Inventor · disambiguated record
Mukund Srinivasan
Also filed as: SRINIVASAN MUKUND
50 granted patents·9 pending applications·1,322 citations·filing 2000–2024
98Inventor score
Top patents by PatentIndex Score
59 records- 0199US6391787B1Stepped upper electrode for plasma processing uniformityLAM RES CORP·Filed 2000·Granted May 21, 2002·153 cites·29 claims
- 0298US9412581B2Low-K dielectric gapfill by flowable depositionAPPLIED MATERIALS INC·Filed 2014·Granted Aug 9, 2016·396 cites·7 claims
- 0398US6824627B2Stepped upper electrode for plasma processing uniformityLAM RES CORP·Filed 2002·Granted Nov 30, 2004·104 cites·15 claims
- 0497US10056279B2Semiconductor process equipmentAPPLIED MATERIALS INC·Filed 2016·Granted Aug 21, 2018·22 cites·8 claims
- 0597US9412613B2Development of high etch selective hardmask material by ion implantation into amorphous carbon filmsAPPLIED MATERIALS INC·Filed 2014·Granted Aug 9, 2016·54 cites·10 claims
- 0696US10734265B2Semiconductor process equipmentAPPLIED MATERIALS INC·Filed 2018·Granted Aug 4, 2020·13 cites·18 claims
- 0795US12334354B2Sidewall passivation for plasma etchingAPPLIED MATERIALS INC·Filed 2022·Granted Jun 17, 2025·2 cites·19 claims
- 0895US7749353B2High aspect ratio etch using modulation of RF powers of various frequenciesLAM RES CORP·Filed 2006·Granted Jul 6, 2010·30 cites·16 claims
- 0994US10998329B2Methods and apparatus for three dimensional NAND structure fabricationAPPLIED MATERIALS INC·Filed 2019·Granted May 4, 2021·11 cites·9 claims
- 1094US10403535B2Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition systemAPPLIED MATERIALS INC·Filed 2015·Granted Sep 3, 2019·11 cites·17 claims
- 1194US10236197B2Processing system containing an isolation region separating a deposition chamber from a treatment chamberAPPLIED MATERIALS INC·Filed 2015·Granted Mar 19, 2019·11 cites·20 claims
- 1294US6984288B2Plasma processor in plasma confinement region within a vacuum chamberLAM RES CORP·Filed 2001·Granted Jan 10, 2006·52 cites·28 claims
- 1393US8622021B2High lifetime consumable silicon nitride-silicon dioxide plasma processing componentsTAYLOR TRAVIS R·Filed 2008·Granted Jan 7, 2014·172 cites·8 claims
- 1493US6872281B1Chamber configuration for confining a plasmaLAM RES CORP·Filed 2000·Granted Mar 29, 2005·66 cites·27 claims
- 1590US7094315B2Chamber configuration for confining a plasmaLAM RES CORP·Filed 2004·Granted Aug 22, 2006·46 cites·27 claims
- 1689US6714033B1Probe for direct wafer potential measurementsLAM RES CORP·Filed 2001·Granted Mar 30, 2004·45 cites·15 claims
- 1785US10460936B2Photo-assisted deposition of flowable filmsAPPLIED MATERIALS INC·Filed 2017·Granted Oct 29, 2019·3 cites·19 claims
- 1884US9406509B2Deposition of heteroatom-doped carbon filmsAPPLIED MATERIALS INC·Filed 2014·Granted Aug 2, 2016·5 cites·13 claims
- 1984US7405521B2Multiple frequency plasma processor method and apparatusLAM RES CORP·Filed 2003·Granted Jul 29, 2008·35 cites·45 claims
- 2083US7144521B2High aspect ratio etch using modulation of RF powers of various frequenciesLAM RES CORP·Filed 2003·Granted Dec 5, 2006·24 cites·15 claims
- 2181US11152248B2Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutionsAPPLIED MATERIALS INC·Filed 2020·Granted Oct 19, 2021·1 cites·20 claims
- 2280US7645707B2Etch profile controlLAM RES CORP·Filed 2005·Granted Jan 12, 2010·7 cites·7 claims
- 2379US2024162020A1Dynamic Phased Array Plasma Source For Complete Plasma Coverage Of A Moving SubstrateAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2478US9624577B2Deposition of metal doped amorphous carbon filmAPPLIED MATERIALS INC·Filed 2015·Granted Apr 18, 2017·2 cites·8 claims
- 2578US7547635B2Process for etching dielectric films with improved resist and/or etch profile characteristicsLAM RES CORP·Filed 2002·Granted Jun 16, 2009·21 cites·22 claims
- 2677US10041167B2Cyclic sequential processes for forming high quality thin filmsAPPLIED MATERIALS INC·Filed 2016·Granted Aug 7, 2018·1 cites·12 claims
- 2777US9111729B2Small plasma chamber systems and methodsGOTTSCHO RICHARD·Filed 2010·Granted Aug 18, 2015·4 cites·44 claims
- 2876US8097120B2Process tuning gas injection from the substrate edgeDHINDSA RAJINDER·Filed 2006·Granted Jan 17, 2012·5 cites·17 claims
- 2975US11948783B2Dynamic phased array plasma source for complete plasma coverage of a moving substrateAPPLIED MATERIALS INC·Filed 2017·Granted Apr 2, 2024·1 cites·16 claims
- 3074US12464716B2NAND cell structure with charge trap cutAPPLIED MATERIALS INC·Filed 2022·Granted Nov 4, 2025·0 cites·10 claims
- 3173US10707116B2Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutionsAPPLIED MATERIALS INC·Filed 2018·Granted Jul 7, 2020·1 cites·20 claims
- 3272US10565615B2System and method for personalized add-on purchaseTRANSF SR BRANDS LLC·Filed 2014·Granted Feb 18, 2020·1 cites·18 claims
- 3371US6942816B2Methods of reducing photoresist distortion while etching in a plasma processing systemLAM RES CORP·Filed 2003·Granted Sep 13, 2005·14 cites·8 claims
- 3469US11705335B2Conformal high concentration boron doping of semiconductorsAPPLIED MATERIALS INC·Filed 2022·Granted Jul 18, 2023·0 cites·20 claims
- 3569US11545504B2Methods and apparatus for three dimensional NAND structure fabricationAPPLIED MATERIALS INC·Filed 2021·Granted Jan 3, 2023·0 cites·13 claims
- 3669US11430801B2Methods and apparatus for three dimensional NAND structure fabricationAPPLIED MATERIALS INC·Filed 2021·Granted Aug 30, 2022·0 cites·13 claims
- 3767US9613908B2Ultra-thin dielectric diffusion barrier and etch stop layer for advanced interconnect applicationsAPPLIED MATERIALS INC·Filed 2015·Granted Apr 4, 2017·1 cites·20 claims
- 3866US9972487B2Dielectric-metal stack for 3D flash memory applicationAPPLIED MATERIALS INC·Filed 2015·Granted May 15, 2018·1 cites·20 claims
- 3962US11328928B2Conformal high concentration boron doping of semiconductorsAPPLIED MATERIALS INC·Filed 2019·Granted May 10, 2022·0 cites·16 claims
- 4062US8911590B2Integrated capacitive and inductive power sources for a plasma etching chamberDHINDSA RAJINDER·Filed 2006·Granted Dec 16, 2014·1 cites·17 claims
- 4159US10332727B2Methods for processing substrates using small plasma chambersLAM RES CORP·Filed 2018·Granted Jun 25, 2019·0 cites·14 claims
- 4259US8337713B2Methods for RF pulsing of a narrow gap capacitively coupled reactorLOEWENHARDT PETER·Filed 2011·Granted Dec 25, 2012·1 cites·6 claims
- 4358US9911578B2Small plasma chamber systems and methodsLAM RES CORP·Filed 2014·Granted Mar 6, 2018·0 cites·9 claims
- 4458US8576866B2Hierarchical rate limiting of control packetsGUPTA ANUBHAV·Filed 2012·Granted Nov 5, 2013·1 cites·9 claims
- 4557US2015167160A1Enabling radical-based deposition of dielectric filmsAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 4656US10475644B2Dielectric-metal stack for 3D flash memory applicationAPPLIED MATERIALS INC·Filed 2018·Granted Nov 12, 2019·0 cites·20 claims
- 4756US7976673B2RF pulsing of a narrow gap capacitively coupled reactorLAM RES CORP·Filed 2003·Granted Jul 12, 2011·4 cites·17 claims
- 4855US2020258119A1System and method for personalized add-on purchaseTRANSF SR BRANDS LLC·Filed 2020·Application pending·0 cites
- 4955US2015187563A1Photo-assisted deposition of flowable filmsAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 5054US11189635B23D-NAND moldAPPLIED MATERIALS INC·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →