Inventor · disambiguated record
Ming-Hsiang Cheng
Also filed as: CHENG MING H · CHENG MING-HSIANG
18 granted patents·9 pending applications·141 citations·filing 2002–2024
92Inventor score
Files withADVANCED SEMICONDUCTOR ENG7LAI YI-SHAO6CHANG HSIAO-CHUAN4CHENG MING-HSIANG2TAIWAN SEMICONDUCTOR MFG CO LTD2
Top patents by PatentIndex Score
27 records- 0195US7279789B2Thermally enhanced three-dimensional package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Oct 9, 2007·44 cites·6 claims
- 0293US9859232B1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jan 2, 2018·18 cites·20 claims
- 0391US7689407B2Method of learning a second language through the guidance of picturesYANG KUO-PING·Filed 2007·Granted Mar 30, 2010·33 cites·20 claims
- 0489US8274149B2Semiconductor device package having a buffer structure and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Sep 25, 2012·14 cites·14 claims
- 0583US8072064B1Semiconductor package and method for making the sameLAI YI-SHAO·Filed 2010·Granted Dec 6, 2011·9 cites·21 claims
- 0669US7429783B2Image sensor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Sep 30, 2008·4 cites·18 claims
- 0768US8401858B2Method and system for voice communicationYANG CHIH-KANG·Filed 2010·Granted Mar 19, 2013·2 cites·12 claims
- 0867US2025289093A1System and method for real time inline mixing cmp slurryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0966US7446295B2Image sensor module having an image signal processor being physically and electrically unconnected to a supporting board of an image sensor chipADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Nov 4, 2008·3 cites·11 claims
- 1062US8421242B2Semiconductor packageCHANG HSIAO-CHUAN·Filed 2009·Granted Apr 16, 2013·2 cites·6 claims
- 1162US7699547B2Compact camera moduleADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Apr 20, 2010·2 cites·8 claims
- 1260US8368216B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 5, 2013·1 cites·20 claims
- 1357US2025038008A1Methods for chemical mechanical polishing and methods for forming an interconnect structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1453US2005186547A1Learning device with page indicatorsKUO PING YANG·Filed 2004·Application pending·0 cites
- 1552US10332848B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jun 25, 2019·0 cites·19 claims
- 1652US8253431B2Apparatus and method for testing non-contact pads of a semiconductor device to be testedLAI YI-SHAO·Filed 2010·Granted Aug 28, 2012·1 cites·10 claims
- 1749USD544881SAudio recording and playing deviceYANG KUO-PING·Filed 2006·Granted Jun 19, 2007·8 cites·1 claims
- 1841US11097056B2Automatic jet injector for administering tissueBEYOUNG SCIENT CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·10 claims
- 1941US2007278665A1Thermally Enhanced Three-Dimensional Package and Method for Manufacturing the SameCHENG MING-HSIANG·Filed 2007·Application pending·0 cites
- 2040US2011156739A1Test kit for testing a chip subassembly and a testing method by using the sameCHANG HSIAO-CHUAN·Filed 2009·Application pending·0 cites
- 2139US8592982B2Semiconductor package having proximity communication signal input terminals and manufacturing methods thereofLAI YI-SHAO·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
- 2238US8222726B2Semiconductor device package having a jumper chip and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Jul 17, 2012·0 cites·16 claims
- 2335US2012091575A1Semiconductor Package And Method For Making The SameLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 2435US2011298139A1Semiconductor PackageLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 2535US2011278739A1Semiconductor PackageLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 2635US2003111713A1Manufacturing method of tape carrier package and the system thereofFiled 2002·Application pending·0 cites
- 2733US8222733B2Semiconductor device packageCHENG MING-HSIANG·Filed 2010·Granted Jul 17, 2012·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →