Inventor · disambiguated record
Masatake Nakano
Also filed as: NAKANO MASATAKE
19 granted patents·1 pending application·438 citations·filing 1992–2016
95Inventor score
Top patents by PatentIndex Score
20 records- 0195US6596610B1Method for reclaiming delaminated wafer and reclaimed delaminated waferSHINETSU HANDOTAI KK·Filed 2000·Granted Jul 22, 2003·108 cites·1 claims
- 0284US6004866AMethod for manufacturing bonded wafer and bonded wafer manufactured therebySHINETSU HANDOTAI KK·Filed 1997·Granted Dec 21, 1999·73 cites·20 claims
- 0381US11056381B2Method for producing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2016·Granted Jul 6, 2021·3 cites·6 claims
- 0480US6720640B2Method for reclaiming delaminated wafer and reclaimed delaminated waferSHINETSU HANDOTAI KK·Filed 2003·Granted Apr 13, 2004·25 cites·12 claims
- 0576US7565186B2Portable information processing apparatusSHARP KK·Filed 2008·Granted Jul 21, 2009·5 cites·48 claims
- 0676US7186628B2Method of manufacturing an SOI wafer where COP's are eliminated within the base waferSHINETSU HANDOTAI KK·Filed 2003·Granted Mar 6, 2007·18 cites·16 claims
- 0775US6959854B2Production method for bonded substratesSHINETSU HANDOTAI KK·Filed 2002·Granted Nov 1, 2005·17 cites·18 claims
- 0874US6900113B2Method for producing bonded wafer and bonded waferSHINETSU HANDOTAI KK·Filed 2001·Granted May 31, 2005·21 cites·11 claims
- 0971US10460983B2Method for manufacturing a bonded SOI waferSHINETSU HANDOTAI KK·Filed 2015·Granted Oct 29, 2019·2 cites·1 claims
- 1071US7359740B2Portable information processing apparatusSHARP KK·Filed 2003·Granted Apr 15, 2008·11 cites·49 claims
- 1167US6797632B1Bonded wafer producing method and bonded waferSHINETSU HANDOTAI KK·Filed 2000·Granted Sep 28, 2004·15 cites·6 claims
- 1267US5427052AMethod and apparatus for production of extremely thin SOI film substrateSHINETSU HANDOTAI KK·Filed 1992·Granted Jun 27, 1995·36 cites·4 claims
- 1365US6239004B1Method of forming oxide film on an SOI layer and method of fabricating a bonded waferSHINETSU HANDOTAI KK·Filed 1998·Granted May 29, 2001·30 cites·10 claims
- 1464US7531425B2Method of fabricating bonded waferSHINETSU HANDOTAI KK·Filed 2002·Granted May 12, 2009·10 cites·2 claims
- 1557US5376215AApparatus for production of extremely thin SOI film substrateSHINETSU HANDOTAI KK·Filed 1993·Granted Dec 27, 1994·23 cites·3 claims
- 1655US5240883AMethod of fabricating soi substrate with uniform thin silicon filmSHINETSU HANDOTAI KK·Filed 1992·Granted Aug 31, 1993·25 cites·11 claims
- 1748US8466538B2SOI wafer, semiconductor device, and method for manufacturing SOI waferISHIZUKA TOHRU·Filed 2009·Granted Jun 18, 2013·0 cites·5 claims
- 1848US6534384B2Method for manufacturing SOI wafer including heat treatment in an oxidizing atmosphereSHINETSU HANDOTAI KK·Filed 1999·Granted Mar 18, 2003·16 cites·12 claims
- 1943US2006152600A1Mobile telephone deviceHAMADA HIROAKI·Filed 2004·Application pending·0 cites
- 2038US10424484B2Method for manufacturing a bonded SOI waferSHINETSU HANDOTAI KK·Filed 2016·Granted Sep 24, 2019·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →