Inventor · disambiguated record
Masayuki Furumiya
Also filed as: FURUMIYA MASAYUKI
54 granted patents·3 pending applications·567 citations·filing 1993–2013
98Inventor score
Top patents by PatentIndex Score
57 records- 0194US8358009B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 22, 2013·15 cites·20 claims
- 0292US5844290ASolid state image pick-up device and method for manufacturing the sameNEC CORP·Filed 1997·Granted Dec 1, 1998·124 cites·5 claims
- 0389US6316814B1Solid imaging deviceNEC CORP·Filed 2000·Granted Nov 13, 2001·53 cites·10 claims
- 0483US6639293B2Solid-state imaging deviceNEC ELECTRONICS CORP·Filed 2001·Granted Oct 28, 2003·32 cites·11 claims
- 0581US6879234B2Semiconductor integrated circuitNEC ELECTRONICS CORP·Filed 2003·Granted Apr 12, 2005·29 cites·9 claims
- 0680US7973383B2Semiconductor integrated circuit device having a decoupling capacitorRENESAS ELECTRONICS CORP·Filed 2007·Granted Jul 5, 2011·7 cites·5 claims
- 0779US8604617B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Dec 10, 2013·5 cites·12 claims
- 0878US8330254B2Semiconductor deviceFURUMIYA MASAYUKI·Filed 2009·Granted Dec 11, 2012·6 cites·3 claims
- 0977US6525355B2Solid-state image sensor provided with divided photoelectric conversion partNEC CORP·Filed 2002·Granted Feb 25, 2003·15 cites·20 claims
- 1076US8338193B2Semiconductor deviceFURUMIYA MASAYUKI·Filed 2011·Granted Dec 25, 2012·2 cites·10 claims
- 1176US7663207B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Feb 16, 2010·7 cites·20 claims
- 1275US8350357B2Semiconductor device including an inductor that is inductively coupled to another inductorRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 8, 2013·4 cites·20 claims
- 1375US8188566B2Semiconductor integrated circuit deviceFURUMIYA MASAYUKI·Filed 2011·Granted May 29, 2012·3 cites·7 claims
- 1474US8310034B2Semiconductor deviceUCHIDA SHINICHI·Filed 2010·Granted Nov 13, 2012·5 cites·21 claims
- 1573US8039924B2Semiconductor device including capacitor element provided above wiring layer that includes wiring with an upper surface having protruding portionRENESAS ELECTRONICS CORP·Filed 2008·Granted Oct 18, 2011·4 cites·10 claims
- 1672US8373251B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 12, 2013·4 cites·8 claims
- 1770US7091576B2Inductor for semiconductor integrated circuit and method of fabricating the sameNEC ELECTRONICS CORP·Filed 2003·Granted Aug 15, 2006·14 cites·1 claims
- 1869US7705422B2Semiconductor device including metal-insulator-metal capacitor arrangementNEC ELECTRONICS CORP·Filed 2005·Granted Apr 27, 2010·3 cites·6 claims
- 1969US7256456B2SOI substrate and semiconductor integrated circuit deviceNEC ELECTRONICS CORP·Filed 2003·Granted Aug 14, 2007·13 cites·23 claims
- 2069US5858812AMethod for fabricating interline-transfer CCD image sensorNEC CORP·Filed 1997·Granted Jan 12, 1999·30 cites·3 claims
- 2167US7053165B2Semiconductor integrated circuit including an inductor and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2003·Granted May 30, 2006·14 cites·20 claims
- 2266US6333525B1Charge transfer apparatus and manufacture method thereofNEC CORP·Filed 2000·Granted Dec 25, 2001·12 cites·3 claims
- 2365US7414506B2Semiconductor integrated circuit and fabrication method thereofNEC ELECTRONICS CORP·Filed 2004·Granted Aug 19, 2008·12 cites·17 claims
- 2463US8013385B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Sep 6, 2011·2 cites·7 claims
- 2560US7935549B2Seminconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted May 3, 2011·0 cites·7 claims
- 2659US9123571B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 1, 2015·0 cites·14 claims
- 2758US7432551B2SOI semiconductor device including a guard ring regionNEC ELECTRONICS CORP·Filed 2006·Granted Oct 7, 2008·1 cites·7 claims
- 2858US6518605B1Solid state imaging pickup device and method for manufacturing the sameNEC CORP·Filed 2001·Granted Feb 11, 2003·8 cites·9 claims
- 2957US8633037B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Jan 21, 2014·0 cites·12 claims
- 3057US5637893AInterline-transfer CCD image sensor and method for fabricating the sameNEC CORP·Filed 1996·Granted Jun 10, 1997·19 cites·2 claims
- 3156US8841771B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 23, 2014·0 cites·12 claims
- 3256US6667499B1Solid-state image sensing device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2000·Granted Dec 23, 2003·6 cites·7 claims
- 3355US7095072B2Semiconductor device with wiring layers forming a capacitorNEC ELECTRONICS CORP·Filed 2004·Granted Aug 22, 2006·6 cites·20 claims
- 3453US7432170B2Semiconductor device and fabrication method thereofNEC ELECTRONICS CORP·Filed 2004·Granted Oct 7, 2008·5 cites·8 claims
- 3552US6744466B1Method of driving solid-state image sensorNEC ELECTRONICS CORP·Filed 1999·Granted Jun 1, 2004·15 cites·26 claims
- 3651US8378454B2Semiconductor device including metal-insulator-metal capacitor arrangementRENESAS ELECTRONICS CORP·Filed 2011·Granted Feb 19, 2013·0 cites·6 claims
- 3751US7361845B2Wiring line for high frequencyNEC ELECTRONICS CORP·Filed 2003·Granted Apr 22, 2008·4 cites·19 claims
- 3851US7288826B2Semiconductor integrated circuit deviceNEC ELECTRONICS CORP·Filed 2003·Granted Oct 30, 2007·3 cites·16 claims
- 3951US6252285B1Efficient inspection of light-gathering rate of microlens in solid state imaging deviceNEC CORP·Filed 1999·Granted Jun 26, 2001·15 cites·21 claims
- 4051US6097433ASolid state imaging apparatus having a plurality of metal wirings for supplying driving pulses to transfer electrodes of vertical CCD registersNEC CORP·Filed 1997·Granted Aug 1, 2000·17 cites·2 claims
- 4150US8089165B2Device comprising electrode padMORIYA TARO·Filed 2009·Granted Jan 3, 2012·0 cites·11 claims
- 4249US7986026B2Semiconductor device including metal-insulator-metal capacitor arrangementRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 26, 2011·0 cites·5 claims
- 4349US2007262383A1Soi substrate and semiconductor integrated ciruit deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 4448US8481399B2Method of manufacturing semiconductor device including capacitor element provided above wiring layer that includes wiring with an upper surface having protruding portionFURUMIYA MASAYUKI·Filed 2011·Granted Jul 9, 2013·0 cites·12 claims
- 4548US5742081ACharge transfer image pickup deviceNEC CORP·Filed 1995·Granted Apr 21, 1998·14 cites·14 claims
- 4647US8357990B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Jan 22, 2013·0 cites·28 claims
- 4747US2006231923A1Inductor for semiconductor integrated circuit and method of fabricating the sameNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 4846US7547976B2Electrode pad arrangement with open side for waste removalNEC ELECTRONICS CORP·Filed 2005·Granted Jun 16, 2009·0 cites·7 claims
- 4945US6465819B2Solid state imaging apparatus with transistors having different gate insulating film thickness and manufacturing method for the sameNEC CORP·Filed 1999·Granted Oct 15, 2002·11 cites·9 claims
- 5041US5323034ACharge transfer image pick-up deviceNEC CORP·Filed 1993·Granted Jun 21, 1994·8 cites·2 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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