Inventor · disambiguated record
Masato Shinada
Also filed as: SHINADA MASATO
15 granted patents·6 pending applications·5 citations·filing 2015–2024
84Inventor score
Top patents by PatentIndex Score
21 records- 0195US11823879B2Film formation apparatus and film formation methodTOKYO ELECTRON LTD·Filed 2022·Granted Nov 21, 2023·3 cites·7 claims
- 0281US11939665B2Film thickness measuring apparatus and film thickness measuring method, and film forming system and film forming methodTOKYO ELECTRON LTD·Filed 2021·Granted Mar 26, 2024·1 cites·28 claims
- 0381US11542592B2Film forming system and method for forming film on substrateTOKYO ELECTRON LTD·Filed 2019·Granted Jan 3, 2023·1 cites·3 claims
- 0475US12437976B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2024·Granted Oct 7, 2025·0 cites·14 claims
- 0567US12463022B2Placing table and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Granted Nov 4, 2025·0 cites·11 claims
- 0661US2023349036A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0760US11742190B2Sputtering apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2021·Granted Aug 29, 2023·0 cites·12 claims
- 0860US2023249306A1Method and apparatus for processing substrateTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0959US2024360543A1Film-forming apparatus, and method for cleaning film-forming apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1057US11851750B2Apparatus and method for performing sputtering processTOKYO ELECTRON LTD·Filed 2021·Granted Dec 26, 2023·0 cites·15 claims
- 1155US12002667B2Sputtering apparatus and method of controlling sputtering apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jun 4, 2024·0 cites·13 claims
- 1254US2023051865A1Pvd apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1353US12315707B2Mounting table structure, substrate processing apparatus, and method of controlling substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted May 27, 2025·0 cites·15 claims
- 1453US12261078B2Processing method and processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Mar 25, 2025·0 cites·11 claims
- 1553US2025122625A1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1649US11581171B2Cathode unit and film forming apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Feb 14, 2023·0 cites·11 claims
- 1749US2022081757A1Film forming apparatus, film forming system, and film forming methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1845US9368331B2Sputtering apparatusCANON ANELVA CORP·Filed 2015·Granted Jun 14, 2016·0 cites·5 claims
- 1943US11664207B2Film-forming apparatus, film-forming system, and film-forming methodTOKYO ELECTRON LTD·Filed 2019·Granted May 30, 2023·0 cites·10 claims
- 2043US11512388B2Film forming apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2019·Granted Nov 29, 2022·0 cites·7 claims
- 2142US11495446B2Film formation device and film formation methodTOKYO ELECTRON LTD·Filed 2019·Granted Nov 8, 2022·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →