Inventor · disambiguated record
Max L. Lifson
Also filed as: LIFSON MAX L
18 granted patents·1 pending application·45 citations·filing 2013–2022
93Inventor score
Top patents by PatentIndex Score
19 records- 0195US9601606B2Integrated circuit heat dissipation using nanostructuresIBM·Filed 2016·Granted Mar 21, 2017·7 cites·17 claims
- 0294US10068827B2Integrated circuit heat dissipation using nanostructuresIBM·Filed 2017·Granted Sep 4, 2018·5 cites·16 claims
- 0394US9324628B2Integrated circuit heat dissipation using nanostructuresIBM·Filed 2014·Granted Apr 26, 2016·8 cites·12 claims
- 0493US10109553B2Integrated circuit heat dissipation using nanostructuresIBM·Filed 2017·Granted Oct 23, 2018·4 cites·17 claims
- 0591US10629710B2Integrated circuit heat dissipation using nanostructuresIBM·Filed 2018·Granted Apr 21, 2020·3 cites·18 claims
- 0688US10600893B2Integrated circuit heat dissipation using nanostructuresIBM·Filed 2018·Granted Mar 24, 2020·2 cites·16 claims
- 0786US9704978B2Integrated circuit heat dissipation using nanostructuresIBM·Filed 2016·Granted Jul 11, 2017·2 cites·17 claims
- 0886US9666701B2Integrated circuit heat dissipation using nanostructuresIBM·Filed 2016·Granted May 30, 2017·2 cites·18 claims
- 0982US10224225B2Centering substrates on a chuckIBM·Filed 2018·Granted Mar 5, 2019·2 cites·20 claims
- 1080US9997385B2Centering substrates on a chuckIBM·Filed 2017·Granted Jun 12, 2018·2 cites·19 claims
- 1179US9685362B2Apparatus and method for centering substrates on a chuckIBM·Filed 2014·Granted Jun 20, 2017·3 cites·24 claims
- 1276US9508578B2Method and apparatus for detecting foreign material on a chuckGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 29, 2016·3 cites·18 claims
- 1372US11152495B2Integrated circuit heat dissipation using nanostructuresIBM·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 1471US11081572B2Integrated circuit heat dissipation using nanostructuresIBM·Filed 2019·Granted Aug 3, 2021·0 cites·19 claims
- 1571US9275868B2Uniform roughness on backside of a waferIBM·Filed 2013·Granted Mar 1, 2016·2 cites·20 claims
- 1667US2022314183A13d printing of metal containing structuresCALIFORNIA INST OF TECHN·Filed 2022·Application pending·0 cites
- 1761US11318435B23D printing of metal containing structuresCALIFORNIA INST OF TECHN·Filed 2019·Granted May 3, 2022·0 cites·30 claims
- 1849US9312205B2Methods of forming a TSV wafer with improved fracture strengthIBM·Filed 2014·Granted Apr 12, 2016·0 cites·18 claims
- 1944US9607929B2Tsv wafer with improved fracture strengthIBM·Filed 2015·Granted Mar 28, 2017·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →