Inventor · disambiguated record
Maki Hasegawa
Also filed as: HASEGAWA MAKI
27 granted patents·6 pending applications·319 citations·filing 1996–2024
96Inventor score
Files withMITSUBISHI ELECTRIC CORP17FUJIFILM BUSINESS INNOVATION CORP9PROCTER & GAMBLE5AOYAMA SEISAKUSHO1UEMINAMI ATSUSHI1
Top patents by PatentIndex Score
33 records- 0195USD783550SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Apr 11, 2017·42 cites·1 claims
- 0293USD770994SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Nov 8, 2016·32 cites·1 claims
- 0392USD859334SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 10, 2019·32 cites·1 claims
- 0487USD777124SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jan 24, 2017·20 cites·1 claims
- 0587US9041456B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted May 26, 2015·10 cites·19 claims
- 0685USD864135SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Oct 22, 2019·19 cites·1 claims
- 0782US10566222B2Semiconductor device sorting system and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 18, 2020·3 cites·6 claims
- 0876USD772182SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Nov 22, 2016·13 cites·1 claims
- 0975US8481806B2Absorbent article having traverse reinforcing elementUEMINAMI ATSUSHI·Filed 2006·Granted Jul 9, 2013·11 cites·15 claims
- 1070US2025104845A1Information processing system, diagnostic system, information processing method, and non-transitory computer readable mediumFUJIFILM BUSINESS INNOVATION CORP·Filed 2024·Application pending·0 cites
- 1166US10305411B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted May 28, 2019·1 cites·12 claims
- 1266US5707193AScrew-fitting clip and object-engaging mechanism using the sameAOYAMA SEISAKUSHO·Filed 1996·Granted Jan 13, 1998·33 cites·11 claims
- 1363US11254122B1Image forming apparatusFUJIFILM BUSINESS INNOVATION CORP·Filed 2020·Granted Feb 22, 2022·0 cites·20 claims
- 1463US11186100B2Image processing apparatus and non-transitory computer readable mediumFUJIFILM BUSINESS INNOVATION CORP·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 1562US9655788B2Absorbent article having traverse reinforcing elementPROCTER & GAMBLE·Filed 2014·Granted May 23, 2017·1 cites·10 claims
- 1662US2025272825A1Information processing system, non-transitory computer readable medium storing program, and information processing methodFUJIFILM BUSINESS INNOVATION CORP·Filed 2024·Application pending·0 cites
- 1761US8878000B2Absorbent article having traverse reinforcing elementPROCTER & GAMBLE·Filed 2013·Granted Nov 4, 2014·1 cites·10 claims
- 1860US2025233077A1Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1956US2025104416A1Information processing system, information processing method, and non-transitory computer readable mediumFUJIFILM BUSINESS INNOVATION CORP·Filed 2024·Application pending·0 cites
- 2055US9716058B2Power module and control integrated circuitMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jul 25, 2017·0 cites·6 claims
- 2153US2024386229A1Information processing system and non-transitory computer readable mediumFUJIFILM BUSINESS INNOVATION CORP·Filed 2024·Application pending·0 cites
- 2251US10332869B2Method for manufacturing power moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jun 25, 2019·0 cites·7 claims
- 2350US2024305737A1Information processing apparatus, information processing system, and non-transitory computer readable medium storing programFUJIFILM BUSINESS INNOVATION CORP·Filed 2023·Application pending·0 cites
- 2449US11214057B2Ejection apparatus, ejection control device, and non-transitory computer readable medium storing program causing computer to execute process for controlling ejectionFUJIFILM BUSINESS INNOVATION CORP·Filed 2020·Granted Jan 4, 2022·0 cites·10 claims
- 2549US6168582B1Absorbent article wrapper comprising a side flap fastener coverPROCTER & GAMBLE·Filed 1996·Granted Jan 2, 2001·49 cites·10 claims
- 2647US11302569B2Method for manufacturing semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Apr 12, 2022·0 cites·6 claims
- 2744US10796979B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Oct 6, 2020·0 cites·17 claims
- 2843US11173736B2Image forming apparatusFUJIFILM BUSINESS INNOVATION CORP·Filed 2020·Granted Nov 16, 2021·0 cites·19 claims
- 2942US10074585B2Power module with dummy terminal structureMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Sep 11, 2018·0 cites·6 claims
- 3040US11069602B2Package and terminal arrangement for semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 20, 2021·0 cites·10 claims
- 3138US11257732B2Semiconductor module and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 22, 2022·0 cites·20 claims
- 3237US6312418B1Absorbent article wrapper comprising a side flap fastener coverPROCTER & GAMBLE·Filed 1998·Granted Nov 6, 2001·34 cites·20 claims
- 3334US6375645B1Absorbent article wrapper comprising a side flap fastener coverPROCTER & GAMBLE·Filed 1997·Granted Apr 23, 2002·18 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →