Inventor · disambiguated record
Mark Chou
Also filed as: CHOU MARK
7 granted patents·1 pending application·110 citations·filing 2003–2019
85Inventor score
Top patents by PatentIndex Score
8 records- 0192US7470997B2Wirebond pad for semiconductor chip or waferMEGICA CORP·Filed 2004·Granted Dec 30, 2008·66 cites·20 claims
- 0291US8187965B2Wirebond pad for semiconductor chip or waferLIN MOU-SHIUNG·Filed 2007·Granted May 29, 2012·20 cites·27 claims
- 0386US10537983B2Modular power toolBLACK & DECKER INC·Filed 2017·Granted Jan 21, 2020·10 cites·18 claims
- 0482US10420287B2Pole assembly for vegetation cutting toolBLACK & DECKER INC·Filed 2016·Granted Sep 24, 2019·5 cites·5 claims
- 0566US8529136B2High temperature ball bearingLiu xiao-jun·Filed 2009·Granted Sep 10, 2013·6 cites·18 claims
- 0659US7554208B2Wirebond pad for semiconductor chip or waferMEGICA CORP·Filed 2007·Granted Jun 30, 2009·1 cites·25 claims
- 0758US2021068350A1Pole assembly for vegetation cutting toolBLACK & DECKER INC·Filed 2019·Application pending·0 cites
- 0840US6840677B2Ceramic bearing structureACT RX TECHNOLOGY CORP·Filed 2003·Granted Jan 11, 2005·2 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →