Inventor · disambiguated record
Matthew Thorum
Also filed as: THORUM MATTHEW · THORUM MATTHEW S · THORUM MATTHEW S S · Thorum Matthew Sherman
26 granted patents·5 pending applications·23 citations·filing 2013–2025
93Inventor score
Top patents by PatentIndex Score
31 records- 0186US9435049B2Alkaline pretreatment for electroplatingLAM RES CORP·Filed 2013·Granted Sep 6, 2016·8 cites·19 claims
- 0285US10508359B2TSV bath evaluation using field versus feature contrastLAM RES CORP·Filed 2017·Granted Dec 17, 2019·1 cites·20 claims
- 0385US9617648B2Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon viasLAM RES CORP·Filed 2015·Granted Apr 11, 2017·5 cites·18 claims
- 0480US10475656B2Hydrosilylation in semiconductor processingMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 12, 2019·2 cites·25 claims
- 0578US9816196B2Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2013·Granted Nov 14, 2017·1 cites·19 claims
- 0676US10784101B2Using sacrificial solids in semiconductor processingMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 22, 2020·1 cites·7 claims
- 0776US2025132248A1Memory devices including staircase structuresMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0875US9689083B2TSV bath evaluation using field versus feature contrastLAM RES CORP·Filed 2014·Granted Jun 27, 2017·3 cites·24 claims
- 0974US12507392B2Multiple, alternating epitaxial siliconMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 1074US10094038B2Monitoring electrolytes during electroplatingLAM RES CORP·Filed 2015·Granted Oct 9, 2018·1 cites·19 claims
- 1173US11600485B2Using sacrificial solids in semiconductor processingMICRON TECHNOLOGY INC·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 1271US10957530B2Freezing a sacrificial material in forming a semiconductorMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 23, 2021·1 cites·13 claims
- 1371US10774438B2Monitoring electrolytes during electroplatingLAM RES CORP·Filed 2018·Granted Sep 15, 2020·0 cites·16 claims
- 1468US12237013B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 25, 2025·0 cites·37 claims
- 1568US11791152B2Residue removal during semiconductor device formationMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 17, 2023·0 cites·17 claims
- 1667US11482409B2Freezing a sacrificial material in forming a semiconductorMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 25, 2022·0 cites·20 claims
- 1766US12191249B2Microelectronic devices including staircase structures, and related memory devices, electronic systems, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 7, 2025·0 cites·24 claims
- 1865US12322585B2Sublimation in forming a semiconductorMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 3, 2025·0 cites·10 claims
- 1965US12041779B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 16, 2024·0 cites·18 claims
- 2065US2025157537A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2164US10937644B2Using sacrificial solids in semiconductor processingMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 2, 2021·0 cites·12 claims
- 2263US10825686B2Hydrosilylation in semiconductor processingMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 2363US2018030611A1Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2017·Application pending·0 cites
- 2460US11296103B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 5, 2022·0 cites·26 claims
- 2560US2025254955A1Memory architectures with replacement gate through piersMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2656US11037779B2Gas residue removalMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 15, 2021·0 cites·10 claims
- 2756US10964525B2Removing a sacrificial material via sublimation in forming a semiconductorMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 30, 2021·0 cites·24 claims
- 2855US10943907B2Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitryMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 9, 2021·0 cites·15 claims
- 2952US10707211B2Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitryMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 7, 2020·0 cites·26 claims
- 3050US11495610B2Integrated circuitry, a method used in forming integrated circuitry, and a method used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 8, 2022·0 cites·43 claims
- 3141US2016355939A1Polarization stabilizer additive for electroplatingLAM RES CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →