Inventor · disambiguated record
Masato Terasaki
Also filed as: TERASAKI MASATO
24 granted patents·4 pending applications·1,262 citations·filing 1996–2024
96Inventor score
Technology areasH10P
Files withHITACHI INT ELECTRIC INC19KOKUSAI ELECTRIC CORP6KOKUSAI ELECTRIC CO LTD1TERASAKI MASATO1YUASA KAZUHIRO1
Top patents by PatentIndex Score
28 records- 0198US9190264B2Method of manufacturing semiconductor device, method of processing substrate and non-transitory computer readable recording mediumYUASA KAZUHIRO·Filed 2012·Granted Nov 17, 2015·479 cites·19 claims
- 0295US6194037B1Method of plasma processing a substrate placed on a substrate tableKOKUSAI ELECTRIC CO LTD·Filed 1996·Granted Feb 27, 2001·589 cites·22 claims
- 0390US10081868B2Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Sep 25, 2018·6 cites·19 claims
- 0487USD725055SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Mar 24, 2015·36 cites·1 claims
- 0586USD739832SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Sep 29, 2015·34 cites·1 claims
- 0685US10840094B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Nov 17, 2020·4 cites·19 claims
- 0784US10513775B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 24, 2019·4 cites·14 claims
- 0884USD711843SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Aug 26, 2014·30 cites·1 claims
- 0982US9006116B2Method of manufacturing semiconductor device, substrate processing method and substrate processing apparatusTERASAKI MASATO·Filed 2012·Granted Apr 14, 2015·8 cites·14 claims
- 1082US7795157B2Substrate treatment device and manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2007·Granted Sep 14, 2010·9 cites·17 claims
- 1178US10607833B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 31, 2020·2 cites·15 claims
- 1277US9401272B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jul 26, 2016·3 cites·17 claims
- 1375USD719114SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Dec 9, 2014·19 cites·1 claims
- 1470US11462401B2Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 4, 2022·2 cites·21 claims
- 1569US10513774B2Substrate processing apparatus and guide portionHITACHI INT ELECTRIC INC·Filed 2016·Granted Dec 24, 2019·1 cites·11 claims
- 1669US9905413B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Feb 27, 2018·1 cites·13 claims
- 1767USD720707SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Jan 6, 2015·14 cites·1 claims
- 1865US9934960B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Apr 3, 2018·1 cites·18 claims
- 1964USD773609SReturn nozzleHITACHI INT ELECTRIC INC·Filed 2015·Granted Dec 6, 2016·10 cites·1 claims
- 2061US2025003068A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2159USD771772SReturn nozzleHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 15, 2016·8 cites·1 claims
- 2255US12148611B2Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 2355US11972934B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 30, 2024·0 cites·21 claims
- 2453US2018363137A1Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Application pending·0 cites
- 2551US10714336B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jul 14, 2020·0 cites·12 claims
- 2639USD771543SReturn nozzleHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 15, 2016·2 cites·1 claims
- 2739US2019127848A1Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 2836US2002192984A1Method for manufacturing semiconductor device, method for processing substrate, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Masato Terasaki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →