Inventor · disambiguated record
Michael Welch
Also filed as: WELCH MICHAEL · WELCH MICHAEL D · WELCH MICHAEL DUDLEY
38 granted patents·7 pending applications·2,914 citations·filing 1994–2012
99Inventor score
Top patents by PatentIndex Score
45 records- 0198US6074514AHigh selectivity etch using an external plasma dischargeAPPLIED MATERIALS INC·Filed 1998·Granted Jun 13, 2000·504 cites·22 claims
- 0297US5891350AAdjusting DC bias voltage in plasma chambersAPPLIED MATERIALS INC·Filed 1996·Granted Apr 6, 1999·186 cites·21 claims
- 0396US6716302B2Dielectric etch chamber with expanded process windowAPPLIED MATERIALS INC·Filed 2002·Granted Apr 6, 2004·91 cites·18 claims
- 0496US6232236B1Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1999·Granted May 15, 2001·134 cites·32 claims
- 0596US5843847AMethod for etching dielectric layers with high selectivity and low microloadingAPPLIED MATERIALS INC·Filed 1996·Granted Dec 1, 1998·319 cites·51 claims
- 0695US6284093B1Shield or ring surrounding semiconductor workpiece in plasma chamberAPPLIED MATERIALS INC·Filed 2000·Granted Sep 4, 2001·133 cites·46 claims
- 0794US6797639B2Dielectric etch chamber with expanded process windowAPPLIED MATERIALS INC·Filed 2002·Granted Sep 28, 2004·63 cites·30 claims
- 0893US6432259B1Plasma reactor cooled ceiling with an array of thermally isolated plasma heated mini-gas distribution platesAPPLIED MATERIALS INC·Filed 1999·Granted Aug 13, 2002·104 cites·101 claims
- 0993US5948168ADistributed microwave plasma reactor for semiconductor processingAPPLIED MATERIALS INC·Filed 1997·Granted Sep 7, 1999·83 cites·29 claims
- 1092US6192827B1Double slit-valve doors for plasma processingAPPLIED MATERIALS INC·Filed 1998·Granted Feb 27, 2001·108 cites·16 claims
- 1192US6113731AMagnetically-enhanced plasma chamber with non-uniform magnetic fieldAPPLIED MATERIALS INC·Filed 1997·Granted Sep 5, 2000·152 cites·42 claims
- 1290US6813534B2Endpoint detection in substrate fabrication processesFiled 2002·Granted Nov 2, 2004·54 cites·30 claims
- 1390US6513452B2Adjusting DC bias voltage in plasma chamberAPPLIED MATERIALS INC·Filed 2001·Granted Feb 4, 2003·29 cites·20 claims
- 1490US6387288B1High selectivity etch using an external plasma dischargeAPPLIED MATERIALS INC·Filed 2000·Granted May 14, 2002·31 cites·8 claims
- 1590US5740009AApparatus for improving wafer and chuck edge protectionAPPLIED MATERIALS INC·Filed 1996·Granted Apr 14, 1998·117 cites·24 claims
- 1689US6689249B2Shield or ring surrounding semiconductor workpiece in plasma chamberAPPLIED MATERIALS INC·Filed 2001·Granted Feb 10, 2004·48 cites·20 claims
- 1789US5814563AMethod for etching dielectric using fluorohydrocarbon gas, NH3 -generating gas, and carbon-oxygen gasAPPLIED MATERIALS INC·Filed 1996·Granted Sep 29, 1998·110 cites·13 claims
- 1889US5702530ADistributed microwave plasma reactor for semiconductor processingAPPLIED MATERIALS INC·Filed 1995·Granted Dec 30, 1997·76 cites·64 claims
- 1988US6022446AShallow magnetic fields for generating circulating electrons to enhance plasma processingFiled 1995·Granted Feb 8, 2000·63 cites·34 claims
- 2085US5865937ABroad-band adjustable power ratio phase-inverting plasma reactorAPPLIED MATERIALS INC·Filed 1995·Granted Feb 2, 1999·48 cites·36 claims
- 2184US5780359APolymer removal from top surfaces and sidewalls of a semiconductor waferAPPLIED MATERIALS INC·Filed 1995·Granted Jul 14, 1998·67 cites·12 claims
- 2282US6221782B1Adjusting DC bias voltage in plasma chamberAPPLIED MATERIALS INC·Filed 1999·Granted Apr 24, 2001·31 cites·12 claims
- 2381US6015761AMicrowave-activated etching of dielectric layersAPPLIED MATERIALS INC·Filed 1996·Granted Jan 18, 2000·62 cites·37 claims
- 2480US6391790B1Method and apparatus for etching photomasksAPPLIED MATERIALS INC·Filed 2000·Granted May 21, 2002·22 cites·43 claims
- 2580US5400651AApparatus for interface measurement in a storage tankSHELL OIL CO·Filed 1994·Granted Mar 28, 1995·48 cites·18 claims
- 2679US7147719B2Double slit-valve doors for plasma processingAPPLIED MATERIALS INC·Filed 2003·Granted Dec 12, 2006·17 cites·15 claims
- 2779US6267549B1Dual independent robot blades with minimal offsetAPPLIED MATERIALS INC·Filed 1998·Granted Jul 31, 2001·66 cites·11 claims
- 2876US6863835B1Magnetic barrier for plasma in chamber exhaustFiled 2000·Granted Mar 8, 2005·10 cites·33 claims
- 2973US6647918B1Double slit-valve doors for plasma processingAPPLIED MATERIALS INC·Filed 2000·Granted Nov 18, 2003·13 cites·43 claims
- 3069US6899111B2Configurable single substrate wet-dry integrated cluster cleanerAPPLIED MATERIALS INC·Filed 2001·Granted May 31, 2005·12 cites·34 claims
- 3169US6592673B2Apparatus and method for detecting a presence or position of a substrateAPPLIED MATERIALS INC·Filed 1999·Granted Jul 15, 2003·36 cites·32 claims
- 3266US6248206B1Apparatus for sidewall profile control during an etch processAPPLIED MATERIALS INC·Filed 1996·Granted Jun 19, 2001·33 cites·8 claims
- 3364US6773544B2Magnetic barrier for plasma in chamber exhaustFiled 2001·Granted Aug 10, 2004·5 cites·17 claims
- 3462US6534417B2Method and apparatus for etching photomasksAPPLIED MATERIALS INC·Filed 2002·Granted Mar 18, 2003·7 cites·40 claims
- 3560US6822185B2Temperature controlled dome-coil system for high power inductively coupled plasma systemsAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·7 cites·56 claims
- 3660US2007091535A1Temperature controlled semiconductor processing chamber linerAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3749US6062237APolymer removal from top surfaces and sidewalls of a semiconductor waferAPPLIED MATERIALS INC·Filed 1998·Granted May 16, 2000·13 cites·10 claims
- 3848US7115523B2Method and apparatus for etching photomasksAPPLIED MATERIALS INC·Filed 2003·Granted Oct 3, 2006·2 cites·19 claims
- 3945US2013306524A1Underwater gold processing machineWELCH MICHAEL DUDLEY·Filed 2012·Application pending·0 cites
- 4044US6774806B1Monitoring an element of a plantSHELL OIL CO·Filed 1999·Granted Aug 10, 2004·10 cites·17 claims
- 4144US2005003675A1Dielectric etch chamber with expanded process windowFiled 2004·Application pending·0 cites
- 4242US2002069970A1Temperature controlled semiconductor processing chamber linerAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 4340US2001009139A1Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing systemFiled 2001·Application pending·0 cites
- 4436US2002096114A1Series chamber for substrate processingAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 4529US2002066535A1Exhaust system for treating process gas effluentFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →