Inventor · disambiguated record
Min-Feng Ku
Also filed as: KU MIN-FENG
9 granted patents·8 pending applications·6 citations·filing 2011–2025
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
17 records- 0185US2025357382A1Guard Ring StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0277US8581399B2Metal bump structureTSAI TSUNG-FU·Filed 2011·Granted Nov 12, 2013·5 cites·19 claims
- 0377US2024379588A1Guard ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0477US2025351471A1Guard Ring Design For Through ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0576US2024332218A1Devices with through silicon vias, guard rings and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0676US2024332219A1Devices with through silicon vias, guard rings and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0772US12354975B2Guard ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 0869US12288735B2Through via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 0969US12265119B2Repackaging IC chip for fault identificationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 1069US12046566B2Devices with through silicon vias, guard rings and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·20 claims
- 1166US9048333B2Isolation rings for packages and the method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 2, 2015·1 cites·20 claims
- 1266US2025231233A1Repackaging ic chip for fault identificationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1363US2023178589A1Guard Ring Design For Through ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1457US2024395666A1Through silicon via with textured structure and footing featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1556US9929070B2Isolation rings for packages and the method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 27, 2018·0 cites·20 claims
- 1653US9548245B2Isolation rings for packages and the method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 17, 2017·0 cites·20 claims
- 1752US8710681B2Isolation rings for blocking the interface between package components and the respective molding compoundCHANG CHIH-HORNG·Filed 2012·Granted Apr 29, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →