Inventor · disambiguated record
Mahmoud Dreiza
Also filed as: DREIZA MAHMOUD
20 granted patents·448 citations·filing 2005–2023
95Inventor score
Top patents by PatentIndex Score
20 records- 0198US9012789B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Apr 21, 2015·31 cites·20 claims
- 0298US8222538B1Stackable via package and methodYOSHIDA AKITO·Filed 2009·Granted Jul 17, 2012·91 cites·20 claims
- 0397US8471154B1Stackable variable height via package and methodYOSHIDA AKITO·Filed 2009·Granted Jun 25, 2013·71 cites·18 claims
- 0497US7960827B1Thermal via heat spreader package and methodAMKOR TECHNOLOGY INC·Filed 2009·Granted Jun 14, 2011·114 cites·14 claims
- 0595US9730327B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 8, 2017·10 cites·20 claims
- 0695US8704368B1Stackable via package and methodYOSHIDA AKITO·Filed 2012·Granted Apr 22, 2014·15 cites·16 claims
- 0795US8623753B1Stackable protruding via package and methodYOSHIDA AKITO·Filed 2009·Granted Jan 7, 2014·41 cites·21 claims
- 0893US10206285B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2018·Granted Feb 12, 2019·5 cites·20 claims
- 0990US9029962B1Molded cavity substrate MEMS package fabrication method and structureDREIZA MAHMOUD·Filed 2011·Granted May 12, 2015·29 cites·21 claims
- 1089US10034372B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 24, 2018·3 cites·20 claims
- 1189US7652361B1Land patterns for a semiconductor stacking structure and method thereforAMKOR TECHNOLOGY INC·Filed 2006·Granted Jan 26, 2010·20 cites·16 claims
- 1286US9346668B1Molded cavity substrate MEMS package fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2015·Granted May 24, 2016·6 cites·20 claims
- 1385US12035472B2Stackable via package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jul 9, 2024·0 cites·20 claims
- 1482US10257942B1Stackable variable height via package and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 9, 2019·5 cites·20 claims
- 1577US11700692B2Stackable via package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 11, 2023·0 cites·22 claims
- 1676US7429799B1Land patterns for a semiconductor stacking structure and method thereforAMKOR TECHNOLOGY INC·Filed 2005·Granted Sep 30, 2008·6 cites·20 claims
- 1774US11089685B2Stackable via package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 10, 2021·0 cites·20 claims
- 1867US10548221B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2019·Granted Jan 28, 2020·0 cites·20 claims
- 1960US7691745B1Land patterns for a semiconductor stacking structure and method thereforAMKOR TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·1 cites·20 claims
- 2049US8022521B1Package failure prognostic structure and methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Sep 20, 2011·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →