Inventor · disambiguated record
Mitsuyoshi Endo
Also filed as: ENDO MITSUYOSHI
23 granted patents·6 pending applications·283 citations·filing 1987–2018
95Inventor score
Top patents by PatentIndex Score
29 records- 0192US9543484B1Semiconductor light emitting device and method for manufacturing sameTOSHIBA KK·Filed 2016·Granted Jan 10, 2017·12 cites·20 claims
- 0290US4770953AAluminum nitride sintered body having conductive metallized layerTOSHIBA KK·Filed 1987·Granted Sep 13, 1988·87 cites·19 claims
- 0384US10170352B2Manufacturing apparatus of semiconductor device, and manufacturing method of semiconductor deviceALPAD CORP·Filed 2015·Granted Jan 1, 2019·4 cites·17 claims
- 0482US7768456B2Antenna device and radio communication deviceTOSHIBA KK·Filed 2007·Granted Aug 3, 2010·11 cites·16 claims
- 0580US9755127B2Semiconductor light emitting device and method for manufacturing sameTOSHIBA KK·Filed 2016·Granted Sep 5, 2017·4 cites·16 claims
- 0679US5703397ASemiconductor package having an aluminum nitride substrateTOKYO SHIBAURA ELECTRIC CO·Filed 1996·Granted Dec 30, 1997·60 cites·14 claims
- 0775US8884396B2Semiconductor device and manufacturing method thereofENDO MITSUYOSHI·Filed 2011·Granted Nov 11, 2014·4 cites·8 claims
- 0874US7095112B2Semiconductor device, semiconductor package member, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2003·Granted Aug 22, 2006·20 cites·15 claims
- 0973US7370412B2Method for connecting electronic deviceTOSHIBA KK·Filed 2003·Granted May 13, 2008·21 cites·6 claims
- 1069US9209097B2Substrate bonding method and substrate bonding apparatusTOSHIBA KK·Filed 2014·Granted Dec 8, 2015·2 cites·6 claims
- 1166US5176309AMethod of manufacturing circuit boardTOSHIBA KK·Filed 1991·Granted Jan 5, 1993·31 cites·11 claims
- 1265US8766407B2Semiconductor wafer and laminate structure including the sameENDO MITSUYOSHI·Filed 2012·Granted Jul 1, 2014·2 cites·13 claims
- 1362US9312207B2Semiconductor deviceTOSHIBA KK·Filed 2014·Granted Apr 12, 2016·1 cites·14 claims
- 1459US8324715B2Semiconductor device and method of manufacturing the sameENDO MITSUYOSHI·Filed 2011·Granted Dec 4, 2012·1 cites·20 claims
- 1554US6617678B2Semiconductor deviceTOSHIBA KK·Filed 2002·Granted Sep 9, 2003·6 cites·30 claims
- 1652US2019080953A1Manufacturing apparatus of semiconductor device, and manufacturing method of semiconductor deviceALPAD CORP·Filed 2018·Application pending·0 cites
- 1748US6861738B2Laminated-chip semiconductor deviceTOSHIBA KK·Filed 2002·Granted Mar 1, 2005·3 cites·20 claims
- 1847US9123717B2Semiconductor device manufacturing method and manufacturing apparatusTOSHIBA KK·Filed 2013·Granted Sep 1, 2015·0 cites·6 claims
- 1947US8427808B2Variable capacity elementENDO MITSUYOSHI·Filed 2010·Granted Apr 23, 2013·0 cites·16 claims
- 2045US5969413ASemiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape carrier used as external leadsTOKYO SHIBAURA ELECTRIC CO·Filed 1997·Granted Oct 19, 1999·14 cites·5 claims
- 2145US2012248624A1Semiconductor device and manufacturing method thereofENDO MITSUYOSHI·Filed 2011·Application pending·0 cites
- 2244US9229052B2Stack including inspection circuit, inspection method and inspection apparatusTOSHIBA KK·Filed 2013·Granted Jan 5, 2016·0 cites·19 claims
- 2341US9887328B2Semiconductor light emitting device and method for manufacturing sameTOSHIBA KK·Filed 2014·Granted Feb 6, 2018·0 cites·4 claims
- 2441US9735325B2Semiconductor device and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2015·Granted Aug 15, 2017·0 cites·14 claims
- 2540US2014285273A1Semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 2639US2013168832A1Semiconductor deviceENDO MITSUYOSHI·Filed 2012·Application pending·0 cites
- 2739US2004112633A1Electronic device moduleFiled 2003·Application pending·0 cites
- 2835US9595631B2Semiconductor light emitting device and method of manufacturing the sameTOSHIBA KK·Filed 2015·Granted Mar 14, 2017·0 cites·18 claims
- 2935US2016233389A1Semiconductor light emitting device and method for forming phosphor layerTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →