Inventor · disambiguated record
Mary E. Rothwell
Also filed as: ROTHWELL MARY E · ROTHWELL MARY ELIZABETH
19 granted patents·1 pending application·280 citations·filing 2000–2020
95Inventor score
Files withIBM14HEDRICK JAMES L2PURUSHOTHAMAN SAMPATH2CORCOLES GONZALEZ ANTONIO D1INTELLECTUAL BUSINESS MACHINES1
Top patents by PatentIndex Score
20 records- 0197US9520547B2Chip mode isolation and cross-talk reduction through buried metal layers and through-viasIBM·Filed 2013·Granted Dec 13, 2016·28 cites·6 claims
- 0297US9397283B2Chip mode isolation and cross-talk reduction through buried metal layers and through-viasIBM·Filed 2015·Granted Jul 19, 2016·24 cites·15 claims
- 0395US9455392B2Method of fabricating a coplanar waveguide device including removal of spurious microwave modes via flip-chip crossoverIBM·Filed 2015·Granted Sep 27, 2016·12 cites·3 claims
- 0495US9219298B2Removal of spurious microwave modes via flip-chip crossoverIBM·Filed 2013·Granted Dec 22, 2015·14 cites·9 claims
- 0595US9177814B2Suspended superconducting qubitsIBM·Filed 2013·Granted Nov 3, 2015·17 cites·5 claims
- 0695US8093099B2Lock and key through-via method for wafer level 3D integration and structures producedPURUSHOTHAMAN SAMPATH·Filed 2010·Granted Jan 10, 2012·27 cites·10 claims
- 0794US7855455B2Lock and key through-via method for wafer level 3 D integration and structures producedIBM·Filed 2008·Granted Dec 21, 2010·35 cites·7 claims
- 0890US9994741B2Enhanced adhesive materials and processes for 3D applicationsHEDRICK JAMES L·Filed 2015·Granted Jun 12, 2018·7 cites·5 claims
- 0990US8954125B2Low-loss superconducting devicesCORCOLES GONZALEZ ANTONIO D·Filed 2011·Granted Feb 10, 2015·38 cites·20 claims
- 1087US9531055B2Removal of spurious microwave modes via flip-chip crossoverIBM·Filed 2015·Granted Dec 27, 2016·4 cites·11 claims
- 1187US6380101B1Method of forming patterned indium zinc oxide and indium tin oxide films via microcontact printing and uses thereofIBM·Filed 2000·Granted Apr 30, 2002·51 cites·19 claims
- 1281US10008655B2Suspended superconducting qubitsIBM·Filed 2015·Granted Jun 26, 2018·2 cites·5 claims
- 1379US9064717B2Lock and key through-via method for wafer level 3D integration and structures produced therebyPURUSHOTHAMAN SAMPATH·Filed 2009·Granted Jun 23, 2015·8 cites·16 claims
- 1476US9716219B2Suspended superconducting qubitsIBM·Filed 2013·Granted Jul 25, 2017·2 cites·6 claims
- 1569US6632536B2Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displaysIBM·Filed 2000·Granted Oct 14, 2003·9 cites·13 claims
- 1667US11168234B2Enhanced adhesive materials and processes for 3D applicationsIBM·Filed 2020·Granted Nov 9, 2021·0 cites·8 claims
- 1759US11683995B2Lithography for fabricating Josephson junctionsIBM·Filed 2020·Granted Jun 20, 2023·0 cites·19 claims
- 1858US10767084B2Enhanced adhesive materials and processes for 3D applicationsIBM·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 1944US6890599B2Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displaysINTELLECTUAL BUSINESS MACHINES·Filed 2003·Granted May 10, 2005·2 cites·10 claims
- 2039US2019378781A1Enhanced adhesive materials and processes for 3d applicationsHEDRICK JAMES L·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →