Inventor · disambiguated record
Mitsuhisa Watanabe
Also filed as: WATANABE MITSUHISA
30 granted patents·8 pending applications·188 citations·filing 2000–2024
96Inventor score
Files withELPIDA MEMORY INC9FUJITSU LTD9MICRON TECHNOLOGY INC7WATANABE MITSUHISA5ELPIDIA MEMORY INC1
Top patents by PatentIndex Score
38 records- 0197US10217719B2Semiconductor device assemblies with molded support substratesMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 26, 2019·28 cites·16 claims
- 0293US9935082B2Stacked semiconductor dies with selective capillary under fillMICRON TECHNOLOGY INC·Filed 2015·Granted Apr 3, 2018·7 cites·10 claims
- 0393US7884459B2Semiconductor device suitable for a stacked structureFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Feb 8, 2011·23 cites·9 claims
- 0491US10998290B2Semiconductor device assemblies with molded support substratesMICRON TECHNOLOGY INC·Filed 2019·Granted May 4, 2021·5 cites·20 claims
- 0586US8216934B2Semiconductor device suitable for a stacked structureYOSHIDA EIJI·Filed 2010·Granted Jul 10, 2012·7 cites·12 claims
- 0686US6837776B2Flat-object holder and method of using the sameFUJITSU LTD·Filed 2002·Granted Jan 4, 2005·35 cites·10 claims
- 0785US7395847B2Jig for a semiconductor substrateFUJITSU LTD·Filed 2005·Granted Jul 8, 2008·9 cites·3 claims
- 0884US2025006697A1Semiconductor device assemblies with molded support substratesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0978US6461942B2Semiconductor chip removing and conveying method and deviceFUJITSU LTD·Filed 2000·Granted Oct 8, 2002·24 cites·3 claims
- 1077US9466546B2Semiconductor device and method of forming the sameHATAKEYAMA KOICHI·Filed 2011·Granted Oct 11, 2016·5 cites·26 claims
- 1174US7109561B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2005·Granted Sep 19, 2006·4 cites·1 claims
- 1273US12119325B2Semiconductor device assemblies with molded support substratesMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 15, 2024·0 cites·18 claims
- 1373US6750074B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2002·Granted Jun 15, 2004·13 cites·12 claims
- 1471US8816478B2Semiconductor device having penetration electrode penetrating through semiconductor substrateELPIDA MEMORY INC·Filed 2013·Granted Aug 26, 2014·3 cites·20 claims
- 1571US7571538B2Vacuum fixing jig for semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Aug 11, 2009·3 cites·1 claims
- 1668US8203222B2Semiconductor device and method of manufacturing the sameWATANABE MITSUHISA·Filed 2009·Granted Jun 19, 2012·4 cites·23 claims
- 1762US7993975B2Method of manufacturing semiconductor device including mounting and dicing chipsELPIDA MEMORY INC·Filed 2008·Granted Aug 9, 2011·2 cites·17 claims
- 1862US7964962B2Method of manufacturing a semiconductor apparatusELPIDIA MEMORY INC·Filed 2008·Granted Jun 21, 2011·2 cites·21 claims
- 1962US7786564B2Semiconductor device and method for manufacturing semiconductor deviceELPIDA MEMORY INC·Filed 2008·Granted Aug 31, 2010·2 cites·19 claims
- 2061US10607966B2Stacked semiconductor dies with selective capillary under fillMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 31, 2020·0 cites·9 claims
- 2161US10553560B2Semiconductor device having multiple semiconductor chips laminated together and electrically connectedPS4 LUXCO SARL·Filed 2014·Granted Feb 4, 2020·1 cites·16 claims
- 2261US10083941B2Stacked semiconductor dies with selective capillary under fillMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 25, 2018·0 cites·13 claims
- 2359US6902944B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2004·Granted Jun 7, 2005·5 cites·4 claims
- 2458US7969019B2Module with stacked semiconductor devicesELPIDA MEMORY INC·Filed 2009·Granted Jun 28, 2011·1 cites·8 claims
- 2555US6869819B2Recognition method of a mark provided on a semiconductor deviceFUJITSU LTD·Filed 2002·Granted Mar 22, 2005·4 cites·10 claims
- 2648US2010133722A1Semiconductor device manufacturing methodELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 2747US8441126B2Semiconductor deviceWATANABE MITSUHISA·Filed 2011·Granted May 14, 2013·0 cites·21 claims
- 2847US7812439B2Semiconductor package with reduced length interconnect and manufacturing method thereofELPIDA MEMORY INC·Filed 2008·Granted Oct 12, 2010·0 cites·12 claims
- 2947US2005167812A1Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3047US2010148172A1Semiconductor deviceELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 3146US8810047B2Semiconductor device and method of manufacturing the sameWATANABE MITSUHISA·Filed 2009·Granted Aug 19, 2014·0 cites·26 claims
- 3246US6951800B2Method of making semiconductor device that has improved structural strengthFUJITSU LTD·Filed 2002·Granted Oct 4, 2005·1 cites·1 claims
- 3343US2005085171A1Flat-object holder and method of using the sameFiled 2004·Application pending·0 cites
- 3439US8217517B2Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each otherWATANABE MITSUHISA·Filed 2010·Granted Jul 10, 2012·0 cites·18 claims
- 3538US9112061B2Semiconductor device and method of forming the sameWATANABE MITSUHISA·Filed 2010·Granted Aug 18, 2015·0 cites·21 claims
- 3637US2010252923A1Semiconductor device and method of manufacturing sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 3736US2010301468A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 3835US2012118939A1Process and apparatus for manufacturing semiconductor deviceKUSANAGI KEIYO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →