Inventor · disambiguated record
Magali Gregoire
Also filed as: GREGOIRE MAGALI
6 granted patents·5 pending applications·0 citations·filing 2005–2024
65Inventor score
Files withST MICROELECTRONICS CROLLES 2 SAS8GREGOIRE MAGALI1ST MICROELECTRONICS INT NV1ST MICROELECTRONICS SA1
Top patents by PatentIndex Score
11 records- 0164US11610813B2Interconnection element and method of manufacturing the sameST MICROELECTRONICS CROLLES 2 SAS·Filed 2021·Granted Mar 21, 2023·0 cites·15 claims
- 0263US2023170260A1Siliciding methodST MICROELECTRONICS CROLLES 2 SAS·Filed 2023·Application pending·0 cites
- 0359US11152259B2Interconnection element and method of manufacturing the sameST MICROELECTRONICS CROLLES 2 SAS·Filed 2020·Granted Oct 19, 2021·0 cites·20 claims
- 0455US2024332376A1Integrated electronic device with an improved conductive contact structure and related manufacturing processST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0551US2024204029A1Image acquisition deviceST MICROELECTRONICS CROLLES 2 SAS·Filed 2023·Application pending·0 cites
- 0650US11222957B2Intermetallic compoundST MICROELECTRONICS CROLLES 2 SAS·Filed 2020·Granted Jan 11, 2022·0 cites·14 claims
- 0749US2019363021A1Siliciding methodST MICROELECTRONICS CROLLES 2 SAS·Filed 2019·Application pending·0 cites
- 0846US11322363B2Contacts for electronic componentST MICROELECTRONICS CROLLES 2 SAS·Filed 2020·Granted May 3, 2022·0 cites·15 claims
- 0945US2023326947A1Integrated circuit including a metal pillar in contact with a silicon region on an ohmic coupling region, and corresponding manufacturing methodST MICROELECTRONICS CROLLES 2 SAS·Filed 2023·Application pending·0 cites
- 1039US7531447B2Process for forming integrated circuit comprising copper linesST MICROELECTRONICS SA·Filed 2005·Granted May 12, 2009·0 cites·6 claims
- 1132US9257291B2Method for forming a silicide layer at the bottom of a hole and device for implementing said methodGREGOIRE MAGALI·Filed 2012·Granted Feb 9, 2016·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →