Inventor · disambiguated record
Meng-Wei Chou
Also filed as: CHOU MENG-WEI
24 granted patents·5 pending applications·104 citations·filing 2010–2024
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD24LIU CHUNG-SHI2CHOU MENG-WEI1LIN CHENG-CHUNG1LIN CHIH-WEI1
Top patents by PatentIndex Score
29 records- 0198US11527474B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·8 cites·20 claims
- 0298US11380666B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·5 cites·20 claims
- 0396US11075151B2Fan-out package with controllable standoffTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·12 cites·20 claims
- 0496US10790162B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·14 cites·20 claims
- 0595US8823166B2Pillar bumps and process for making sameLIN CHENG-CHUNG·Filed 2010·Granted Sep 2, 2014·25 cites·10 claims
- 0694US10304700B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 28, 2019·10 cites·24 claims
- 0792US12094728B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·1 cites·20 claims
- 0892US8609526B2Preventing UBM oxidation in bump formation processesLIU CHUNG-SHI·Filed 2010·Granted Dec 17, 2013·16 cites·20 claims
- 0990US11296065B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·2 cites·20 claims
- 1089US11901307B2Semiconductor device including electromagnetic interference (EMI) shielding and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 13, 2024·2 cites·20 claims
- 1184US12199084B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 1282US9449931B2Pillar bumps and process for making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·4 cites·20 claims
- 1379US12300592B2Fan-out package with controllable standoffTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1479US2024379646A1Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1577US11855059B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1677US2025087598A1Semiconductor device including electromagnetic interference (emi) shielding and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1776US2024395566A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1875US10804254B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·1 cites·20 claims
- 1972US12170274B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 17, 2024·0 cites·20 claims
- 2072US11854955B2Fan-out package with controllable standoffTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2170US11699598B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 11, 2023·0 cites·20 claims
- 2266US8865585B2Method of forming post passivation interconnectsCHOU MENG-WEI·Filed 2012·Granted Oct 21, 2014·3 cites·20 claims
- 2364US2025385157A1Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2463US12074104B2Integrated circuit packages with ring-shaped substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 2561US10128206B2Conductive pillar structureLIN CHIH WEI·Filed 2010·Granted Nov 13, 2018·1 cites·20 claims
- 2658US12191261B2Semiconductor device including electromagnetic interference (EMI) shielding and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 2758US10867811B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 2841US11682599B2Chip package structure with molding layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 20, 2023·0 cites·14 claims
- 2938US2012009777A1UBM Etching MethodsLIU CHUNG-SHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →