Inventor · disambiguated record
Ming-Da Cheng
Also filed as: CHENG MING-DA
402 granted patents·72 pending applications·1,607 citations·filing 2008–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD366TAIWAN SEMICONDUCTOR MFG44CHEN MENG-TSE15CHENG MING-DA9LU WEN-HSIUNG8
Top patents by PatentIndex Score
474 records- 0199US9899248B2Method of forming semiconductor packages having through package viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·73 cites·20 claims
- 0298US10157849B2Packages with molding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·54 cites·20 claims
- 0398US9818729B1Package-on-package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·35 cites·20 claims
- 0498US9659805B2Fan-out interconnect structure and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·20 cites·20 claims
- 0598US9418971B2Package-on-package structure including a thermal isolation material and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 16, 2016·42 cites·20 claims
- 0698US9263839B2System and method for an improved fine pitch jointTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·69 cites·17 claims
- 0798US9257333B2Interconnect structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·77 cites·20 claims
- 0898US9196559B2Directly sawing wafers covered with liquid molding compoundTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 24, 2015·61 cites·19 claims
- 0998US8912651B2Package-on-package (PoP) structure including stud bulbs and methodYU CHEN-HUA·Filed 2012·Granted Dec 16, 2014·41 cites·16 claims
- 1097US11456266B2Bump structure and method of manufacturing bump structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·3 cites·20 claims
- 1197US11251141B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 1297US10014260B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·14 cites·20 claims
- 1397US9484227B1Dicing in wafer level packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 1, 2016·20 cites·20 claims
- 1497US9171790B2Package on package devices and methods of packaging semiconductor diesYU CHEN-HUA·Filed 2012·Granted Oct 27, 2015·40 cites·19 claims
- 1597US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 1696US11854835B2Heterogeneous bonding structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 1796US11532692B2Process for tuning via profile in dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·4 cites·20 claims
- 1896US10276541B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 30, 2019·12 cites·22 claims
- 1996US9859229B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·16 cites·20 claims
- 2096US9768048B2Package on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·26 cites·20 claims
- 2196US9601353B2Packages with molding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 21, 2017·28 cites·19 claims
- 2296US9570410B1Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·11 cites·20 claims
- 2396US8975741B2Process for forming package-on-package structuresLIN CHIH-WEI·Filed 2011·Granted Mar 10, 2015·21 cites·20 claims
- 2496US8492891B2Cu pillar bump with electrolytic metal sidewall protectionLU WEN-HSIUNG·Filed 2010·Granted Jul 23, 2013·43 cites·20 claims
- 2595US11855017B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·4 cites·20 claims
- 2695US11348884B1Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·4 cites·20 claims
- 2795US11101233B1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 24, 2021·4 cites·20 claims
- 2895US10276548B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·11 cites·20 claims
- 2995US10276536B2Structure and formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·8 cites·20 claims
- 3095US10032734B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·8 cites·20 claims
- 3195US9847317B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 19, 2017·16 cites·20 claims
- 3295US9799631B2Semiconductor packaging structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 24, 2017·8 cites·20 claims
- 3395US8735273B2Forming wafer-level chip scale package structures with reduced number of seed layersLU WEN-HSIUNG·Filed 2011·Granted May 27, 2014·25 cites·20 claims
- 3495US8659155B2Mechanisms for forming copper pillar bumpsCHENG MING-DA·Filed 2010·Granted Feb 25, 2014·33 cites·25 claims
- 3595US8405199B2Conductive pillar for semiconductor substrate and method of manufactureLU WEN-HSIUNG·Filed 2010·Granted Mar 26, 2013·23 cites·20 claims
- 3694US12015002B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·2 cites·20 claims
- 3794US11955423B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
- 3894US11901323B2Semiconductor packages having conductive pillars with inclined surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 3994US11776881B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·2 cites·20 claims
- 4094US10867932B2Method for manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·3 cites·20 claims
- 4194US9559064B2Warpage control in package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·11 cites·20 claims
- 4293US11862588B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
- 4393US10325853B2Method of forming semiconductor packages having through package viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 18, 2019·8 cites·20 claims
- 4493US9865574B2Alignment in the packaging of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·9 cites·20 claims
- 4593US8901726B2Package on package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 2, 2014·14 cites·20 claims
- 4692US12027435B2Packages including multiple encapsulated substrate blocks and overlapping redistribution structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·1 cites·20 claims
- 4792US10510734B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 4892US9991190B2Packaging with interposer frameHuang hui min·Filed 2012·Granted Jun 5, 2018·14 cites·20 claims
- 4992US9666572B2Process for forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·6 cites·20 claims
- 5092US9559005B2Methods of packaging and dicing semiconductor devices and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 31, 2017·14 cites·20 claims
Showing the top 50 of 474 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →