Inventor · disambiguated record
Manfred Engelhardt
Also filed as: ENGELHARDT MANFRED
70 granted patents·18 pending applications·783 citations·filing 1979–2018
98Inventor score
Top patents by PatentIndex Score
88 records- 0197US9627287B2Thinning in package using separation structure as stopINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 18, 2017·153 cites·13 claims
- 0296US6030900AProcess for generating a space in a structureSIEMENS AG·Filed 1996·Granted Feb 29, 2000·356 cites·17 claims
- 0389US10032670B2Plasma dicing of silicon carbideINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 24, 2018·6 cites·27 claims
- 0483US9679773B1Method for thermal annealing and a semiconductor device formed by the methodINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 13, 2017·3 cites·23 claims
- 0583US8338317B2Method for processing a semiconductor wafer or die, and particle deposition deviceENGELHARDT MANFRED·Filed 2011·Granted Dec 25, 2012·7 cites·19 claims
- 0680US6387773B1Method for fabricating trenches having hallows along the trenches side wall for storage capacitors of DRAM semiconductor memoriesINFINEON TECHNOLOGIES AG·Filed 2000·Granted May 14, 2002·22 cites·13 claims
- 0779US9219011B2Separation of chips on a substrateINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 22, 2015·3 cites·12 claims
- 0879US8093637B2MIM capacitor and associated production methodENGELHARDT MANFRED·Filed 2006·Granted Jan 10, 2012·8 cites·23 claims
- 0978US8361884B2Plasma dicing and semiconductor devices formed thereofINFINEON TECHNOLOGIES AG·Filed 2010·Granted Jan 29, 2013·3 cites·28 claims
- 1076US9391263B2Semiconductor devices having insulating substrates and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 12, 2016·2 cites·18 claims
- 1174US8906782B2Method of separating semiconductor die using material modificationENGELHARDT MANFRED·Filed 2012·Granted Dec 9, 2014·3 cites·15 claims
- 1273US7321097B2Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jan 22, 2008·16 cites·10 claims
- 1372US9006109B2Semiconductor devices and methods for manufacturing semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 14, 2015·2 cites·6 claims
- 1471US9275916B2Removable indicator structure in electronic chips of a common substrate for process adjustmentINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·2 cites·14 claims
- 1568US8877631B2Interconnect arrangement and associated production methodsENGELHARDT MANFRED·Filed 2011·Granted Nov 4, 2014·2 cites·10 claims
- 1667US10157765B2Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 18, 2018·1 cites·17 claims
- 1767US8462358B2Device for detecting movement and forcesBECKER FRANK·Filed 2007·Granted Jun 11, 2013·7 cites·12 claims
- 1866US9530618B2Plasma system, chuck and method of making a semiconductor deviceENGELHARDT MANFRED·Filed 2012·Granted Dec 27, 2016·1 cites·20 claims
- 1966US8575026B2Method of protecting sidewall surfaces of a semiconductor substrateENGELHARDT MANFRED·Filed 2011·Granted Nov 5, 2013·1 cites·20 claims
- 2063US6930052B2Method for producing an integrated circuit having at least one metalicized surfaceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 16, 2005·7 cites·10 claims
- 2160US8815706B2Methods of forming semiconductor devicesHIRSCHLER JOACHIM·Filed 2012·Granted Aug 26, 2014·1 cites·25 claims
- 2260US8158485B2Integrated circuit device having openings in a layered structureKOEHLER DANIEL·Filed 2007·Granted Apr 17, 2012·2 cites·45 claims
- 2360US6888244B2Interconnect arrangement and method for fabricating an interconnect arrangementINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 3, 2005·9 cites·22 claims
- 2459US9165895B2Method for separating a plurality of dies and a processing device for separating a plurality of diesBRUNNER HELMUT·Filed 2011·Granted Oct 20, 2015·2 cites·19 claims
- 2559US6864175B2Method for fabricating integrated circuit arrangements, and associated circuit arrangements, in particular tunnel contact elementsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 8, 2005·9 cites·13 claims
- 2659US4283849ACutting unit for a dry-shaving apparatusPHILIPS CORP·Filed 1979·Granted Aug 18, 1981·20 cites·3 claims
- 2758US10672716B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jun 2, 2020·0 cites·17 claims
- 2858US9608201B2Semiconductor devices having insulating substrates and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 28, 2017·0 cites·18 claims
- 2957US2017148981A1Semiconductor Devices Having Insulating Substrates and Methods of Formation ThereofINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 3056US10043683B2Plasma system, chuck and method of making a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 7, 2018·0 cites·21 claims
- 3156US9012325B2Method of protecting sidewall surfaces of a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 21, 2015·0 cites·19 claims
- 3256US6946386B2Process for producing ultrathin homogenous metal layersINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 20, 2005·3 cites·8 claims
- 3356US4275497AShaving apparatusPHILIPS CORP·Filed 1979·Granted Jun 30, 1981·18 cites·5 claims
- 3455US10622218B2Segmented edge protection shieldINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 14, 2020·0 cites·16 claims
- 3555US6730562B2Method of patterning ferroelectric layersINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 4, 2004·4 cites·36 claims
- 3654US6454956B1Structuring methodINFINEON TECHNOLOGIES AG·Filed 1998·Granted Sep 24, 2002·18 cites·33 claims
- 3753US10236204B2Semiconductor processing systemINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 19, 2019·0 cites·3 claims
- 3853US9490103B2Separation of chips on a substrateINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 8, 2016·0 cites·9 claims
- 3953US7045070B1Method of producing an electrode configuration and method of electrically contacting the electrode configurationINFINEON TECHNOLOGIES AG·Filed 2000·Granted May 16, 2006·4 cites·16 claims
- 4053US2015044856A1Method of separating semiconductor die using material modificationINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 4152US8993422B2Process tools and methods of forming devices using process toolsINFINEON TECHNOLOGIES AG·Filed 2012·Granted Mar 31, 2015·0 cites·24 claims
- 4252US8722514B2Semiconductor devices having insulating substrates and methods of formation thereofVON KOBLINSKI CARSTEN·Filed 2011·Granted May 13, 2014·0 cites·19 claims
- 4352US6296777B1Structuring processINFINEON TECHNOLOGIES AG·Filed 1998·Granted Oct 2, 2001·17 cites·22 claims
- 4451US10043640B2Process tools and methods of forming devices using process toolsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 7, 2018·0 cites·21 claims
- 4551US10020264B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 10, 2018·0 cites·17 claims
- 4651US9793129B2Segmented edge protection shieldINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 17, 2017·0 cites·13 claims
- 4751US9481563B2Semiconductor device having a micro-mechanical structureINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 1, 2016·0 cites·16 claims
- 4851US9030744B2Fabrication of micro lensesENGELHARDT MANFRED·Filed 2011·Granted May 12, 2015·0 cites·25 claims
- 4950US9455192B2Kerf preparation for backside metallizationINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 27, 2016·0 cites·20 claims
- 5050US6828680B2Integrated circuit configuration using spacers as a diffusion barrier and method of producing such an integrated circuit configurationINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 7, 2004·3 cites·11 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →