Inventor · disambiguated record
Matthew F. Davis
Also filed as: DAVIS MATTHEW F · DAVIS MATTHEW FENTON
27 granted patents·8 pending applications·919 citations·filing 2000–2012
97Inventor score
Files withAPPLIED MATERIALS INC23DAVIS MATTHEW FENTON4DAVIS MATTHEW F3LIAN LEI2APPLIED MATERILS INC1
Top patents by PatentIndex Score
35 records- 0195US8293016B2Apparatus for efficient removal of halogen residues from etched substratesBAHNG KENNETH J·Filed 2009·Granted Oct 23, 2012·555 cites·11 claims
- 0295US7169625B2Method for automatic determination of semiconductor plasma chamber matching and source of fault by comprehensive plasma monitoringAPPLIED MATERIALS INC·Filed 2003·Granted Jan 30, 2007·90 cites·31 claims
- 0394US7652774B2Interferometric endpoint determination in a substrate etching processAPPLIED MATERIALS INC·Filed 2007·Granted Jan 26, 2010·18 cites·18 claims
- 0492US7306696B2Interferometric endpoint determination in a substrate etching processAPPLIED MATERIALS INC·Filed 2002·Granted Dec 11, 2007·33 cites·23 claims
- 0589US7846845B2Integrated method for removal of halogen residues from etched substrates in a processing systemAPPLIED MATERIALS INC·Filed 2007·Granted Dec 7, 2010·16 cites·27 claims
- 0688US6323463B1Method and apparatus for reducing contamination in a wafer loadlock of a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 2000·Granted Nov 27, 2001·38 cites·9 claims
- 0787US7808651B2Determining endpoint in a substrate processAPPLIED MATERIALS INC·Filed 2010·Granted Oct 5, 2010·6 cites·26 claims
- 0884US8009938B2Advanced process sensing and control using near infrared spectral reflectometryAPPLIED MATERIALS INC·Filed 2008·Granted Aug 30, 2011·9 cites·24 claims
- 0984US7330244B2Method and apparatus for performing limited area spectral analysisAPPLIED MATERIALS INC·Filed 2006·Granted Feb 12, 2008·9 cites·20 claims
- 1084US6485254B1Energy dissipating couplingAPPLIED MATERIALS INC·Filed 2000·Granted Nov 26, 2002·30 cites·31 claims
- 1182US6410889B2Method and apparatus for reducing contamination in a wafer loadlock of a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 2001·Granted Jun 25, 2002·24 cites·9 claims
- 1281US8232212B2Within-sequence metrology based process tuning for adaptive self-aligned double patterningDAVIS MATTHEW F·Filed 2008·Granted Jul 31, 2012·8 cites·16 claims
- 1381US7969581B2Determining endpoint in a substrate processAPPLIED MATERIALS INC·Filed 2010·Granted Jun 28, 2011·3 cites·25 claims
- 1478US8257546B2Method and system for monitoring an etch processDAVIS MATTHEW FENTON·Filed 2003·Granted Sep 4, 2012·23 cites·37 claims
- 1574US7695987B2Method for automatic determination of semiconductor plasma chamber matching and source of fault by comprehensive plasma monitoringAPPLIED MATERILS INC·Filed 2006·Granted Apr 13, 2010·4 cites·15 claims
- 1674US7158221B2Method and apparatus for performing limited area spectral analysisAPPLIED MATERIALS INC·Filed 2003·Granted Jan 2, 2007·14 cites·24 claims
- 1773US7946759B2Substrate temperature measurement by infrared transmissionAPPLIED MATERIALS INC·Filed 2007·Granted May 24, 2011·4 cites·23 claims
- 1870US6685799B2Variable efficiency faraday shieldAPPLIED MATERIALS INC·Filed 2001·Granted Feb 3, 2004·16 cites·8 claims
- 1969US8486194B2Apparatus for efficient removal of halogen residues from etched substratesBHANG KENNETH J·Filed 2012·Granted Jul 16, 2013·3 cites·13 claims
- 2068US8130382B2Determining endpoint in a substrate processLIAN LEI·Filed 2011·Granted Mar 6, 2012·1 cites·20 claims
- 2168US7602484B2Method and apparatus for performing limited area spectral analysisAPPLIED MATERIALS INC·Filed 2007·Granted Oct 13, 2009·2 cites·20 claims
- 2267US7815812B2Method for controlling a process for fabricating integrated devicesAPPLIED MATERIALS INC·Filed 2006·Granted Oct 19, 2010·2 cites·19 claims
- 2356US8089046B2Method and apparatus for calibrating mass flow controllersDAVIS MATTHEW F·Filed 2008·Granted Jan 3, 2012·3 cites·15 claims
- 2456US7374696B2Method and apparatus for removing a halogen-containing residueAPPLIED MATERIALS INC·Filed 2004·Granted May 20, 2008·4 cites·31 claims
- 2555US8274645B2Method and apparatus for in-situ metrology of a workpiece disposed in a vacuum processing chamberDAVIS MATTHEW F·Filed 2009·Granted Sep 25, 2012·2 cites·19 claims
- 2654US7846347B2Method for removing a halogen-containing residueAPPLIED MATERIALS INC·Filed 2007·Granted Dec 7, 2010·0 cites·20 claims
- 2754US7393459B2Method for automatic determination of substrates states in plasma processing chambersAPPLIED MATERIALS INC·Filed 2004·Granted Jul 1, 2008·2 cites·27 claims
- 2846US2012291952A1Method and system for monitoring an etch processDAVIS MATTHEW FENTON·Filed 2012·Application pending·0 cites
- 2944US2009316749A1Substrate temperature measurement by infrared transmission in an etch processDAVIS MATTHEW FENTON·Filed 2008·Application pending·0 cites
- 3044US2010076729A1Self-diagnostic semiconductor equipmentAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 3142US2004200574A1Method for controlling a process for fabricating integrated devicesAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 3240US2009158265A1Implementation of advanced endpoint functions within third party software by using a plug-in approachDAVIS MATTHEW FENTON·Filed 2007·Application pending·0 cites
- 3339US2007249071A1Neural Network Methods and Apparatuses for Monitoring Substrate ProcessingLIAN LEI·Filed 2006·Application pending·0 cites
- 3438US2010224322A1Endpoint detection for a reactor chamber using a remote plasma chamberAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 3537US2004018647A1Method for controlling the extent of notch or undercut in an etched profile using optical reflectometryAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →