Inventor · disambiguated record
Matthew R. Whalen
Also filed as: WHALEN MATTHEW R
7 granted patents·2 pending applications·20 citations·filing 2003–2011
80Inventor score
Technology areasH10P
Top patents by PatentIndex Score
9 records- 0168US7348216B2Rework process for removing residual UV adhesive from C4 wafer surfacesIBM·Filed 2005·Granted Mar 25, 2008·3 cites·10 claims
- 0264US7771560B2Methods to prevent ECC (edge chipping and cracking) damage during die picking processIBM·Filed 2007·Granted Aug 10, 2010·2 cites·18 claims
- 0363US7387911B2Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and crackingIBM·Filed 2004·Granted Jun 17, 2008·10 cites·14 claims
- 0457US7288465B2Semiconductor wafer front side protectionIBM·Filed 2005·Granted Oct 30, 2007·1 cites·9 claims
- 0548US2008099149A1Rework process for removing residual uv adhesive from c4 wafer surfacesIBM·Filed 2008·Application pending·0 cites
- 0647US7001827B2Semiconductor wafer front side protectionIBM·Filed 2003·Granted Feb 21, 2006·3 cites·7 claims
- 0747US2008064185A1Semiconductor wafer front side protectionIBM·Filed 2007·Application pending·0 cites
- 0844US7902682B2Ultraviolet energy curable tape and method of making a semiconductor chip using the tapeIBM·Filed 2003·Granted Mar 8, 2011·1 cites·22 claims
- 0940US8163602B2Ultraviolet energy curable tape and method of making a semiconductor chip using the tapeKRYWANCZYK TIMOTHY C·Filed 2011·Granted Apr 24, 2012·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →