Inventor · disambiguated record
Martin Zgaga
Also filed as: ZGAGA MARTIN
16 granted patents·1 pending application·74 citations·filing 2012–2018
90Inventor score
Top patents by PatentIndex Score
17 records- 0197US9496193B1Semiconductor chip with structured sidewallsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 15, 2016·38 cites·23 claims
- 0294US9673096B2Method for processing a semiconductor substrate and a method for processing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 6, 2017·22 cites·17 claims
- 0375US9257342B2Methods of singulating substrates to form semiconductor devices using dummy materialINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 9, 2016·2 cites·22 claims
- 0474US9610543B2Method for simultaneous structuring and chip singulationINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 4, 2017·2 cites·17 claims
- 0572US9006109B2Semiconductor devices and methods for manufacturing semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 14, 2015·2 cites·6 claims
- 0672US8748297B2Methods of forming semiconductor devices by singulating a substrate by removing a dummy fill materialSTRANZL GUDRUN·Filed 2012·Granted Jun 10, 2014·3 cites·28 claims
- 0769US9139427B2Methods for producing a cavity within a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 22, 2015·2 cites·11 claims
- 0867US10157765B2Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 18, 2018·1 cites·17 claims
- 0964US8871550B2Method for processing a wafer at unmasked areas and previously masked areas to reduce a wafer thicknessGRILLE THOMAS·Filed 2012·Granted Oct 28, 2014·2 cites·25 claims
- 1058US10672716B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jun 2, 2020·0 cites·17 claims
- 1157US10005659B2Method for simultaneous structuring and chip singulationINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 26, 2018·0 cites·20 claims
- 1255US9741618B2Methods of forming semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 22, 2017·0 cites·23 claims
- 1351US10020264B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 10, 2018·0 cites·17 claims
- 1451US9481563B2Semiconductor device having a micro-mechanical structureINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 1, 2016·0 cites·16 claims
- 1549US2015147850A1Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 1646US9708182B2Methods for producing a cavity within a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 18, 2017·0 cites·12 claims
- 1744US8772133B2Utilization of a metallization scheme as an etching maskENGELHARDT MANFRED·Filed 2012·Granted Jul 8, 2014·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →