Inventor · disambiguated record
Man-Kyo Jong
Also filed as: JONG MAN KYO
3 granted patents·5 pending applications·21 citations·filing 2008–2022
65Inventor score
Files withLIM SEUNG-WON3INFINEON TECHNOLOGIES AUSTRIA AG2FAIRCHILD KR SEMICONDUCTOR LTD1IM SEUNGWON1JONG MAN-KYO1
Top patents by PatentIndex Score
8 records- 0186US8552541B2Power device packages having thermal electric modules using peltier effect and methods of fabricating the sameIM SEUNGWON·Filed 2011·Granted Oct 8, 2013·15 cites·20 claims
- 0274US7863725B2Power device packages and methods of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Jan 4, 2011·6 cites·16 claims
- 0351US11848243B2Molded semiconductor package having a substrate with bevelled edgeINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Dec 19, 2023·0 cites·16 claims
- 0451US2024145325A1Semiconductor Package with Molded Heat Dissipation PlateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Application pending·0 cites
- 0545US2009243078A1Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the SameLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 0641US2011076804A1Power device packages and methods of fabricating the sameJONG MAN-KYO·Filed 2010·Application pending·0 cites
- 0740US2009243079A1Semiconductor device packageLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 0839US2009244848A1Power Device Substrates and Power Device Packages Including the SameLIM SEUNG-WON·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →