Inventor · disambiguated record
Ming-Hsun Lee
Also filed as: LEE MING-HSUN
13 granted patents·11 pending applications·447 citations·filing 2001–2025
91Inventor score
Files withTRIPLE WIN TECH SHENZHEN CO LTD8LEE MING HSUN6SILICONWARE PRECISION INDUSTRIES CO LTD3SANDISK CORP2CHIPMOS TECHNOLOGIES INC1
Top patents by PatentIndex Score
24 records- 0196US6603196B2Leadframe-based semiconductor package for multi-media cardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 5, 2003·185 cites·10 claims
- 0296US6388313B1Multi-chip moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted May 14, 2002·207 cites·10 claims
- 0392US7375415B2Die package with asymmetric leadframe connectionSANDISK CORP·Filed 2005·Granted May 20, 2008·23 cites·30 claims
- 0483US7728411B2COL-TSOP with nonconductive material for reducing package capacitanceSANDISK CORP·Filed 2006·Granted Jun 1, 2010·12 cites·21 claims
- 0580US11852944B2Electrochromic module, camera module, and electronic deviceTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2021·Granted Dec 26, 2023·1 cites·9 claims
- 0678US10623646B1Camera system and imaging method of camera systemTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2019·Granted Apr 14, 2020·3 cites·8 claims
- 0776US8097495B2Die package with asymmetric leadframe connectionLEE MING HSUN·Filed 2008·Granted Jan 17, 2012·7 cites·15 claims
- 0872US2025234455A1Method for manufacturing circuit board having embedded electronic componentTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2025·Application pending·0 cites
- 0970US9909305B2Composite wall assemblyLEE MING HSUN·Filed 2017·Granted Mar 6, 2018·5 cites·7 claims
- 1068US12309918B2Circuit board having embedded electronic component and method for manufacturing the sameTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2022·Granted May 20, 2025·0 cites·9 claims
- 1159US2025220816A1Circuit board assembly and terminal deviceTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 1258US2025391774A1Contact over active gate structures with gate recess for gate insulating cap layers for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Application pending·0 cites
- 1351US6861736B2Leadframe-based semiconductor package for multi-media cardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Mar 1, 2005·4 cites·3 claims
- 1448US11736785B2Camera moduleTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·12 claims
- 1546US2024223913A1Image acquisition device, image acquisition method and electronic deviceTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 1645US2020344368A1Image processing device communicating wirelessly and electronic device using the sameTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2019·Application pending·0 cites
- 1741US2009004783A1Method of package stacking using unbalanced molded tsopLEE MING HSUN·Filed 2007·Application pending·0 cites
- 1841US2009004774A1Method of multi-chip packaging in a tsop packageLEE MING HSUN·Filed 2007·Application pending·0 cites
- 1941US2009166820A1Tsop leadframe strip of multiply encapsulated packagesTAKIAR HEM·Filed 2007·Application pending·0 cites
- 2041US2009001533A1Multi-chip packaging in a tsop packageLEE MING HSUN·Filed 2007·Application pending·0 cites
- 2141US2009001529A1Package stacking using unbalanced molded tsopLEE MING HSUN·Filed 2007·Application pending·0 cites
- 2239US11573784B2Electronic device for updating on-board data of power off status and electronic device package assemblyGIGA BYTE TECH CO LTD·Filed 2019·Granted Feb 7, 2023·0 cites·15 claims
- 2339US8575739B2Col-based semiconductor package including electrical connections through a single layer leadframeUPADHYAYULA SURESH·Filed 2011·Granted Nov 5, 2013·0 cites·24 claims
- 2434US2008088039A1Substrate with heat-dissipating dummy pattern for semiconductor packagesCHIPMOS TECHNOLOGIES INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →