Inventor · disambiguated record
Michael Newman
Also filed as: NEWMAN MICHAEL · NEWMAN MICHAEL W
24 granted patents·4 pending applications·556 citations·filing 2004–2018
95Inventor score
Top patents by PatentIndex Score
28 records- 0198US9502390B2BVA interposerINVENSAS CORP·Filed 2013·Granted Nov 22, 2016·59 cites·27 claims
- 0298US7402515B2Method of forming through-silicon vias with stress buffer collars and resulting devicesINTEL CORP·Filed 2005·Granted Jul 22, 2008·375 cites·22 claims
- 0396US7592697B2Microelectronic package and method of cooling sameINTEL CORP·Filed 2007·Granted Sep 22, 2009·64 cites·7 claims
- 0493US8884427B2Low CTE interposer without TSV structureINVENSAS CORP·Filed 2013·Granted Nov 11, 2014·13 cites·19 claims
- 0591US8981564B2Metal PVD-free conducting structuresINVENSAS CORP·Filed 2013·Granted Mar 17, 2015·11 cites·22 claims
- 0689US10297582B2BVA interposerINVENSAS CORP·Filed 2015·Granted May 21, 2019·6 cites·11 claims
- 0789US7528006B2Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansionINTEL CORP·Filed 2005·Granted May 5, 2009·17 cites·12 claims
- 0879US9312175B2Surface modified TSV structure and methods thereofINVENSAS CORP·Filed 2012·Granted Apr 12, 2016·5 cites·16 claims
- 0966US9123780B2Method and structures for heat dissipating interposersINVENSAS CORP·Filed 2012·Granted Sep 1, 2015·1 cites·19 claims
- 1063US9237648B2Carrier-less silicon interposerINVENSAS CORP·Filed 2013·Granted Jan 12, 2016·1 cites·19 claims
- 1162US10744320B2Magnetic field detector for implantable medical devicesNEWMAN MICHAEL W·Filed 2012·Granted Aug 18, 2020·4 cites·22 claims
- 1260US10475733B2Method and structures for heat dissipating interposersINVENSAS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·9 claims
- 1357US9558964B2Method of fabricating low CTE interposer without TSV structureINVENSAS CORP·Filed 2014·Granted Jan 31, 2017·0 cites·19 claims
- 1456US10103094B2Method and structures for heat dissipating interposersINVENSAS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·20 claims
- 1555US10396114B2Method of fabricating low CTE interposer without TSV structureINVENSAS CORP·Filed 2017·Granted Aug 27, 2019·0 cites·17 claims
- 1653US9685401B2Structures for heat dissipating interposersINVENSAS CORP·Filed 2015·Granted Jun 20, 2017·0 cites·16 claims
- 1752US9064933B2Methods and structure for carrier-less thin wafer handlingINVENSAS CORP·Filed 2012·Granted Jun 23, 2015·0 cites·15 claims
- 1851US9398700B2Method of forming a reliable microelectronic assemblyINVENSAS CORP·Filed 2013·Granted Jul 19, 2016·0 cites·15 claims
- 1950US9893030B2Reliable device assemblyINVENSAS CORP·Filed 2016·Granted Feb 13, 2018·0 cites·2 claims
- 2050US9691693B2Carrier-less silicon interposer using photo patterned polymer as substrateINVENSAS CORP·Filed 2013·Granted Jun 27, 2017·0 cites·14 claims
- 2150US9379008B2Metal PVD-free conducting structuresINVENSAS CORP·Filed 2015·Granted Jun 28, 2016·0 cites·8 claims
- 2249US10403510B2Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrateINVENSAS CORP·Filed 2017·Granted Sep 3, 2019·0 cites·2 claims
- 2349US10181411B2Method for fabricating a carrier-less silicon interposerINVENSAS CORP·Filed 2015·Granted Jan 15, 2019·0 cites·10 claims
- 2449US9355905B2Methods and structure for carrier-less thin wafer handlingINVENSAS CORP·Filed 2015·Granted May 31, 2016·0 cites·14 claims
- 2545US2010193952A1Integrated circuit die containing particale-filled through-silicon metal vias with reduced thermal expansionARANA LEONEL·Filed 2009·Application pending·0 cites
- 2644US2008251932A1Method of forming through-silicon vias with stress buffer collars and resulting devicesARANA LEONEL R·Filed 2008·Application pending·0 cites
- 2741US2006286768A1Method of supporting microelectronic wafer during backside processingINTEL CORP·Filed 2005·Application pending·0 cites
- 2835US2005248002A1Fill for large volume viasNEWMAN MICHAEL·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →