Inventor · disambiguated record
Masayuki Kumekawa
Also filed as: KUMEKAWA MASAYUKI · SHIRAKASHI MITSUHIKO
13 granted patents·11 pending applications·96 citations·filing 2000–2011
90Inventor score
Top patents by PatentIndex Score
24 records- 0184US7585205B2Substrate polishing apparatus and methodEBARA CORP·Filed 2007·Granted Sep 8, 2009·7 cites·23 claims
- 0284US6558518B1Method and apparatus for plating substrate and plating facilityEBARA CORP·Filed 2000·Granted May 6, 2003·36 cites·17 claims
- 0382US7101465B2Electrolytic processing device and substrate processing apparatusEBARA CORP·Filed 2003·Granted Sep 5, 2006·14 cites·62 claims
- 0468US7208076B2Substrate processing apparatus and methodEBARA CORP·Filed 2002·Granted Apr 24, 2007·10 cites·27 claims
- 0564US7976362B2Substrate polishing apparatus and methodEBARA CORP·Filed 2009·Granted Jul 12, 2011·1 cites·17 claims
- 0664US7638030B2Electrolytic processing apparatus and electrolytic processing methodEBARA CORP·Filed 2003·Granted Dec 29, 2009·3 cites·24 claims
- 0764US7166204B2Plating apparatus and methodEBARA CORP·Filed 2002·Granted Jan 23, 2007·4 cites·5 claims
- 0863US7083706B2Substrate processing apparatusEBARA CORP·Filed 2002·Granted Aug 1, 2006·9 cites·20 claims
- 0954US8133380B2Method for regenerating ion exchangerSAITO TAKAYUKI·Filed 2008·Granted Mar 13, 2012·0 cites·8 claims
- 1054US7655118B2Electrolytic processing apparatus and methodEBARA CORP·Filed 2003·Granted Feb 2, 2010·4 cites·13 claims
- 1154US6913514B2Chemical mechanical polishing endpoint detection system and methodEBARA TECH INC·Filed 2003·Granted Jul 5, 2005·5 cites·21 claims
- 1253US7569135B2Electrolytic processing apparatus and substrate processing apparatus and methodEBARA CORP·Filed 2007·Granted Aug 4, 2009·0 cites·14 claims
- 1353US7427345B2Method and device for regenerating ion exchanger, and electrolytic processing apparatusEBARA CORP·Filed 2002·Granted Sep 23, 2008·3 cites·36 claims
- 1448US2007034502A1Electrolytic processing apparatusKUMEKAWA MASAYUKI·Filed 2005·Application pending·0 cites
- 1547US2011237163A1Substrate polishing apparatus and methodKATSUOKA SEIJI·Filed 2011·Application pending·0 cites
- 1645US2007187259A1Substrate processing apparatus and methodKOBATA ITSUKI·Filed 2007·Application pending·0 cites
- 1743US2007034525A1Electrolytic processing methodKUMEKAWA MASAYUKI·Filed 2005·Application pending·0 cites
- 1841US2004206634A1Electrolytic processing apparatus and substrate processing apparatus and methodFiled 2003·Application pending·0 cites
- 1938US2006234508A1Substrate processing apparatus and substrate processing methodSHIRAKASHI MITSUHIKO·Filed 2003·Application pending·0 cites
- 2037US2005051432A1Electrolytic processing apparatus and methodFiled 2002·Application pending·0 cites
- 2137US2004256237A1Electrolytic processing apparatus and methodFiled 2002·Application pending·0 cites
- 2236US2003132103A1Electrolytic processing device and substrate processing apparatusFiled 2002·Application pending·0 cites
- 2336US2005115838A1Electrolytic processing apparatus and methodFiled 2003·Application pending·0 cites
- 2430US2006144711A1Electrochemical machining device and electrochemical machining methodKOBATA ITSUKI·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →