Inventor · disambiguated record
Ming Li
Also filed as: LI MING · LI MING-HSUN
7 granted patents·1 pending application·10 citations·filing 2005–2021
77Inventor score
Files withCHIPMOS TECHNOLOGIES INC3TEXAS INSTRUMENTS INC2CHEN TSUNG LUNG1CHIPMOS TECHNOLOGIES BERMUDA1SHENZHEN BENCENT ELECTRONICS CO LTD1
Top patents by PatentIndex Score
8 records- 0177US10892405B2Hall-effect sensor package with added current pathTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 12, 2021·2 cites·21 claims
- 0275US11296497B2Surge protection circuit and electronic device using the circuitSHENZHEN BENCENT ELECTRONICS CO LTD·Filed 2017·Granted Apr 5, 2022·3 cites·12 claims
- 0370US11557722B2Hall-effect sensor package with added current pathTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 0459US7936032B2Film type package for fingerprint sensorCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted May 3, 2011·2 cites·16 claims
- 0555US7812422B2Film type package for fingerprint sensorCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Oct 12, 2010·1 cites·13 claims
- 0655US7732911B2Semiconductor packaging substrate improving capability of electrostatic dissipationCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Jun 8, 2010·1 cites·11 claims
- 0752US8253235B2Semiconductor packaging substrate improving capability of electrostatic dissipationCHEN TSUNG LUNG·Filed 2010·Granted Aug 28, 2012·1 cites·13 claims
- 0832US2007040262A1Flexible substrate capable of preventing lead thereon from fracturingCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →