Inventor · disambiguated record
Mikhail Korolik
Also filed as: KOROLIK MIKHAIL
67 granted patents·21 pending applications·2,846 citations·filing 2000–2023
99Inventor score
Files withLAM RES CORP36APPLIED MATERIALS INC23FREER ERIK M13YOON HYUNGSUK ALEXANDER6KOROLIK MIKHAIL5
Top patents by PatentIndex Score
88 records- 0198US10043674B1Germanium etching systems and methodsAPPLIED MATERIALS INC·Filed 2017·Granted Aug 7, 2018·102 cites·20 claims
- 0298US9831097B2Methods for selective etching of a silicon material using HF gas without nitrogen etchantsAPPLIED MATERIALS INC·Filed 2016·Granted Nov 28, 2017·100 cites·18 claims
- 0398US9576809B2Etch suppression with germaniumAPPLIED MATERIALS INC·Filed 2014·Granted Feb 21, 2017·131 cites·4 claims
- 0498US9478434B2Chlorine-based hardmask removalAPPLIED MATERIALS INC·Filed 2014·Granted Oct 25, 2016·134 cites·14 claims
- 0598US9449843B1Selectively etching metals and metal nitrides conformallyAPPLIED MATERIALS INC·Filed 2015·Granted Sep 20, 2016·399 cites·15 claims
- 0698US9355862B2Fluorine-based hardmask removalAPPLIED MATERIALS INC·Filed 2014·Granted May 31, 2016·147 cites·12 claims
- 0798US9355863B2Non-local plasma oxide etchAPPLIED MATERIALS INC·Filed 2015·Granted May 31, 2016·130 cites·20 claims
- 0898US9275834B1Selective titanium nitride etchAPPLIED MATERIALS INC·Filed 2015·Granted Mar 1, 2016·554 cites·15 claims
- 0998US9236265B2Silicon germanium processingAPPLIED MATERIALS INC·Filed 2014·Granted Jan 12, 2016·169 cites·12 claims
- 1098US9111877B2Non-local plasma oxide etchAPPLIED MATERIALS INC·Filed 2013·Granted Aug 18, 2015·182 cites·20 claims
- 1198US8951429B1Tungsten oxide processingAPPLIED MATERIALS INC·Filed 2013·Granted Feb 10, 2015·221 cites·15 claims
- 1296US10177227B1Method for fabricating junctions and spacers for horizontal gate all around devicesAPPLIED MATERIALS INC·Filed 2017·Granted Jan 8, 2019·40 cites·6 claims
- 1396US10043684B1Self-limiting atomic thermal etching systems and methodsAPPLIED MATERIALS INC·Filed 2017·Granted Aug 7, 2018·96 cites·20 claims
- 1496US6534381B2Method for fabricating multi-layered substratesSILICON GENESIS CORP·Filed 2000·Granted Mar 18, 2003·139 cites·25 claims
- 1595US7367345B1Apparatus and method for providing a confined liquid for immersion lithographyLAM RES CORP·Filed 2004·Granted May 6, 2008·62 cites·22 claims
- 1692US7749689B2Methods for providing a confined liquid for immersion lithographyLAM RES CORP·Filed 2008·Granted Jul 6, 2010·13 cites·14 claims
- 1791US7632376B1Method and apparatus for atomic layer deposition (ALD) in a proximity systemLAM RES CORP·Filed 2005·Granted Dec 15, 2009·15 cites·23 claims
- 1890US8287647B2Apparatus and method for atomic layer depositionYOON HYUNGSUK ALEXANDER·Filed 2007·Granted Oct 16, 2012·12 cites·7 claims
- 1989US7696141B2Cleaning compound and method and system for using the cleaning compoundLAM RES CORP·Filed 2006·Granted Apr 13, 2010·10 cites·28 claims
- 2088US7737097B2Method for removing contamination from a substrate and for making a cleaning solutionLAM RES CORP·Filed 2006·Granted Jun 15, 2010·11 cites·22 claims
- 2187US7862662B2Method and material for cleaning a substrateLAM RES CORP·Filed 2006·Granted Jan 4, 2011·10 cites·13 claims
- 2285US7799141B2Method and system for using a two-phases substrate cleaning compoundLAM RES CORP·Filed 2006·Granted Sep 21, 2010·8 cites·24 claims
- 2385US7648584B2Method and apparatus for removing contamination from substrateLAM RES CORP·Filed 2006·Granted Jan 19, 2010·9 cites·27 claims
- 2485US7383843B2Method and apparatus for processing wafer surfaces using thin, high velocity fluid layerLAM RES CORP·Filed 2004·Granted Jun 10, 2008·28 cites·17 claims
- 2583US8591662B2Methods for cleaning a semiconductor substrateFREER ERIK M·Filed 2012·Granted Nov 26, 2013·4 cites·14 claims
- 2683US7615486B2Apparatus and method for integrated surface treatment and deposition for copper interconnectLAM RES CORP·Filed 2007·Granted Nov 10, 2009·7 cites·22 claims
- 2782US8316866B2Method and apparatus for cleaning a semiconductor substrateFREER ERIK M·Filed 2006·Granted Nov 27, 2012·6 cites·13 claims
- 2882US8137474B2Cleaning compound and method and system for using the cleaning compoundFREER ERIK M·Filed 2010·Granted Mar 20, 2012·4 cites·15 claims
- 2981US10204796B2Methods for selective etching of a silicon material using HF gas without nitrogen etchantsAPPLIED MATERIALS INC·Filed 2017·Granted Feb 12, 2019·2 cites·16 claims
- 3081US9875907B2Self-aligned shielding of silicon oxideAPPLIED MATERIALS INC·Filed 2016·Granted Jan 23, 2018·3 cites·15 claims
- 3181US8716210B2Material for cleaning a substrateFREER ERIK M·Filed 2010·Granted May 6, 2014·4 cites·18 claims
- 3281US8475599B2Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutionsFREER ERIK M·Filed 2006·Granted Jul 2, 2013·6 cites·12 claims
- 3381US7204639B1Method and apparatus for thin metal film thickness measurementLAM RES CORP·Filed 2003·Granted Apr 17, 2007·19 cites·10 claims
- 3479US8671959B2Method and apparatus for cleaning a substrate using non-newtonian fluidsDE LARIOS JOHN M·Filed 2011·Granted Mar 18, 2014·4 cites·7 claims
- 3579US8522801B2Method and apparatus for cleaning a semiconductor substrateFREER ERIK M·Filed 2006·Granted Sep 3, 2013·6 cites·6 claims
- 3678US8522799B2Apparatus and system for cleaning a substrateFREER ERIK M·Filed 2006·Granted Sep 3, 2013·6 cites·8 claims
- 3778US8043441B2Method and apparatus for cleaning a substrate using non-Newtonian fluidsLAM RES CORP·Filed 2005·Granted Oct 25, 2011·4 cites·7 claims
- 3877US7806126B1Substrate proximity drying using in-situ local heating of substrate and substrate carrier point of contact, and methods, apparatus, and systems for implementing the sameLAM RES CORP·Filed 2005·Granted Oct 5, 2010·5 cites·19 claims
- 3976US8480810B2Method and apparatus for particle removalFREER ERIK M·Filed 2006·Granted Jul 9, 2013·5 cites·19 claims
- 4074US8623456B2Methods for atomic layer depositionYOON HYUNGSUK ALEXANDER·Filed 2012·Granted Jan 7, 2014·2 cites·11 claims
- 4173US7591613B2Method and apparatus for transporting a substrate using non-newtonian fluidLAM RES CORP·Filed 2008·Granted Sep 22, 2009·3 cites·13 claims
- 4272US8242067B2Two-phase substrate cleaning materialKOROLIK MIKHAIL·Filed 2010·Granted Aug 14, 2012·2 cites·18 claims
- 4372US8128278B2Methods and apparatus for thin metal film thickness measurementGOTKIS YEHIEL·Filed 2009·Granted Mar 6, 2012·5 cites·7 claims
- 4471US8608859B2Method for removing contamination from a substrate and for making a cleaning solutionFREER ERIK M·Filed 2010·Granted Dec 17, 2013·2 cites·15 claims
- 4571US7078344B2Stress free etch processing in combination with a dynamic liquid meniscusLAM RES CORP·Filed 2004·Granted Jul 18, 2006·13 cites·23 claims
- 4669US7709400B2Thermal methods for cleaning post-CMP wafersLAM RES CORP·Filed 2007·Granted May 4, 2010·2 cites·25 claims
- 4768US8555903B2Method and apparatus for removing contamination from substrateFREER ERIK M·Filed 2009·Granted Oct 15, 2013·2 cites·20 claims
- 4868US7416370B2Method and apparatus for transporting a substrate using non-Newtonian fluidLAM RES CORP·Filed 2005·Granted Aug 26, 2008·2 cites·10 claims
- 4967US8388762B2Substrate cleaning technique employing multi-phase solutionFREER ERIK M·Filed 2007·Granted Mar 5, 2013·2 cites·18 claims
- 5063US7534307B2Methods for processing wafer surfaces using thin, high velocity fluid layerLAM RES CORP·Filed 2008·Granted May 19, 2009·1 cites·14 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →