Inventor · disambiguated record
Michael Rizzolo
Also filed as: RIZZOLO MICHAEL · RIZZOLO MICHAEL R
206 granted patents·22 pending applications·990 citations·filing 2009–2024
99Inventor score
Top patents by PatentIndex Score
228 records- 0199US9837355B2Method for maximizing air gap in back end of the line interconnect through via landing modificationIBM·Filed 2016·Granted Dec 5, 2017·313 cites·5 claims
- 0299US8027162B2Liquid-cooled electronics apparatus and methods of fabricationIBM·Filed 2009·Granted Sep 27, 2011·123 cites·20 claims
- 0398US11056429B2Semiconductor device including a porous dielectric layer, and method of forming the semiconductor deviceTESSERA INC·Filed 2020·Granted Jul 6, 2021·4 cites·19 claims
- 0498US10707413B1Formation of embedded magnetic random-access memory devicesIBM·Filed 2019·Granted Jul 7, 2020·46 cites·20 claims
- 0598US10395986B1Fully aligned via employing selective metal depositionIBM·Filed 2018·Granted Aug 27, 2019·24 cites·19 claims
- 0698US10243020B1Structures and methods for embedded magnetic random access memory (MRAM) fabricationIBM·Filed 2017·Granted Mar 26, 2019·18 cites·13 claims
- 0798US9911651B1Skip-vias bypassing a metallization level at minimum pitchIBM·Filed 2016·Granted Mar 6, 2018·26 cites·16 claims
- 0897US12218003B2Selective ILD deposition for fully aligned via with airgapADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Granted Feb 4, 2025·2 cites·20 claims
- 0997US9966337B1Fully aligned via with integrated air gapsIBM·Filed 2017·Granted May 8, 2018·22 cites·12 claims
- 1097US9917137B1Integrated magnetic tunnel junction (MTJ) in back end of line (BEOL) interconnectsIBM·Filed 2017·Granted Mar 13, 2018·14 cites·20 claims
- 1197US9553019B1Airgap protection layer for via alignmentIBM·Filed 2016·Granted Jan 24, 2017·20 cites·20 claims
- 1296US9754883B1Hybrid metal interconnects with a bamboo grain microstructureIBM·Filed 2016·Granted Sep 5, 2017·14 cites·14 claims
- 1395US11955424B2Semiconductor device including a porous dielectric layer, and method of forming the semiconductor deviceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Granted Apr 9, 2024·1 cites·20 claims
- 1495US11574864B2Semiconductor device including a porous dielectric layer, and method of forming the semiconductor deviceTESSERA LLC·Filed 2021·Granted Feb 7, 2023·2 cites·21 claims
- 1595US11223008B2Pillar-based memory hardmask smoothing and stress reductionIBM·Filed 2019·Granted Jan 11, 2022·6 cites·6 claims
- 1695US10297750B1Wraparound top electrode line for crossbar array resistive switching deviceIBM·Filed 2017·Granted May 21, 2019·11 cites·20 claims
- 1795US10109579B2Semiconductor device including a porous dielectric layer, and method of forming the semiconductor deviceIBM·Filed 2018·Granted Oct 23, 2018·8 cites·20 claims
- 1895US10046601B2Smartwatch blackboxIBM·Filed 2017·Granted Aug 14, 2018·3 cites·20 claims
- 1995US9780035B1Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnectsIBM·Filed 2016·Granted Oct 3, 2017·10 cites·25 claims
- 2094US10957850B2Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabricationIBM·Filed 2018·Granted Mar 23, 2021·6 cites·18 claims
- 2194US10195901B2Smartwatch blackboxIBM·Filed 2017·Granted Feb 5, 2019·3 cites·20 claims
- 2294US10083905B2Skip-vias bypassing a metallization level at minimum pitchIBM·Filed 2017·Granted Sep 25, 2018·9 cites·19 claims
- 2394US9685366B1Forming chamferless vias using thermally decomposable porefillerIBM·Filed 2016·Granted Jun 20, 2017·12 cites·11 claims
- 2493US10366952B2Semiconductor device including a porous dielectric layer, and method of forming the semiconductor deviceIBM·Filed 2018·Granted Jul 30, 2019·5 cites·17 claims
- 2593US10361157B2Method of manufacturing self-aligned interconnects by deposition of a non-conformal air-gap forming layer having an undulated upper surfaceIBM·Filed 2017·Granted Jul 23, 2019·6 cites·8 claims
- 2693US9985199B1Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shieldIBM·Filed 2017·Granted May 29, 2018·8 cites·13 claims
- 2793US9837305B1Forming deep airgaps without flop overIBM·Filed 2016·Granted Dec 5, 2017·10 cites·20 claims
- 2893US9548243B1Self aligned via and pillar cut for at least a self aligned double pitchIBM·Filed 2015·Granted Jan 17, 2017·7 cites·16 claims
- 2993US9431205B1Fold over emitter and collector field emission transistorIBM·Filed 2015·Granted Aug 30, 2016·8 cites·2 claims
- 3092US11502242B2Embedded memory devicesIBM·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 3192US10204828B1Enabling low resistance gates and contacts integrated with bilayer dielectricsIBM·Filed 2018·Granted Feb 12, 2019·8 cites·20 claims
- 3292US10096769B2Bottom electrode for MRAM applicationsIBM·Filed 2017·Granted Oct 9, 2018·7 cites·20 claims
- 3392US9793206B1Heterogeneous metallization using solid diffusion removal of metal interconnectsIBM·Filed 2016·Granted Oct 17, 2017·8 cites·10 claims
- 3492US9418934B1Structure and fabrication method for electromigration immortal nanoscale interconnectsIBM·Filed 2015·Granted Aug 16, 2016·10 cites·25 claims
- 3591US10964588B2Selective ILD deposition for fully aligned via with airgapTESSERA INC·Filed 2020·Granted Mar 30, 2021·2 cites·17 claims
- 3691US10746782B2Accelerated wafer testing using non-destructive and localized stressIBM·Filed 2017·Granted Aug 18, 2020·4 cites·16 claims
- 3791US9997451B2Semiconductor device including a porous dielectric layer, and method of forming the semiconductor deviceIBM·Filed 2016·Granted Jun 12, 2018·5 cites·16 claims
- 3891US9941088B2Fold over emitter and collector field emission transistorIBM·Filed 2016·Granted Apr 10, 2018·6 cites·9 claims
- 3991US9666474B2Uniform dielectric recess depth during fin revealIBM·Filed 2015·Granted May 30, 2017·5 cites·7 claims
- 4090US10629529B2Semiconductor device including a porous dielectric layer, and method of forming the semiconductor deviceTESSERA INC·Filed 2019·Granted Apr 21, 2020·3 cites·19 claims
- 4190US10559498B2Location-specific laser annealing to improve interconnect microstructureIBM·Filed 2019·Granted Feb 11, 2020·2 cites·20 claims
- 4290US9418327B1Security key systemIBM·Filed 2016·Granted Aug 16, 2016·6 cites·6 claims
- 4389US11735524B2Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zonesIBM·Filed 2019·Granted Aug 22, 2023·3 cites·11 claims
- 4489US11004790B2Method of manufacturing an interconnect without dielectric exclusion zones by thermal decomposition of a sacrificial filler materialIBM·Filed 2017·Granted May 11, 2021·4 cites·7 claims
- 4589US9858388B1Health monitoring using parallel cognitive processingIBM·Filed 2016·Granted Jan 2, 2018·9 cites·20 claims
- 4689US9758095B2Smartwatch blackboxIBM·Filed 2016·Granted Sep 12, 2017·5 cites·14 claims
- 4789US2025140606A1Selective ild deposition for fully aligned via with airgapADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2024·Application pending·0 cites
- 4888US10692925B2Dielectric fill for memory pillar elementsIBM·Filed 2018·Granted Jun 23, 2020·3 cites·20 claims
- 4988US10256191B2Hybrid dielectric scheme for varying liner thickness and manganese concentrationIBM·Filed 2017·Granted Apr 9, 2019·4 cites·5 claims
- 5088US10045096B2Social media modification of behavior and mobile screening for impairmentIBM·Filed 2015·Granted Aug 7, 2018·9 cites·20 claims
Showing the top 50 of 228 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →