Inventor · disambiguated record
Michio Osada
Also filed as: OSADA MICHIO
24 granted patents·4 pending applications·599 citations·filing 1983–2008
97Inventor score
Top patents by PatentIndex Score
28 records- 0187US5834035AMethod of and apparatus for molding resin to seal electronic partsTOWA CORP·Filed 1996·Granted Nov 10, 1998·91 cites·13 claims
- 0285US5435953AMethod of molding resin for sealing an electronic deviceTOWA CORP·Filed 1993·Granted Jul 25, 1995·76 cites·12 claims
- 0385US4793785AApparatus of multiplunger type for enclosing semiconductor elements with resinOSADA MICHIO·Filed 1987·Granted Dec 27, 1988·55 cites·5 claims
- 0478US6773247B1Die used for resin-sealing and molding an electronic componentTOWA CORP·Filed 2000·Granted Aug 10, 2004·31 cites·11 claims
- 0577US5768655AImage forming apparatus and control method thereofKONISHIROKU PHOTO IND·Filed 1997·Granted Jun 16, 1998·29 cites·18 claims
- 0675US5603879AMethod of molding resin to seal electronic parts using two evacuation stepsTOWA CORP·Filed 1994·Granted Feb 18, 1997·48 cites·17 claims
- 0773US4723899AMolding apparatus for enclosing semiconductor chips with resinOSADA MICHIO·Filed 1985·Granted Feb 9, 1988·33 cites·5 claims
- 0871US7738830B2Image forming apparatus, image forming system and computer program of the same for forming cover sheetKONICA MINOLTA BUSINESS TECH·Filed 2006·Granted Jun 15, 2010·5 cites·16 claims
- 0969US5507633AResin molding apparatus for sealing an electronic deviceTOWA CORP·Filed 1994·Granted Apr 16, 1996·36 cites·13 claims
- 1066US6919223B2Method of manufacturing semiconductor resin molding and resin member employed thereforTOWA CORP·Filed 2003·Granted Jul 19, 2005·13 cites·8 claims
- 1166US4862586ALead frame for enclosing semiconductor chips with resinOSADA MICHIO·Filed 1988·Granted Sep 5, 1989·31 cites·6 claims
- 1264US5874324AMethod of sealing electronic component with molded resinTOWA CORP·Filed 1997·Granted Feb 23, 1999·30 cites·16 claims
- 1363US6438826B2Electronic component, method of sealing electronic component with resin, and apparatus thereforTOWA CORP·Filed 2001·Granted Aug 27, 2002·13 cites·14 claims
- 1463US4543684AApparatus for cleaning plastics forming mold facesBANDOH KAZUO·Filed 1983·Granted Oct 1, 1985·18 cites·7 claims
- 1562US6736703B2Cutting apparatus and cutting methodTOWA CORP·Filed 2002·Granted May 18, 2004·8 cites·25 claims
- 1660US8139252B2Image forming system and image forming methodMOROHASHI TAKEO·Filed 2008·Granted Mar 20, 2012·2 cites·12 claims
- 1759US5783220AResin sealing and molding apparatus for sealing electronic partsTOWA CORP·Filed 1996·Granted Jul 21, 1998·19 cites·15 claims
- 1852US5031022AFilm carrier for mounting IC chipsNIPPON STEEL CORP·Filed 1990·Granted Jul 9, 1991·20 cites·18 claims
- 1951US6712674B2Polishing apparatus and polishing methodTOWA CORP·Filed 2001·Granted Mar 30, 2004·4 cites·6 claims
- 2045US2003094185A1Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resinTOWA CORP·Filed 2002·Application pending·0 cites
- 2142US5159666AApparatus and a method for enlarging dot matrix dataCASIO COMPUTER CO LTD·Filed 1990·Granted Oct 27, 1992·10 cites·20 claims
- 2240US5153708ATape carrier used in tab systemNIPPON STEEL CORP·Filed 1991·Granted Oct 6, 1992·13 cites·4 claims
- 2337US5200125AMethod for seal molding electronic components with resinT & K INT KENKYUSHO KK·Filed 1989·Granted Apr 6, 1993·9 cites·11 claims
- 2437US2007177209A1Information processing apparatus and recording medium for storing programISHIBASHI TAKEI·Filed 2006·Application pending·0 cites
- 2534US2006291888A1User interface and computer readable medium storing computer programMIYAMOTO YOSHIO·Filed 2005·Application pending·0 cites
- 2632US2001021409A1Apparatus for processing resin sealed lead frameTOWA CORP·Filed 2001·Application pending·0 cites
- 2728US6258628B1Method and apparatus for processing resin sealed lead frameTOWA CORP·Filed 1999·Granted Jul 10, 2001·3 cites·8 claims
- 2826US6594889B1Method for processing leadframeTOWA CORP·Filed 1999·Granted Jul 22, 2003·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →