Inventor · disambiguated record
Motoki Eto
Also filed as: ETO MOTOKI
16 granted patents·12 pending applications·16 citations·filing 2015–2023
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
28 records- 0189US9887172B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Feb 6, 2018·6 cites·9 claims
- 0288US11721660B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted Aug 8, 2023·1 cites·13 claims
- 0387US11929343B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted Mar 12, 2024·1 cites·13 claims
- 0487US11612966B2Ag alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2020·Granted Mar 28, 2023·2 cites·8 claims
- 0586US12090578B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Sep 17, 2024·2 cites·2 claims
- 0684US11373934B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Jun 28, 2022·4 cites·13 claims
- 0775US12300658B2Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted May 13, 2025·0 cites·3 claims
- 0869US2023387066A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2023·Application pending·0 cites
- 0968US2024290745A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2023·Application pending·0 cites
- 1068US2023335528A1Bonding wire for semiconductor devicesNIPPON MICROMETAL COPORATION·Filed 2023·Application pending·0 cites
- 1163US2024297142A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 1259US12290883B2Bonding wireNIPPON MICROMETAL CORP·Filed 2023·Granted May 6, 2025·0 cites·16 claims
- 1358US12166006B2Bonding wire for semiconductor devicesNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·9 claims
- 1457US2025372565A1Bonding wire for semiconductor devicesNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2023·Application pending·0 cites
- 1555US12388044B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Aug 12, 2025·0 cites·4 claims
- 1655US12132025B2Bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·4 claims
- 1755US10121758B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Nov 6, 2018·0 cites·9 claims
- 1854US12463172B2AG alloy bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2021·Granted Nov 4, 2025·0 cites·8 claims
- 1954US12325901B2AI wiring materialNIPPON MICROMETAL CORP·Filed 2020·Granted Jun 10, 2025·0 cites·8 claims
- 2053US2025379177A1Al ALLOY BONDING WIRENIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2023·Application pending·0 cites
- 2152US2024290744A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2251US2024290743A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2351US2020312808A1Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2017·Application pending·0 cites
- 2450US10950571B2Bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2018·Granted Mar 16, 2021·0 cites·4 claims
- 2548US2024105668A1Ai wiring materialNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2645US10032741B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Jul 24, 2018·0 cites·8 claims
- 2745US2024071978A1Al BONDING WIRE FOR SEMICONDUCTOR DEVICESNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2845US2024110262A1Ai wiring materialNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →