 2024·0 cites·14 claims
- 1180US12165900B2Method of mechanical separation for a double layer transferSOITEC SILICON ON INSULATOR·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1280US10924081B2Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave deviceSOITEC SILICON ON INSULATOR·Filed 2020·Granted Feb 16, 2021·1 cites·30 claims
- 1380US9138980B2Apparatus for manufacturing semiconductor devicesSOITEC SILICON ON INSULATOR·Filed 2012·Granted Sep 22, 2015·3 cites·11 claims
- 1475US9733075B2System and method for assessing inhomogeneous deformations in multilayer platesBROEKAART MARCEL·Filed 2011·Granted Aug 15, 2017·3 cites·19 claims
- 1571US11742233B2Method of mechanical separation for a double layer transferSOITEC SILICON ON INSULATOR·Filed 2020·Granted Aug 29, 2023·0 cites·12 claims
- 1670US11837463B2Method for manufacturing a substrateSOITEC SILICON ON INSULATOR·Filed 2020·Granted Dec 5, 2023·0 cites·20 claims
- 1770US8338266B2Method for molecular adhesion bonding at low pressureBROEKAART MARCEL·Filed 2011·Granted Dec 25, 2012·2 cites·15 claims
- 1867US8932938B2Method of fabricating a multilayer structure with circuit layer transferCASTEX ARNAUD·Filed 2010·Granted Jan 13, 2015·2 cites·16 claims
- 1967US6939812B2Method of forming an etch stop layer in a semiconductor deviceKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Sep 6, 2005·16 cites·15 claims
- 2066US9583531B2Process for transferring circuit layerSOITEC SILICON ON INSULATOR·Filed 2014·Granted Feb 28, 2017·2 cites·19 claims
- 2164US2025140603A1Method for manufacturing a semiconductor-on-insulator substrateSOITEC SILICON ON INSULATOR·Filed 2025·Application pending·0 cites
- 2262US10297464B2Process for the manufacture of a semiconductor element comprising a layer for trapping chargesSOITEC SILICON ON INSULATOR·Filed 2016·Granted May 21, 2019·1 cites·14 claims
- 2362US2022301847A1Support for a semiconductor structureSOITEC SILICON ON INSULATOR·Filed 2022·Application pending·0 cites
- 2460US12230533B2Method for manufacturing a semiconductor-on-insulator substrateSOITEC SILICON ON INSULATOR·Filed 2020·Granted Feb 18, 2025·0 cites·10 claims
- 2559US8927320B2Method of bonding by molecular bondingLAGAHE BLANCHARD CHRYSTELLE·Filed 2010·Granted Jan 6, 2015·2 cites·20 claims
- 2657US9905531B2Method for producing composite structure with metal/metal bondingSOITEC SILICON ON INSULATOR·Filed 2013·Granted Feb 27, 2018·1 cites·9 claims
- 2756US11088016B2Method for locating devicesSOITEC SILICON ON INSULATOR·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 2856US10943778B2Method for manufacturing a substrateSOITEC SILICON ON INSULATOR·Filed 2016·Granted Mar 9, 2021·0 cites·18 claims
- 2955US10910250B2Method of mechanical separation for a double layer transferSOITEC SILICON ON INSULATOR·Filed 2016·Granted Feb 2, 2021·0 cites·17 claims
- 3055US8871611B2Method for molecular adhesion bonding at low pressureSOITEC SILICON ON INSULATOR·Filed 2013·Granted Oct 28, 2014·0 cites·14 claims
- 3153US2015279830A1Method for bonding semiconductor wafers using a molecular bonding apparatusSOITEC SILICON ON INSULATOR·Filed 2015·Application pending·0 cites
- 3252US11373856B2Support for a semiconductor structureSOITEC SILICON ON INSULATOR·Filed 2018·Granted Jun 28, 2022·0 cites·20 claims
- 3352US8357589B2Method of thinning a structureSOITEC SILICON ON INSULATOR·Filed 2009·Granted Jan 22, 2013·0 cites·16 claims
- 3452US8232130B2Process for assembling wafers by means of molecular adhesionBROEKAART MARCEL·Filed 2008·Granted Jul 31, 2012·0 cites·13 claims
- 3552US2025201625A1Method for transferring a thin film onto a support substrateSOITEC SILICON ON INSULATOR·Filed 2022·Application pending·0 cites
- 3651US2025256955A1Method for assembling two substrates by molecular adhesion and structure obtained by such a methodSOITEC SILICON ON INSULATOR·Filed 2023·Application pending·0 cites
- 3751US2012067524A1Apparatus for manufacturing semiconductor devicesBROEKAART MARCEL·Filed 2011·Application pending·0 cites
- 3851US2013105932A1Method for molecular adhesion bonding at low pressureSOITEC SILICON ON INSULATOR·Filed 2012·Application pending·0 cites
- 3950US2011308721A1Apparatus for manufacturing semiconductor devicesBROEKAART MARCEL·Filed 2010·Application pending·0 cites
- 4050US2016197006A1Method for locating devicesSOITEC SILICON ON INSULATOR·Filed 2014·Application pending·0 cites
- 4149US2025176430A1Method for producing a donor substrate for transferring a piezoelectric layer, and method for transferring a piezoelectric layer to a carrier substrateSOITEC SILICON ON INSULATOR·Filed 2023·Application pending·0 cites
- 4248US2025372371A1Process for fabricating a structure comprising a layer that acts as a barrier to diffusion of atomic speciesSOITEC SILICON ON INSULATOR·Filed 2023·Application pending·0 cites
- 4347US2011287604A1Methods of forming semiconductor structures comprising direct bonding of substratesCASTEX ARNAUD·Filed 2011·Application pending·0 cites
- 4447US2025176431A1Method for producing a donor substrate for transferring a piezoelectric layer, and method for transferring a piezoelectric layer to a carrier substrateSOITEC SILICON ON INSULATOR·Filed 2023·Application pending·0 cites
- 4547US2013093033A9Three dimensional structures having improved alignments between layers of microcomponentsCASTEX ARNAUD·Filed 2011·Application pending·0 cites
- 4646US12183624B2Process for producing a receiver substrate for a semiconductor-on-insulator structure for radiofrequency applications and process for producing such a structureSOITEC SILICON ON INSULATOR·Filed 2020·Granted Dec 31, 2024·0 cites·19 claims
- 4745US10819282B2Method for minimizing distortion of a signal in a radiofrequency circuitSOITEC SILICON ON INSULATOR·Filed 2018·Granted Oct 27, 2020·0 cites·20 claims
- 4845US7768129B2Metal etching method for an interconnect structure and metal interconnect structure obtained by such methodNXP BV·Filed 2004·Granted Aug 3, 2010·2 cites·20 claims
- 4944US9548202B2Method for bonding by means of molecular adhesionSOITEC SILICON ON INSULATOR·Filed 2013·Granted Jan 17, 2017·0 cites·20 claims
- 5043US11373898B2Method for manufacturing a semiconductor on insulator type structure by layer transferSOITEC SILICON ON INSULATOR·Filed 2019·Granted Jun 28, 2022·0 cites·20 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →