Series chamber for substrate processing

Abstract

Apparatus and methods provide a module defining processing regions in which substrates can be processed. One embodiment of the module has a serial arrangement of processing regions, where a first processing region is disposed at a front end portion of the module and a second processing region is defined at a back end portion of the module. A substrate transfer passageway fluidly communicates the first and second processing regions.

What is claimed is:  
     
         1 . A system for processing substrates, comprising: 
 a) a transfer chamber defining an enclosure and a first opening; and    b) a processing module interfaced with the transfer chamber, the module comprising: 
 i) a body having a front end portion defining a first processing region and a back end portion defining a second processing region, wherein the front end portion defines a second opening registered with the first opening to form an aperture sized to accommodate substrate transfer therethrough; and  
 ii) a substrate handler disposed on the body and comprising a substrate support arm positionable alternatively in the first processing region and the second processing region.  
   
     
     
         2 . The system of  claim 1 , wherein the aperture is the only entry and exit for substrates moving between the transfer chamber and the processing module.  
     
     
         3 . The system of  claim 1 , further comprising a housing disposed on the body forming an enclosure to receive the substrate handler.  
     
     
         4 . The system of  claim 1 , further comprising a loadlock chamber connected to the transfer chamber, wherein the loadlock serves as a entry and exit location for substrates moving to and from the transfer chamber.  
     
     
         5 . The system of  claim 1 , wherein the first processing region is adapted for chemical vapor deposition (CVD) and the second processing region is adapted for physical vapor deposition (PVD).  
     
     
         6 . The system of  claim 1 , further comprising a sealing apparatus comprising an actuator connected to a door adapted to seal the aperture.  
     
     
         7 . The system of  claim 1 , further comprising a robot disposed in the transfer chamber, the robot comprising a substrate-carrying blade adapted to transfer the substrate through the aperture.  
     
     
         8 . The system of  claim 1 , further comprising an actuator connected to the substrate handler.  
     
     
         9 . The system of  claim 1 , further comprising an actuator connected to the substrate handler and adapted to rotate the substrate handler.  
     
     
         10 . The system of  claim 1 , wherein the body at least partially defines a substrate transfer passageway between the first processing region and second processing region to allow a substrate and the substrate support arm to move between the first processing region and second processing region.  
     
     
         11 . The system of  claim 10 , further comprising a sealing assembly disposed on the body and adapted to seal the substrate transfer passageway.  
     
     
         12 . The system of  claim 10 , wherein the sealing assembly comprises a sealing member positionable in the substrate transfer passageway.  
     
     
         13 . The system of  claim 10 , wherein the substrate transfer passageway is the only entry and exit for substrates moving between the first and second processing regions.  
     
     
         14 . A system for processing substrates, comprising: 
 a) a transfer chamber defining an enclosure and having a first opening formed in a sidewall of the transfer chamber; and    b) at least one processing chamber defining a first processing region and an adjacent second processing region communicable through a substrate transfer passageway, the first processing region being disposed between the transfer chamber and the second processing region, wherein the at least one processing chamber defines a second opening registered with the first opening to communicate the first processing region and the enclosure.    
     
     
         15 . The system of  claim 14 , wherein the transfer chamber, the first processing region and the second processing region define a substrate transfer plane.  
     
     
         16 . The system of  claim 14 , wherein a front end portion of the at least one processing chamber is connected to a facet of the transfer chamber and wherein the first processing region is located at the front end portion and the second processing region is located at a backend portion.  
     
     
         17 . The system of  claim 16 , wherein the front end portion defines the second opening and wherein the first and second opening are sized to accommodate substrate transfer therethough.  
     
     
         18 . The system of  claim 17 , further comprising a sealing apparatus comprising an actuator connected to a door adapted to selectively seal the first opening.  
     
     
         19 . The system of  claim 17 , further comprising a robot disposed in the transfer chamber, the robot comprising a substrate-carrying blade adapted to transfer a substrate through the first and second openings.  
     
     
         20 . The system of  claim 14 , further comprising a sealing assembly disposed on the at least one processing chamber and adapted to selectively isolate the first and second processing regions from each other.  
     
     
         21 . The system of  claim 20 , further comprising at least one shield disposed in at least one of the first processing regions and the second processing region.  
     
     
         22 . The system of  claim 21 , further comprising at least one actuator coupled to the shield.  
     
     
         23 . The system of  claim 14 , further comprising a substrate handler connected to the at least one processing chamber and positionable the first and second processing regions.  
     
     
         24 . The system of  claim 23 , wherein the substrate handler comprises a substrate support arm connected to a shaft rotatable about an axis and having a motor connected to one end of the shaft.  
     
     
         25 . The system of  claim 23 , further comprising a housing connected to an outer surface of the at least one processing chamber and forming a substrate handler enclosure for receiving at least a portion of the substrate handler.  
     
     
         26 . The system of  claim 25 , wherein the housing and the second processing region are disposed at a backend portion of the at least one processing chamber.  
     
     
         27 . A substrate processing module, comprising: 
 a) a body defining a first processing region at a front end portion and a second processing region at back end portion, and further defining a substrate transfer opening between the first processing region and the second processing region to allow transfer of a substrate between the processing regions;    b) a mounting surface formed at the front end portion and including an opening adapted to allow transfer of a substrate between the body and a region external to the body; and    c) a substrate handler disposed on the body and comprising a substrate support arm positionable in the first and second processing regions.    
     
     
         28 . The substrate processing module of  claim 27 , wherein the substrate handler comprises a shaft connected at one end to the substrate support arm and connected at another end to an actuator adapted to rotate the shaft about an axis perpendicular to a plane of rotation on which the substrate support arm moves.  
     
     
         29 . The substrate processing module of  claim 27 , further comprising a pedestal disposed in each processing region.  
     
     
         30 . The substrate processing module of  claim 27 , further comprising an exhaust system connected to the first and second processing regions.  
     
     
         31 . The substrate processing module of  claim 30 , wherein the exhaust system comprises: 
 a first outlet member connected to the body and in fluid communication with the first processing region;    a second outlet member connected to the body and in fluid communication with the second processing region; and    a vacuum pump in communication with the first and second outlet members.    
     
     
         32 . A method for transferring substrates, comprising: 
 a) transferring a first substrate from a transfer chamber into a first processing region of a processing chamber interfacing with the transfer chamber;    b) actuating a substrate handler to transfer the first substrate to a second processing region of the processing chamber, the second processing region being separated from the transfer chamber by at least the first processing region; and    c) positioning the first substrate on a support member disposed in the second processing region.    
     
     
         33 . The method of  claim 32 , wherein step a) comprises: 
 actuating a robot blade carrying the substrate into a position over a pedestal located in the first processing region;    removing the first substrate from the robot blade; and    positioning the first substrate on the pedestal.    
     
     
         34 . The method of  claim 33 , wherein removing the first substrate from the robot blade comprises actuating lift pins disposed in the pedestal to contact a lower surface of the first substrate.  
     
     
         35 . The method of  claim 32 , wherein actuating a substrate handler comprises rotating the substrate handler from the first processing region to the second processing region through a transfer passageway defined by the processing chamber.  
     
     
         36 . The method of  claim 32 , further comprising transferring a second substrate into the first processing region and performing a first process in the first processing region and a second process in the second processing region.  
     
     
         37 . The method of  claim 36 , wherein the first process and the second process are the same.  
     
     
         38 . The method of  claim 32 , further comprising performing a first process on the first substrate in one of the first and second processing regions, transferring the first substrate to the other of the first and second processing regions and performing a second process on the first substrate.  
     
     
         39 . The method of  claim 32 , further comprising substantially sealing the first and second processing regions from each other.  
     
     
         40 . The method of  claim 32 , wherein substantially sealing the first and second processing regions from each other comprises positioning a door in a substrate transfer passageway defined by the processing chamber.