Inventor · disambiguated record
Masayoshi Minami
Also filed as: MINAMI MASAYOSHI
24 granted patents·3 pending applications·129 citations·filing 1996–2025
94Inventor score
Files withKOKUSAI ELECTRIC CORP14HITACHI INT ELECTRIC INC7YAZAKI CORP4HOKURIKU ELECT IND1YUASA KAZUHIRO1
Top patents by PatentIndex Score
27 records- 0190US11434564B2Method of manufacturing semiconductor device, substrate processing apparatus, recording medium and method of processing substrateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Sep 6, 2022·2 cites·20 claims
- 0290US10081868B2Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Sep 25, 2018·6 cites·19 claims
- 0390US5791084AMethod for making a gel of gel-coat seed easily disintegrableYAZAKI CORP·Filed 1997·Granted Aug 11, 1998·72 cites·6 claims
- 0489US9983074B2Force detectorHOKURIKU ELECT IND·Filed 2015·Granted May 29, 2018·7 cites·7 claims
- 0587US7972979B2Substrate processing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Granted Jul 5, 2011·8 cites·4 claims
- 0685US2025349533A1Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0784US12266522B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Apr 1, 2025·0 cites·17 claims
- 0883US10640869B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted May 5, 2020·3 cites·9 claims
- 0981US12406843B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Sep 2, 2025·0 cites·26 claims
- 1081US11361961B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 14, 2022·1 cites·17 claims
- 1181US9895727B2Method of manufacturing semiconductor device, method of cleaning interior of process chamber, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Feb 20, 2018·3 cites·21 claims
- 1278US2025201551A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1377US11915927B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 27, 2024·0 cites·19 claims
- 1473US11885016B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jan 30, 2024·0 cites·23 claims
- 1571US12195848B2Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jan 14, 2025·0 cites·22 claims
- 1671US11823886B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 21, 2023·0 cites·21 claims
- 1768US11728159B2Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 15, 2023·0 cites·26 claims
- 1867US8901013B2Substrate processing apparatus, method of processing substrate and method of manufacturing semiconductor deviceYUASA KAZUHIRO·Filed 2011·Granted Dec 2, 2014·2 cites·15 claims
- 1958US11618947B2Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 4, 2023·0 cites·19 claims
- 2058US11257669B2Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 22, 2022·0 cites·22 claims
- 2151USD791091SPattern waferHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 4, 2017·5 cites·1 claims
- 2245USD789311SPattern waferHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 13, 2017·4 cites·1 claims
- 2344US5706602AMethod for making a gel coat of gel-coat seed easily disintegrableYAZAKI CORP·Filed 1996·Granted Jan 13, 1998·9 cites·6 claims
- 2443US10066294B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Sep 4, 2018·0 cites·15 claims
- 2535US2011065286A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 2632US5701700AMethod for storing gel-coated seedsYAZAKI CORP·Filed 1996·Granted Dec 30, 1997·4 cites·5 claims
- 2731US5910281AMethod for restoring dried aqueous organic gel capsulesYAZAKI CORP·Filed 1996·Granted Jun 8, 1999·3 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →