Inventor · disambiguated record
Matthew D. Moon
Also filed as: MOON MATTHEW D · MOON MATTHEW DAVID
19 granted patents·3 pending applications·63 citations·filing 1999–2021
92Inventor score
Top patents by PatentIndex Score
22 records- 0182US10224225B2Centering substrates on a chuckIBM·Filed 2018·Granted Mar 5, 2019·2 cites·20 claims
- 0280US9997385B2Centering substrates on a chuckIBM·Filed 2017·Granted Jun 12, 2018·2 cites·19 claims
- 0380US7382055B2Integrated thin-film resistor with direct contactIBM·Filed 2007·Granted Jun 3, 2008·7 cites·6 claims
- 0479US9685362B2Apparatus and method for centering substrates on a chuckIBM·Filed 2014·Granted Jun 20, 2017·3 cites·24 claims
- 0577US7303972B2Integrated thin-film resistor with direct contactIBM·Filed 2006·Granted Dec 4, 2007·6 cites·16 claims
- 0671US9275868B2Uniform roughness on backside of a waferIBM·Filed 2013·Granted Mar 1, 2016·2 cites·20 claims
- 0768US9087839B2Semiconductor structures with metal linesIBM·Filed 2013·Granted Jul 21, 2015·2 cites·20 claims
- 0864US7301752B2Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmaskIBM·Filed 2004·Granted Nov 27, 2007·10 cites·12 claims
- 0962US9330988B1Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughnessIBM·Filed 2014·Granted May 3, 2016·1 cites·15 claims
- 1058US6340601B1Method for reworking copper metallurgy in semiconductor devicesIBM·Filed 1999·Granted Jan 22, 2002·26 cites·16 claims
- 1152US9059258B2Controlled metal extrusion opening in semiconductor structure and method of formingIBM·Filed 2013·Granted Jun 16, 2015·0 cites·14 claims
- 1251US9484301B2Controlled metal extrusion opening in semiconductor structure and method of formingGLOBALFOUNDRIES INC·Filed 2015·Granted Nov 1, 2016·0 cites·2 claims
- 1351US7511940B2Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmaskIBM·Filed 2007·Granted Mar 31, 2009·0 cites·13 claims
- 1450US9006703B2Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereofIBM·Filed 2013·Granted Apr 14, 2015·0 cites·12 claims
- 1547US9576863B2Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughnessIBM·Filed 2015·Granted Feb 21, 2017·0 cites·20 claims
- 1647US7682945B2Phase change element extension embedded in an electrodeIBM·Filed 2008·Granted Mar 23, 2010·2 cites·20 claims
- 1743US9390969B2Integrated circuit and interconnect, and method of fabricating sameGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 12, 2016·0 cites·18 claims
- 1842US2007158714A1One-mask high-k metal-insulator-metal capacitor integration in copper back-end-of-line processingIBM·Filed 2005·Application pending·0 cites
- 1937US2003146492A1Nitride etchstop film to protect metal-insulator-metal capacitor dielectric from degradation and method for making sameIBM·Filed 2002·Application pending·0 cites
- 2036US8450168B2Ferro-electric capacitor modules, methods of manufacture and design structuresGAMBINO JEFFREY P·Filed 2010·Granted May 28, 2013·0 cites·15 claims
- 2136US2012086101A1Integrated circuit and interconnect, and method of fabricating sameDEMUYNCK DAVID A·Filed 2010·Application pending·0 cites
- 2233US11562519B1System and method for creating and delivering handwritten greeting cardsFELT INC·Filed 2021·Granted Jan 24, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →