Inventor · disambiguated record
Meng-Tse Chen
Also filed as: CHEN MENG · CHEN MENG-TSE
94 granted patents·9 pending applications·382 citations·filing 2001–2024
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD62CHEN MENG-TSE15TAIWAN SEMICONDUCTOR MFG13APPLE INC3HUANG KUEI-WEI2
Top patents by PatentIndex Score
103 records- 0198US9818729B1Package-on-package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·35 cites·20 claims
- 0298US9418971B2Package-on-package structure including a thermal isolation material and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 16, 2016·42 cites·20 claims
- 0397US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 0496US10276541B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 30, 2019·12 cites·22 claims
- 0596US9859229B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·16 cites·20 claims
- 0696US8975741B2Process for forming package-on-package structuresLIN CHIH-WEI·Filed 2011·Granted Mar 10, 2015·21 cites·20 claims
- 0795US10468355B2EMI Shielding structure in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·12 cites·20 claims
- 0895US9847317B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 19, 2017·16 cites·20 claims
- 0992US9666572B2Process for forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·6 cites·20 claims
- 1092US9425178B2RDL-first packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·13 cites·20 claims
- 1191US11705409B2Semiconductor device having antenna on chip package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 1291US9349663B2Package-on-package structure having polymer-based material for warpage controlCHEN MENG-TSE·Filed 2012·Granted May 24, 2016·9 cites·20 claims
- 1391US9219030B2Package on package structures and methods for forming the sameYU CHEN-HUA·Filed 2012·Granted Dec 22, 2015·9 cites·16 claims
- 1489US9117816B2Process for forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Aug 25, 2015·5 cites·20 claims
- 1588US10950556B2EMI shielding structure in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·4 cites·20 claims
- 1688US10283377B1Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·6 cites·13 claims
- 1787US11264342B2Package on package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·2 cites·20 claims
- 1887US9711470B2Package on package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 18, 2017·4 cites·20 claims
- 1987US9269687B2Packaging methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·7 cites·18 claims
- 2085US11121104B2Method for manufacturing interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 14, 2021·3 cites·18 claims
- 2185US10043778B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 7, 2018·3 cites·20 claims
- 2285US9397062B2Package on package bonding structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 19, 2016·5 cites·20 claims
- 2384US9627355B2Package-on-package structure having polymer-based material for warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·3 cites·20 claims
- 2484US9484285B2Interconnect structures for wafer level package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·6 cites·20 claims
- 2584US8928134B2Package on package bonding structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 6, 2015·5 cites·20 claims
- 2684US8603860B2Process for forming packagesCHEN MENG-TSE·Filed 2011·Granted Dec 10, 2013·7 cites·20 claims
- 2783US9881888B2Manufacturing method of interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·3 cites·20 claims
- 2883US9691726B2Methods for forming fan-out package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 27, 2017·6 cites·19 claims
- 2983US9312214B2Semiconductor packages having polymer-containing substrates and methods of forming sameCHEN MENG-TSE·Filed 2011·Granted Apr 12, 2016·7 cites·20 claims
- 3082US10879203B2Stud bump structure for semiconductor package assembliesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 29, 2020·3 cites·20 claims
- 3182US9768137B2Stud bump structure for semiconductor package assembliesCHEN MENG-TSE·Filed 2012·Granted Sep 19, 2017·5 cites·18 claims
- 3282US9412717B2Apparatus and methods for molded underfills in flip chip packagingCHEN MENG-TSE·Filed 2011·Granted Aug 9, 2016·6 cites·20 claims
- 3381US10510719B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 3481US10192804B2Bump-on-trace packaging structure and method for forming the sameCHEN MENG TSE·Filed 2012·Granted Jan 29, 2019·5 cites·19 claims
- 3581US9627369B2Packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 18, 2017·3 cites·20 claims
- 3681US9082636B2Packaging methods and structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 14, 2015·4 cites·20 claims
- 3780US12057415B2Semiconductor device having antenna and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 3880US10818614B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·2 cites·20 claims
- 3980US10468377B2Device package including molding compound having non-planar top surface around a dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·2 cites·21 claims
- 4080US8664040B2Exposing connectors in packages through selective treatmentYU CHEN-HUA·Filed 2011·Granted Mar 4, 2014·4 cites·14 claims
- 4179US12009345B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 4279US9786631B2Device package with reduced thickness and method for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 10, 2017·3 cites·20 claims
- 4379US9673182B2Package on package bonding structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 6, 2017·2 cites·20 claims
- 4479US9508703B2Stacked dies with wire bonds and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 29, 2016·4 cites·20 claims
- 4579US8609462B2Methods for forming 3DIC packageCHEN MENG-TSE·Filed 2011·Granted Dec 17, 2013·4 cites·20 claims
- 4678US9331038B2Semiconductor interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 3, 2016·3 cites·17 claims
- 4778US2023378153A1Package-on-Package Structure Including a Thermal Isolation MaterialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4877US11390000B2Wafer level transfer molding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
- 4976US10559546B2Package on package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 11, 2020·1 cites·18 claims
- 5075US9030022B2Packages and methods for forming the sameCHEN MENG-TSE·Filed 2011·Granted May 12, 2015·3 cites·20 claims
Showing the top 50 of 103 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →