Inventor · disambiguated record
Matthias Heschel
Also filed as: HESCHEL MATTHIAS
15 granted patents·2 pending applications·774 citations·filing 1998–2025
95Inventor score
Top patents by PatentIndex Score
17 records- 0197US8044412B2Package for a light emitting elementTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 25, 2011·297 cites·55 claims
- 0297US6818464B2Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holesHYMITE AS·Filed 2002·Granted Nov 16, 2004·154 cites·14 claims
- 0394US7419853B2Method of fabrication for chip scale package for a micro componentHYMITE AS·Filed 2005·Granted Sep 2, 2008·37 cites·6 claims
- 0492US6088463ASolid state silicon-based condenser microphoneMICROTRONIC AS·Filed 1998·Granted Jul 11, 2000·163 cites·8 claims
- 0586US7057274B2Semiconductor structures having through-holes sealed with feed-through metalizationHYMITE AS·Filed 2004·Granted Jun 6, 2006·34 cites·10 claims
- 0683US8552460B2Package for a light emitting elementMURPHY THOMAS·Filed 2011·Granted Oct 8, 2013·6 cites·20 claims
- 0782USRE42347ESolid state silicon-based condenser microphoneEPCOS PTE LTD·Filed 2007·Granted May 10, 2011·11 cites·14 claims
- 0871US7253388B2Assembly with self-alignment features to position a cover on a substrate that supports a micro componentHYMITE AS·Filed 2004·Granted Aug 7, 2007·16 cites·17 claims
- 0968US7213978B2Optical device receiving substrate and optical device holding carrierHYMITE AS·Filed 2003·Granted May 8, 2007·15 cites·30 claims
- 1063USRE42346ESolid state silicon-based condenser microphoneEPCOS PTE LTD·Filed 2002·Granted May 10, 2011·9 cites·16 claims
- 1163US7732234B2Fabrication process for package with light emitting device on a sub-mountHYMITE AS·Filed 2007·Granted Jun 8, 2010·3 cites·36 claims
- 1262US7388285B2Hermetically sealed package for optical, electronic, opto-electronic and other devicesHYMITE AS·Filed 2006·Granted Jun 17, 2008·3 cites·20 claims
- 1362US7109580B2Hermetically sealed package for optical, electronic, opto-electronic and other devicesHYMITE AS·Filed 2004·Granted Sep 19, 2006·14 cites·15 claims
- 1456US7081412B2Double-sided etching technique for semiconductor structure with through-holesHYMITE AS·Filed 2004·Granted Jul 25, 2006·5 cites·14 claims
- 1554US2025248623A1Inserter assembly and methodUNOMEDICAL AS·Filed 2025·Application pending·0 cites
- 1653US7681306B2Method of forming an assembly to house one or more micro componentsHYMITE AS·Filed 2004·Granted Mar 23, 2010·7 cites·29 claims
- 1747US2008315390A1Chip Scale Package For A Micro ComponentKUHMANN JOCHEN·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →